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STA210N

STMicroelectronics

STA210N by STMicroelectronics

STA210N by STMicroelectronics is a BICMOS technology IC with 68 terminals, operating at -40 to 85 °C. It has a supply voltage of 3.3V and comes in a square chip carrier package for telecom interfaces. This surface-mountable IC is ideal for industrial applications requiring high-temperature operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,739 parts In-Stock

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2,739

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Vyrian

USA . 2,146 parts In-Stock

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2,146

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Digiode

USA . 348 parts In-Stock

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348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,954 parts In-Stock

1+ parts

$12.954

100+ parts

-

1k+ parts

$11.658

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1,954

$12.954

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$11.658

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MKK Technologies

India . 352 parts In-Stock

1+ parts

$24.358

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352

$24.358

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DigiPath Technology Company

USA . 352 parts In-Stock

1+ parts

$24.358

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352

$24.358

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Corphita

USA . 3,425 parts In-Stock

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3,425

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Parana Technologies

USA . 10 parts In-Stock

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$15.488

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10

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$15.488

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Overview

Unlock a world of seamless connectivity with the STA210N by STMicroelectronics. Crafted by industry-leading experts, this telecom interface IC offers unparalleled quality and reliability. From its innovative design to its durable construction, this product is built to exceed expectations. Whether you're in need of flawless communication solutions or advanced networking capabilities, the STA210N delivers unmatched performance and value. Elevate your projects with this cutting-edge technology and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape provides a compact design, maximizing PCB space and enabling efficient layout of components.

Power Supplies (V): 3.3

Operating at a power supply voltage of 3.3V makes this product energy-efficient and suitable for low-power applications.

No. of Terminals: 68

Having 68 terminals allows for versatile connectivity options, making it compatible with various communication interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and improved reliability, ensuring stable operation in demanding industrial environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand harsh operating conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40 °C ensures reliable functionality even in extreme cold environments.

Terminal Position: QUAD

The quad terminal position allows for easy and secure soldering, ensuring a stable connection for uninterrupted signal transmission.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is built to withstand rugged conditions and maintain consistent performance in demanding environments.

Technology: BICMOS

Utilizing BiCMOS technology offers the advantages of both bipolar and CMOS technologies, providing high-speed operation and low power consumption for efficient performance.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of solder joints cracking or breaking, ensuring long-term reliability and robustness for the product.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for dense packing of terminals on the PCB, enabling high-performance connectivity in a compact form factor.

Technical Specifications

Other Function Telecom Interface ICs STA210N attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-N68

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC68,.4SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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