Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA264TR by STMicroelectronics is a telecom interface IC with 249 terminals in a grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It features fine pitch ball terminals and is surface mountable, making it ideal for telecommunications applications.
Median Price
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Suppliers In-Stock
3
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1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Anansix
Digiode
IDEA Electronic Components Group
$13.901
$12.511
MKK Technologies
$26.140
DigiPath Technology Company
Parana Technologies
$16.621
Corphita
PLASTIC/EPOXY material provides good durability and protection for the IC, ensuring a longer lifespan.
Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.
Square package shape can help optimize space on the circuit board, allowing for more compact and efficient designs.
Having a high number of terminals provides flexibility for connecting to various components and interfaces within a telecommunications system.
Grid array with fine pitch design helps in increasing connectivity density, enabling the IC to handle multiple functions efficiently.
With a high maximum operating temperature, this IC can withstand demanding conditions and maintain stable performance.
The low minimum operating temperature ensures the IC can operate in a wide range of environments, making it versatile and reliable.
Bottom terminal position offers ease of soldering and connection to the circuit board, enhancing assembly efficiency.
Industrial temperature grade ensures the IC can function reliably in harsh industrial settings with varying temperature conditions.
Ball terminal form provides good mechanical strength and reliability for interconnecting the IC with other components.
Fine terminal pitch allows for precise and compact connections, enabling high-speed data transmission and overall system efficiency.
Other Function Telecom Interface ICs STA264TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
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STA264TR Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
BAV99
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Vishay Intertechnology
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
Diotec Semiconductor Ag
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
RN4870-V/RM118
Microchip Technology
RN4870-V/RM118 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and data rate of 0.01 Mbps. It is used in applications requiring a nominal voltage of 3.3V, such as IoT devices and wireless communication systems.
SX1509BIULTRT
Semtech
Semtech's SX1509BIULTRT is a telecom IC with 1 function, operating at -40 to 85°C. It has 28 terminals in a square chip carrier package, ideal for industrial applications requiring a 3.3V supply voltage and very thin profile design.
WFM200S022XNA3
Silicon Labs
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
NRF51822-CFAC-R7
Nordic Semiconductor Asa
NRF51822-CFAC-R7 by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square grid array package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile components in the commercial extended temperature range.
2615011136000
Wuerth Elektronik & Kg
TELECOM CIRCUIT;
PN5321A3HN/C106;55
NXP Semiconductors
NXP Semiconductors' PN5321A3HN/C106;55 is a telecom IC with 40 terminals, operating b/w -30 to 85°C. It has a nominal voltage of 3.4V and terminal pitch of 0.5mm. This chip carrier package is suitable for various telecom circuit applications due to its compact size and surface mount capability.
CC2520RHDR
CC2520RHDR by Texas Instruments is a Telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a data rate of 0.25 Mbps and terminal pitch of 0.5 mm, it's ideal for telecom circuits requiring a 3V supply voltage.
BGM220SC22HNA2
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
BGM220SC12WGA2
MFRC63102HN,151
The NXP Semiconductors MFRC63102HN,151 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85 °C, with data rate of 0.4 Mbps. Ideal for telecom circuits requiring a nominal voltage of 5V and surface mount compatibility.
SA612AD/01,118
SA612AD/01,118 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This small outline IC is suitable for telecom circuit applications due to its dual terminal position and gull wing form factor.
BGSF110GN26E6327XTSA1
Infineon Technologies
BGSF110GN26E6327XTSA1 by Infineon is a Telecom IC with 26 terminals in a rectangular chip carrier package. Operating temperature range from -30 to 85°C, suitable for telecom circuits. Utilizes CMOS technology with a nominal voltage of 3V, ideal for surface mount applications.
RN41-I/RM615
Microchip Technology's RN41-I/RM615 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and matte tin finish, suitable for industrial applications. This surface-mount IC in rectangular package measures 13.2mm x 25.8mm with a seated height of 2.2mm, ideal for telecom interface functions.
TM266DVA1
Pulser
TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
TM1062DSB2
Inrcore
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.5;
XB3-24ARM
Digi International
The Digi International XB3-24ARM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40°C to 85°C, making it suitable for various telecom applications. The RECTANGULAR package style and SPECIAL SHAPE design enhance its performance in Other Function Telecom Interface ICs.
RN4871U-V/RM118
RN4871U-V/RM118 by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -20 to 70 °C and has a max data rate of 0.01 Mbps. This IC is commonly used in telecom circuits for various applications.
CC2564BYFVR
The Texas Instruments CC2564BYFVR is a telecom IC with 54 terminals in a grid array package. It operates at -40 to 85°C, with a supply voltage of 3.6V and data rate of 4 Mbps. Ideal for telecom circuits, it features very thin profile and fine pitch terminal style for compact designs.
ADRV9008BBCZ-1REEL
Analog Devices
Analog Devices ADRV9008BBCZ-1REEL is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuit applications requiring fine pitch and bottom terminal position.
BQ51003YFPR
BQ51003YFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a battery supply of 5V. With a very thin profile and fine pitch, it's ideal for industrial telecom circuits requiring precise power management.
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STA210N
STMicroelectronics
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: QCCN; Package Shape: SQUARE;
STA240
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 288; Package Code: BGA; Package Shape: SQUARE;
STA2416
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 120; Package Code: LFBGA; Package Shape: SQUARE;
STA2500D
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE;
STA2500DC
STA2500DCTR
STA2500DTR
STA260
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: FBGA; Package Shape: SQUARE;
STA260-8X8
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 244; Package Code: FBGA; Package Shape: SQUARE;
STA260TR
STA264
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 249; Package Code: FBGA; Package Shape: SQUARE;
Supply Digital Components
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