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FIDO5200CBCZ

Analog Devices

FIDO5200CBCZ by Analog Devices

FIDO5200CBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it is ideal for telecom circuit integration.

Median Price

$23.605

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 25 parts In-Stock

1+ parts

$2.295

100+ parts

$2.256

1k+ parts

-

10k+ parts

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25

$2.295

$2.256

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Verical

USA . 25 parts In-Stock

1+ parts

$12.615

100+ parts

-

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25

$12.615

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Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$14.400

100+ parts

-

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25

$14.400

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Analog Devices Inc

USA . 26,249 parts In-Stock

1+ parts

$32.810

100+ parts

$22.538

1k+ parts

$11.630

10k+ parts

-

26,249

$32.810

$22.538

$11.630

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Mouser Electronics

USA . 61 parts In-Stock

1+ parts

$35.920

100+ parts

$25.410

1k+ parts

$24.770

10k+ parts

-

61

$35.920

$25.410

$24.770

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DigiKey

USA . 32 parts In-Stock

1+ parts

$35.920

100+ parts

$27.136

1k+ parts

$24.775

10k+ parts

-

32

$35.920

$27.136

$24.775

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 359 parts In-Stock

1+ parts

$5.504

100+ parts

-

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359

$5.504

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Vyrian

USA . 8,125 parts In-Stock

1+ parts

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8,125

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 863 parts In-Stock

1+ parts

$0.990

100+ parts

-

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863

$0.990

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Northwest PG Solutions

USA . 1,471 parts In-Stock

1+ parts

$1.089

100+ parts

-

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1,471

$1.089

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Semicontronic

India . 8,319 parts In-Stock

1+ parts

$4.920

100+ parts

$4.797

1k+ parts

$4.772

10k+ parts

-

8,319

$4.920

$4.797

$4.772

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Corphita

USA . 853 parts In-Stock

1+ parts

$5.215

100+ parts

-

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853

$5.215

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Parana Technologies

USA . 328 parts In-Stock

1+ parts

$13.028

100+ parts

-

1k+ parts

$12.116

10k+ parts

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328

$13.028

-

$12.116

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IDEA Electronic Components Group

UK . 2,254 parts In-Stock

1+ parts

$14.009

100+ parts

$13.309

1k+ parts

$13.309

10k+ parts

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2,254

$14.009

$13.309

$13.309

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DigiPath Technology Company

USA . 640 parts In-Stock

1+ parts

$21.854

100+ parts

$20.980

1k+ parts

-

10k+ parts

$20.980

640

$21.854

$20.980

-

$20.980

Overview

Unlock unparalleled performance and reliability with the FIDO5200CBCZ by Analog Devices. As a trusted leader in the industry, Analog Devices delivers top-notch quality and cutting-edge technology in every product. The FIDO5200CBCZ falls under the category of Other Function Telecom Interface ICs, offering versatile applications and seamless integration. Experience the value of this product through its unmatched benefits and advantages, providing customers with a game-changing solution for their telecom needs. Elevate your projects with the FIDO5200CBCZ and experience the difference Analog Devices brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Being surface mountable allows for easier and more efficient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of integration into circuit designs.

No. of Terminals: 144

Having a high number of terminals allows for a greater level of connectivity and functionality in telecommunications applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers a compact design with high density interconnects, ideal for space-constrained applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliability in various environmental conditions, making the product suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in harsh cold environments without compromising performance.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy access and soldering during installation on PCBs.

Maximum Seated Height: 1.24 mm

The low seated height allows for a compact overall design, making it suitable for applications with height restrictions.

Width: 10 mm

The 10mm width provides a balance between space efficiency and ease of handling during installation.

Length: 10 mm

The 10mm length offers a square form factor, ensuring compatibility with standard PCB layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the product suitable for rugged applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form enables precise and reliable connections, ensuring stable performance in telecommunications circuits.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this product offers optimized performance and compatibility in telecommunications applications.

Nominal Supply Voltage: 1.2 V

The 1.2V nominal supply voltage is commonly used in telecommunications systems, ensuring compatibility and reliable operation.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for high density interconnects, enabling complex circuit designs in telecommunications applications.

Technical Specifications

Other Function Telecom Interface ICs FIDO5200CBCZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.24 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

FIDO5200CBCZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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