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STA2416

STMicroelectronics

STA2416 by STMicroelectronics

STA2416 by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates at nominal voltages of 1.8V and 3.3V, with a wide temp range from -40 °C to 85°C. This low-profile, fine-pitch grid array features 120 terminals for efficient connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,771 parts In-Stock

1+ parts

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3,771

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Anansix

USA . 1,499 parts In-Stock

1+ parts

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1,499

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Digiode

USA . 930 parts In-Stock

1+ parts

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930

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 200 parts In-Stock

1+ parts

$8.043

100+ parts

-

1k+ parts

$7.238

10k+ parts

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200

$8.043

-

$7.238

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MKK Technologies

India . 947 parts In-Stock

1+ parts

$15.124

100+ parts

-

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947

$15.124

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DigiPath Technology Company

USA . 947 parts In-Stock

1+ parts

$15.124

100+ parts

-

1k+ parts

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947

$15.124

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-

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A-Z Elektronik GmbH

Germany . 6,077 parts In-Stock

1+ parts

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6,077

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Kepictronics

USA . 2,200 parts In-Stock

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2,200

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Corphita

USA . 1,486 parts In-Stock

1+ parts

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1,486

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Parana Technologies

USA . 1,027 parts In-Stock

1+ parts

-

100+ parts

$9.616

1k+ parts

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1,027

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$9.616

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Overview

Elevate your telecom solutions with the STA2416 from STMicroelectronics—where quality meets innovation. Designed for demanding applications, this compact interface IC ensures reliable performance across a wide temperature range. With STMicroelectronics' renowned expertise, you gain access to cutting-edge technology that enhances efficiency and scalability, making it perfect for industrial-grade projects. Unlock the potential for seamless communication and superior connectivity today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient space utilization on the PCB, ideal for modern electronic devices.

Package Shape: SQUARE

The square package shape optimizes space on the board and provides excellent thermal performance.

Power Supplies (V): 1.8, 3.3

Dual supply voltage options (1.8V and 3.3V) allow for versatile integration in various electronic circuits.

No. of Terminals: 120

A high terminal count ensures greater connectivity and flexibility for complex circuits, making it suitable for advanced telecom applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array and low profile design facilitate efficient heat dissipation and better performance in tightly packed environments.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the IC to function reliably in harsh environments without performance degradation.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C is crucial for applications in extreme conditions, ensuring reliability across a wide temperature range.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB design and promotes effective heat management.

Maximum Seated Height: 1.4 mm

A low seated height enhances compatibility with low-profile designs and enclosures, making it versatile for various applications.

Width: 10 mm

A compact width of 10 mm aids in space-saving designs and fits well into smaller circuit boards.

Length: 10 mm

The square length measures contribute to a balanced form factor that simplifies layout planning on PCBs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees the IC's reliability and performance in demanding operational environments.

Terminal Form: BALL

Ball terminal form enhances reliability through robust connections, allowing for better soldering and mechanical stability.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC is optimized for performance in communication systems.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V makes it energy-efficient, which is critical for battery-operated devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for a more compact design while ensuring adequate space for reliable interconnections.

Technical Specifications

Other Function Telecom Interface ICs STA2416 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B120

Length:

10 mm

No. of Functions:

1

No. of Terminals:

120

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA120,18X18,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

STA2416 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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