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STA2500DTR

STMicroelectronics

STA2500DTR by STMicroelectronics

STA2500DTR by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 48-terminal grid array with a nominal voltage of 2.75V and peak reflow temp of 260 °C. Ideal for reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,020 parts In-Stock

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7,020

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Anansix

USA . 1,644 parts In-Stock

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1,644

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Sternenhof Electronics

Switzerland . 319 parts In-Stock

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319

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Digiode

USA . 284 parts In-Stock

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284

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IDEA Electronic Components Group

UK . 1,532 parts In-Stock

1+ parts

$9.618

100+ parts

-

1k+ parts

$8.656

10k+ parts

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1,532

$9.618

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$8.656

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AZTECH Wire

Italy . 846 parts In-Stock

1+ parts

$11.730

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846

$11.730

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MKK Technologies

India . 1,796 parts In-Stock

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$18.085

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1,796

$18.085

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DigiPath Technology Company

USA . 1,796 parts In-Stock

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$18.085

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1,796

$18.085

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Component Stockers USA

USA . 433 parts In-Stock

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$99.990

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433

$99.990

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A-Z Elektronik GmbH

Germany . 6,872 parts In-Stock

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6,872

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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RC Electronics

USA . 5,785 parts In-Stock

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Corphita

USA . 3,077 parts In-Stock

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3,077

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Parana Technologies

USA . 2,331 parts In-Stock

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$11.499

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$11.499

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Kepictronics

USA . 70 parts In-Stock

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70

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Perfect Parts

USA . 17 parts In-Stock

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Overview

Unlock the potential of your telecom applications with the STA2500DTR from STMicroelectronics, a leader in innovation and quality. Designed for reliable performance in demanding environments, this robust interface IC offers exceptional durability and efficiency. With its compact surface mount design, it integrates seamlessly into your projects, delivering unmatched stability and precision. Trust in STMicroelectronics’ expertise to elevate your solutions, ensuring you stay ahead in the competitive telecom landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs, enabling efficient use of PCB space.

Package Shape: SQUARE

The square shape facilitates efficient layout and routing on the PCB, optimizing the design process.

Power Supplies (V): 2.75

Operates at a nominal supply voltage of 2.75 V, making it ideal for low-power applications, enhancing energy efficiency.

No. of Terminals: 48

With 48 terminals, this IC offers extensive connectivity options, allowing for greater functionality in telecom applications.

Package Style (Meter): GRID ARRAY

The grid array package style ensures good thermal performance and electrical efficiency, which are crucial for telecom ICs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C makes this IC suitable for industrial applications in challenging environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this component is able to function reliably in extreme conditions.

Terminal Finish: TIN SILVER COPPER

The Tin-Silver-Copper (SAC) finish enhances solderability and reliability, ensuring long-term performance.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies board layout, allowing for easier integration into existing designs.

Maximum Seated Height: 1.25 mm

A low maximum seated height facilitates compact design, allowing for reduced form factor in devices.

Width: 6 mm

A compact width of 6 mm makes it versatile for various applications, fitting into constrained spaces.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds helps protect sensitive components during soldering processes.

Peak Reflow Temperature °C: 260

Ability to withstand peak reflow temperatures of 260 °C enables compatibility with high-temperature soldering processes.

Length: 6 mm

With a length of 6 mm, the IC contributes to compact board designs, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, ensuring reliability and performance in varying thermal environments.

Terminal Form: BALL

Ball terminals improve solder joint reliability and reduce stress on the IC during thermal cycling.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring specialized performance and functionality.

Nominal Supply Voltage: 2.75 V

Low nominal supply voltage enhances energy efficiency and reduces overall power consumption.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for fine-pitch designs, accommodating more compact layouts and improved signal integrity.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates a moderate level of moisture sensitivity, suitable for standard manufacturing processes with appropriate handling.

Technical Specifications

Other Function Telecom Interface ICs STA2500DTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B48

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,7X7,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.75

Qualification:

Not Qualified

Maximum Seated Height:

1.25 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

STA2500DTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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