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STA264

STMicroelectronics

STA264 by STMicroelectronics

STA264 by STMicroelectronics is a telecom interface IC with 249 terminals in a grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features fine pitch ball terminals and is surface mountable, making it ideal for various telecommunications applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,880 parts In-Stock

1+ parts

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4,880

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Digiode

USA . 4,377 parts In-Stock

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4,377

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Anansix

USA . 2,397 parts In-Stock

1+ parts

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2,397

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$5.612

100+ parts

-

1k+ parts

$5.051

10k+ parts

-

1,848

$5.612

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$5.051

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MKK Technologies

India . 337 parts In-Stock

1+ parts

$10.553

100+ parts

-

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337

$10.553

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DigiPath Technology Company

USA . 337 parts In-Stock

1+ parts

$10.553

100+ parts

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337

$10.553

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Corphita

USA . 1,834 parts In-Stock

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1,834

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Parana Technologies

USA . 910 parts In-Stock

1+ parts

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100+ parts

$6.710

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910

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$6.710

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Overview

Discover the cutting-edge technology of the STA264 by STMicroelectronics, a high-quality telecom interface IC that promises unparalleled performance and reliability. Designed with precision in mind, this product boasts a durable plastic/epoxy package body, making it suitable for industrial-grade applications. With 249 terminals and a fine pitch grid array design, the STA264 ensures seamless connectivity and optimal functionality. Elevate your projects with the STA264 and experience the value and benefits that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, durable, and cost-effective, making this product suitable for various telecommunications applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, making it ideal for applications where space is limited.

No. of Terminals: 249

The high number of terminals allows for complex functionality and connectivity, making this product versatile for different telecom interface requirements.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array design with fine pitch terminals enables high-density integration and reliable connections, important for telecom interface ICs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40 °C makes it suitable for use in extreme cold conditions without compromising performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easy soldering and maintenance, simplifying the assembly process for manufacturers.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets rigorous temperature and performance standards, ensuring reliable operation in demanding environments.

Terminal Form: BALL

The ball terminal form facilitates a strong and reliable connection, important for stable data transmission in telecom interfaces.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, this product allows for high-density packing of terminals on the IC, enabling efficient signal transmission in tight spaces.

Technical Specifications

Other Function Telecom Interface ICs STA264 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B249

No. of Terminals:

249

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA249,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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