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STA260

STMicroelectronics

STA260 by STMicroelectronics

STA260 by STMicroelectronics is a telecom interface IC with 289 terminals in a grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Power supplies of 1.2V and 2.5V make it ideal for various applications requiring precise communication interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,872 parts In-Stock

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4,872

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Digiode

USA . 3,357 parts In-Stock

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3,357

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Anansix

USA . 288 parts In-Stock

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288

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 51 parts In-Stock

1+ parts

$6.558

100+ parts

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1k+ parts

$5.902

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51

$6.558

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$5.902

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MKK Technologies

India . 1,342 parts In-Stock

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$12.331

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1,342

$12.331

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DigiPath Technology Company

USA . 1,342 parts In-Stock

1+ parts

$12.331

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1,342

$12.331

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Parana Technologies

USA . 1,829 parts In-Stock

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$7.841

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1,829

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$7.841

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Corphita

USA . 1,139 parts In-Stock

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1,139

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Overview

Experience the unparalleled quality and reliability of the STA260 by STMicroelectronics, a leading manufacturer in the industry. This innovative telecom interface IC offers a wide range of applications, providing seamless connectivity for your projects. With a durable plastic/epoxy body and a compact square package shape, this IC is designed to exceed expectations. Benefit from its low power consumption, high performance, and versatile terminal positions. Trust STA260 to deliver exceptional value and efficiency for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to physical damage, making this product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, reducing assembly time and simplifying manufacturing processes.

Package Shape: SQUARE

Square package shape provides uniformity in design and allows for efficient use of board space, making it easy to integrate this component into different systems.

Power Supplies (V): 1.2,2.5

Multiple power supply options of 1.2V and 2.5V provide flexibility in voltage requirements, allowing for compatibility with a wide range of systems and applications.

No. of Terminals: 289

Having a high number of terminals allows for multiple connections and functions, enabling complex communication and interface capabilities within the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance in varying environmental conditions, making it suitable for industrial use where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C ensures that the product can function in cold environments without any issues, providing versatility in usage scenarios.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure connections during installation, enhancing the overall reliability and stability of the product.

Temperature Grade: INDUSTRIAL

Industrial grade temperature rating ensures that the product can withstand harsh environmental conditions and operate reliably in demanding industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term operation.

Terminal Form: BALL

Ball terminal form provides good contact reliability and easy soldering connections, ensuring secure and stable signal transmission within the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting and space-saving design, enabling compact integration of the product in tight spaces on PCBs.

Technical Specifications

Other Function Telecom Interface ICs STA260 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B289

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,2.5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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