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FIDO2100BGA128IR0

Analog Devices

FIDO2100BGA128IR0 by Analog Devices

Analog Devices' FIDO2100BGA128IR0 is a telecom IC with 128 terminals, operating b/w -40 to 85°C. It features a low profile grid array package style, suitable for telecom circuit applications. With a nominal voltage of 1.8V and 0.8mm terminal pitch, it's ideal for industrial temperature grade environments.

Median Price

$23.090

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 35 parts In-Stock

1+ parts

$15.900

100+ parts

-

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35

$15.900

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DigiKey

USA . 2,564 parts In-Stock

1+ parts

$32.650

100+ parts

$24.443

1k+ parts

$22.323

10k+ parts

-

2,564

$32.650

$24.443

$22.323

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Arrow

USA . 222 parts In-Stock

1+ parts

-

100+ parts

$23.090

1k+ parts

$22.040

10k+ parts

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222

-

$23.090

$22.040

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Verical

USA . 217 parts In-Stock

1+ parts

-

100+ parts

$23.090

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$22.040

10k+ parts

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217

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$23.090

$22.040

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 183 parts In-Stock

1+ parts

$15.105

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183

$15.105

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Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$19.495

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85

$19.495

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Vyrian

USA . 14,949 parts In-Stock

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14,949

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,483 parts In-Stock

1+ parts

$9.974

100+ parts

-

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2,483

$9.974

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Parana Technologies

USA . 4,616 parts In-Stock

1+ parts

$11.562

100+ parts

-

1k+ parts

$10.752

10k+ parts

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4,616

$11.562

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$10.752

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Corohmni

South Africa . 226 parts In-Stock

1+ parts

$12.069

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226

$12.069

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IDEA Electronic Components Group

UK . 1,012 parts In-Stock

1+ parts

$12.432

100+ parts

$11.810

1k+ parts

$11.810

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-

1,012

$12.432

$11.810

$11.810

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Corphita

USA . 578 parts In-Stock

1+ parts

$14.310

100+ parts

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578

$14.310

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DigiPath Technology Company

USA . 26 parts In-Stock

1+ parts

$19.394

100+ parts

$18.618

1k+ parts

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10k+ parts

$18.618

26

$19.394

$18.618

-

$18.618

Continental Prestige Electronics

USA . 1,920 parts In-Stock

1+ parts

$19.495

100+ parts

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1k+ parts

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$19.105

1,920

$19.495

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$19.105

Vigor

Singapore . 221 parts In-Stock

1+ parts

$20.390

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221

$20.390

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Semicontronic

India . 15,266 parts In-Stock

1+ parts

$29.420

100+ parts

$28.684

1k+ parts

$28.537

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15,266

$29.420

$28.684

$28.537

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Argo Parts USA

USA . 3,447 parts In-Stock

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3,447

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,388 parts In-Stock

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1,388

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$19.105

1k+ parts

$18.520

10k+ parts

$18.130

500

-

$19.105

$18.520

$18.130

Overview

Experience unparalleled quality and reliability with the FIDO2100BGA128IR0 by Analog Devices. As a leader in telecom interface ICs, Analog Devices brings cutting-edge technology to your applications. This low-profile, fine pitch grid array package offers customers exceptional value with its industrial temperature grade and ball terminal form. Whether you're looking for top-notch performance or seamless integration, the FIDO2100BGA128IR0 delivers on all fronts. Upgrade your telecom circuits today with Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, which is ideal for telecom applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package provides a compact design, making it easier to fit in tight spaces within a telecom device.

No. of Terminals: 128

Having a high number of terminals allows for more connections and functionality within the telecom interface IC, making it versatile and capable of handling complex tasks.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enables high density integration of components, maximizing performance in a limited space.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions typically found in telecom equipment, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows this product to function in extreme cold environments, making it suitable for various telecom applications.

Terminal Position: BOTTOM

Having terminals positioned at the bottom provides easier access for soldering and maintenance, simplifying the assembly process and ensuring reliability.

Maximum Seated Height: 1.3 mm

The low seated height enables a slim and compact design, making this product suitable for applications where space is limited.

Width: 10 mm

The small width of the product allows for efficient use of board space, enabling compact designs in telecom devices.

Length: 10 mm

The compact length of the product further contributes to space-saving design in telecom applications, facilitating integration into smaller devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can operate reliably in demanding industrial environments, making it a dependable choice for telecom applications.

Terminal Form: BALL

The use of ball terminals simplifies the soldering and connection process, providing a reliable and secure connection for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers specialized features and performance to meet the requirements of telecom applications, ensuring optimal functionality.

Nominal Supply Voltage: 1.8 V

With a low nominal supply voltage, this product helps conserve power and prolongs the life of telecom devices, making it energy-efficient and cost-effective.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting of components, optimizing PCB space and enhancing overall performance in telecom devices.

Technical Specifications

Other Function Telecom Interface ICs FIDO2100BGA128IR0 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B128

Length:

10 mm

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.3 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

FIDO2100BGA128IR0 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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