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STA8090FGTR

STMicroelectronics

STA8090FGTR by STMicroelectronics

STA8090FGTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max operating temp of 85 °C and operates at a nominal voltage of 1.2V. Its thin profile and fine pitch make it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,352 parts In-Stock

1+ parts

-

100+ parts

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4,352

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Anansix

USA . 1,782 parts In-Stock

1+ parts

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1k+ parts

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1,782

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Digiode

USA . 1,473 parts In-Stock

1+ parts

-

100+ parts

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1,473

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 569 parts In-Stock

1+ parts

$11.370

100+ parts

-

1k+ parts

$10.233

10k+ parts

-

569

$11.370

-

$10.233

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AZTECH Wire

Italy . 1,062 parts In-Stock

1+ parts

$19.680

100+ parts

-

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10k+ parts

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1,062

$19.680

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MKK Technologies

India . 1,093 parts In-Stock

1+ parts

$21.381

100+ parts

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1,093

$21.381

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DigiPath Technology Company

USA . 1,093 parts In-Stock

1+ parts

$21.381

100+ parts

-

1k+ parts

-

10k+ parts

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1,093

$21.381

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Component Stockers USA

USA . 1,099 parts In-Stock

1+ parts

$110.840

100+ parts

-

1k+ parts

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10k+ parts

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1,099

$110.840

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Authorized Procurement Solutions

USA . 50,000 parts In-Stock

1+ parts

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100+ parts

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50,000

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Corphita

USA . 2,406 parts In-Stock

1+ parts

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2,406

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Parana Technologies

USA . 1,236 parts In-Stock

1+ parts

-

100+ parts

$13.595

1k+ parts

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1,236

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$13.595

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Overview

Unlock unparalleled performance with the STA8090FGTR from STMicroelectronics, a leader in innovation and quality. This state-of-the-art telecom interface IC is designed for reliability in demanding industrial environments, ensuring robust communication across various applications. With its compact design and exceptional thermal range, it offers customers significant advantages like enhanced efficiency and durability. Trust in STMicroelectronics to elevate your projects with cutting-edge solutions that truly make a difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the body material ensures durability and resistance to environmental stress, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient manufacturing processes, enabling higher density and reduced space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape of the package is advantageous for layout optimization and helps in maintaining a compact design.

No. of Terminals: 99

With 99 terminals, this IC can support complex functions and extensive interconnections, ideal for multifaceted telecom applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array configuration and thin profile allow for high-speed performance and efficient thermal management.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C allows this IC to function in extreme cold conditions, making it versatile for various settings.

Terminal Position: BOTTOM

Bottom terminal positioning enhances space efficiency and allows for better integration into circuit designs.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm contributes to a compact design, facilitating dense packaging on PCBs.

Width: 5 mm

With a width of 5 mm, this component is suitable for space-constrained applications, making it ideal for modern electronic devices.

Length: 6 mm

The 6 mm length further aids in compact designs, allowing for efficient use of board real estate.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature, this IC is built to withstand harsh operational environments, ensuring longevity and performance.

Technology: CMOS

CMOS technology provides low power consumption and high performance, making it favorable for battery-operated devices.

Terminal Form: BALL

Ball terminal form facilitates effective soldering and enhances electrical connectivity, contributing to overall reliability.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically as a telecom circuit, this IC meets the stringent requirements of telecommunications with optimized performance.

Nominal Supply Voltage: 1.2 V

The low supply voltage of 1.2 V allows for reduced power consumption, supporting energy-efficient designs and battery life longevity.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables compact layouts while maintaining the integrity of electrical connections, suitable for high-density applications.

Technical Specifications

Other Function Telecom Interface ICs STA8090FGTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B99

Length:

6 mm

No. of Functions:

1

No. of Terminals:

99

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

STA8090FGTR Telecommunications trade compliance attributes, and parameters.

ECCN

7A994

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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