Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA240 by STMicroelectronics is a telecom IC with 288 terminals in a grid array package. Operating at -40 to 85 °C, it supports power supplies of 1.2V and 3.3V for industrial applications. The CMOS technology and ball terminal form make it suitable for various telecom interface functions.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Anansix
Vyrian
IDEA Electronic Components Group
$5.997
$5.397
MKK Technologies
$11.276
DigiPath Technology Company
Parana Technologies
$7.170
Corphita
PLASTIC/EPOXY material provides durability and protection for the IC, ensuring a longer lifespan.
Surface mount option allows for easy and efficient assembly onto printed circuit boards.
Square package shape helps in efficient space utilization on the PCB.
Supports multiple power supply options for flexibility in different applications.
High number of terminals enable connection to a wide range of external components.
Grid array package style provides efficient heat dissipation and electrical performance.
High maximum operating temperature ensures reliable performance in various environmental conditions.
Low minimum operating temperature allows for operation in extreme cold conditions.
Bottom terminal position facilitates easy soldering and connections during assembly.
Industrial temperature grade ensures robust operation in harsh industrial environments.
CMOS technology offers low power consumption and high noise immunity for efficient performance.
Ball terminal form provides reliable electrical connections for improved signal transmission.
Small terminal pitch enables high-density mounting and space-saving on the PCB.
Other Function Telecom Interface ICs STA240 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
JESD-30 Code:
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STA240 Telecommunications trade compliance attributes, and parameters.
NSN
5985-21-906-8320, 5985219068320
NIIN
219068320
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
Infineon Technologies
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
ERJ2RKF1002X
Panasonic
Panasonic's ERJ2RKF1002X is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance and operating temperature range of -55 to 155 °C.
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
MBR0540T1G
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
SX1262IMLTRT
RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
LBCA2HNZYZ-711
Murata Manufacturing
Murata Manufacturing's LBCA2HNZYZ-711 is a telecom IC with 37 terminals, operating b/w -40°C to 85°C. It has a compact rectangular package measuring 7mm x 7.4mm and a low seated height of 1mm. Ideal for industrial applications requiring a nominal voltage of 2.5V and MSL level of 3.
BLUENRG-M2SP
STMicroelectronics
BLUENRG-M2SP by STMicroelectronics is a 20-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It comes in a rectangular package style, suitable for industrial applications requiring reliable telecom circuit interfaces. With surface mount capability and compact dimensions of 13.5mm x 11.5mm x 2.5mm, it offers peak reflow temperature of 240°C for efficient assembly processes.
NRF52833-QIAA-R
Nordic Semiconductor Asa
NRF52833-QIAA-R by Nordic Semiconductor Asa is a telecom IC with 2 Mbps data rate. It operates in industrial temperature range (-40 to 105 °C) and has 73 terminals in a square chip carrier package. Ideal for telecom circuit applications, it is surface mountable and features quad terminal position.
RN4678-V/RM100
RN4678-V/RM100 by Microchip Tech is a surface mount telecom IC with 33 terminals. Operating temp range -20 to 70°C, voltage supply of 3.3V. Ideal for telecom circuits due to its compact size and commercial temperature grade suitability.
AS3933-BTST
Ams Ag
AS3933-BTST by Ams Ag is a telecom IC with 16 terminals, operating from -40 to 85°C. It features a small outline package, Gull Wing terminals, and 3V supply voltage. Ideal for telecom circuits, this IC has a rectangular shape and is surface mountable for industrial applications.
WT32I-A-AI61
Silicon Labs
Other Telecom ICs;
AP22811AW5-7
Diodes Incorporated
AP22811AW5-7 by Diodes Inc. is a telecom interface IC with 5 terminals, operating b/w -40 to 85°C. It features a small outline package style, matte tin finish, and nominal voltage of 5V. Ideal for telecom circuits, this IC has a low profile design and can withstand peak reflow temperatures up to 260°C.
NRF51822-CFAC-R
NRF51822-CFAC-R by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile grid array packages.
BGT24MTR11E6327XUMA1
Infineon's BGT24MTR11E6327XUMA1 is a telecom IC with 32 terminals, operating at -40 to 105°C. It features a 3.3V supply voltage, quad terminal position, and no-lead form factor. This industrial-grade chip carrier is surface-mountable and suitable for telecom circuit applications due to its bipolar technology.
WT12-A-AI4C
WT12-A-AI4C by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps and operates at a nominal voltage of 3.3 V. This MICROELECTRONIC ASSEMBLY is ideal for telecom circuit applications due to its compact size and high-speed data capabilities.
CC2500RGP
Texas Instruments
CC2500RGP by Texas Instruments is a telecom IC with 20 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8/3.6V and data rate of 0.25 Mbps. Ideal for industrial applications requiring low power consumption and compact design.
TGA2975-SM
Qorvo
Qorvo's TGA2975-SM is a 24-terminal telecom IC with a nominal voltage of 28V. It features a chip carrier package style, 0.65mm terminal pitch, and 0.9mm max seated height. Ideal for telecom circuit applications due to its compact size and surface-mount capability.
WT12-A-AI3
Silicon Labs' WT12-A-AI3 is a telecom IC with 31 terminals, CMOS technology, and 3 Mbps data rate. It operates in industrial temperature range (-40 to 85°C) and requires a nominal voltage of 3.3V. This surface-mount rectangular package (14x25 mm) is ideal for telecom interface applications.
ESP32-WROOM-32U
Espressif Systems (Shanghai)
ESP32-WROOM-32U by Espressif Systems (Shanghai) is a surface-mount telecom IC with 38 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3.3V. This rectangular microelectronic assembly, with no lead terminal form, is ideal for telecom circuit applications due to its compact size (18mm x 19.2mm) and high peak reflow temperature (260°C).
ADRV9026BBCZ
Analog Devices
Analog Devices ADRV9026BBCZ is a telecom IC with 4 functions, operating at -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and terminal pitch of 0.8mm.
ZED-F9R-01B
U-blox Ag
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
MGM12P32F1024GA-V4
Silicon Labs' MGM12P32F1024GA-V4 is a TELECOM CIRCUIT IC with 3.3V supply voltage, 1 Mbps data rate, and operating temperatures from -40 to 85 °C. Its RECTANGULAR package shape makes it ideal for telecom interface applications.
ODIN-W260
ODIN-W260 by U-blox Ag is a TELECOM CIRCUIT with 3.3V supply, operating from -40°C to 85°C. RECTANGULAR MICROELECTRONIC ASSEMBLY package for telecom interfaces, ideal for various applications requiring reliable connectivity in extreme temperature conditions.
LEA-M8F-0-00
LEA-M8F-0-00 by U-blox Ag is a telecom IC with 28 terminals, operating at -40 to 85°C. Its package style is MICROELECTRONIC ASSEMBLY, suitable for INDUSTRIAL applications. With a supply voltage of 3.3V and AEC-Q100 screening, it's ideal for robust telecom interfaces.
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STA210N
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: QCCN; Package Shape: SQUARE;
STA2416
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 120; Package Code: LFBGA; Package Shape: SQUARE;
STA2500D
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE;
STA2500DC
STA2500DCTR
STA2500DTR
STA260
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: FBGA; Package Shape: SQUARE;
STA260-8X8
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 244; Package Code: FBGA; Package Shape: SQUARE;
STA260TR
STA264
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 249; Package Code: FBGA; Package Shape: SQUARE;
STA264TR
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