Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STA8090FGBTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max temp of 85 °C and operates at a nominal voltage of 1.2V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.
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AZTECH Wire
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Advanced Electronics
$12.766
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$16.305
$14.675
MKK Technologies
$30.661
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$19.495
The plastic/epoxy material provides durability and protection, making it suitable for various operating environments.
Being surface mount technology (SMT) allows for compact designs and easier integration onto PCBs, improving manufacturing efficiency.
The rectangular shape promotes efficient space utilization on PCB layouts, making it ideal for space-constrained applications.
With 99 terminals, it supports a high level of connectivity and functionality, catering to complex telecom applications.
The grid array design with a thin profile and fine pitch ensures better electrical performance and thermal management.
The capability to operate at temperatures up to 85 °C makes it suitable for industrial applications where temperature fluctuations may occur.
A minimum operating temperature of -40 °C allows the IC to function in extreme environments, which is essential for certain industrial applications.
Bottom terminal positioning aids in efficient heat dissipation and enhances mechanical stability when mounted.
A maximum seated height of 1.2 mm allows for a low-profile design, which is beneficial in compact electronic devices.
With a width of 5 mm, it maintains a small footprint, ideal for integrating into tight spaces.
A length of 6 mm contributes to its compact size, facilitating its use in various applications without consuming excessive board space.
Classified as industrial-grade, the IC is designed for reliability under harsh conditions typical of industrial setups.
Using CMOS technology enhances power efficiency and performance, which is critical for telecom applications requiring minimal power consumption.
Ball terminals provide reliable electrical contact and support the thermal expansion of the component during operation.
Specifically designed for telecom applications, it ensures optimized performance and reliability in communication systems.
A low nominal supply voltage of 1.2 V supports energy-efficient designs, reducing overall power consumption in devices.
The 0.5 mm terminal pitch allows for higher pin density, supporting more complex functions within a smaller area.
Other Function Telecom Interface ICs STA8090FGBTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
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STA8090FGBTR Telecommunications trade compliance attributes, and parameters.
ECCN
7A994
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - Material Barrier Bag 17/Dec/2020
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
1N4148
Renesas Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
Formosa Microsemi
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Continental Device India
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Vishay Intertechnology
Vishay Intertechnology's LL4148 diode features a max reverse recovery time of 0.004 us, forward voltage of 1 V, and output current of 0.15 A. Ideal for rectification applications in electronics due to its high efficiency and low power dissipation capabilities.
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
SS14
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F407VGT6
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
EU2B-YS3303C
Idec
ROTARY SWITCH;
261
Deltrol Controls
Other Relays;
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NEO-M8U-0
U-blox Ag
NEO-M8U-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its AEC-Q100 screening level and TS 16949 certification make it ideal for industrial applications requiring a 3V supply voltage. With a compact rectangular package style, this IC is suitable for various telecom circuit functions.
WL1801MODGBMOCR
Texas Instruments
WL1801MODGBMOCR by Texas Instruments is a telecom IC with 100 terminals, operating at 3.7V. It offers a data rate of 100 Mbps and can withstand temperatures from -20 to 70°C. Ideal for telecom applications requiring high-speed data transmission in commercial-grade environments.
453-00005
Laird Technologies
453-00005 by Laird Technologies is a surface mount telecom IC with 39 terminals. Operating b/w -40 to 85°C, it has a compact rectangular package style measuring 14x10x2.33mm. Ideal for industrial applications requiring a 3V supply voltage and telecom circuit functionality.
DA14531MOD-00F0100C
Dialog Semiconductor
TELECOM CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
MFRC63102HN,151
NXP Semiconductors
The NXP Semiconductors MFRC63102HN,151 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85 °C, with data rate of 0.4 Mbps. Ideal for telecom circuits requiring a nominal voltage of 5V and surface mount compatibility.
SX1233IMLTRT
Semtech
Semtech's SX1233IMLTRT is a 24-terminal IC with 3.3V supply, operating from -40 to 85°C. It features AEC-Q100 screening and is ideal for telecom circuits due to its industrial temperature grade and square chip carrier package style.
TESEO-VIC3DA
TELECOM CIRCUIT;
WF111-A-V1
Silicon Labs
CYBLE-022001-00
Cypress Semiconductor
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3;
HMC641ALP4ETR
Analog Devices
HMC641ALP4ETR by Analog Devices is a telecom interface IC with 24 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal negative supply voltage of -3V and terminal pitch of 0.5mm, it is ideal for telecom circuit designs requiring compact and high-performance solutions.
MT9041AP
Mitel Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
PN7160B1HN/C100Y
PN7160B1HN/C100Y by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating b/w -25°C to 85°C, it has a data rate of 0.848 Mbps and nominal voltage of 1.8V. Ideal for telecom circuits, this IC is surface mountable and has a max seated height of 1mm.
MGM12P32F1024GE-V2
TESEO-LIV3FL
XB3-24Z8PT
Digi International
The Digi International XB3-24Z8PT is a telecom IC with 20 terminals in a MICROELECTRONIC ASSEMBLY package. It operates in temperatures ranging from -40°C to 85°C, making it suitable for industrial applications requiring reliable telecom circuit connections. The terminal form is THROUGH-HOLE, ideal for robust and secure installations.
LTC5596IDC#TRMPBF
Linear Technology
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
MAX24287ETK2
Microsemi
SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;
MAX7033EUI
Maxim Integrated
MAX7033EUI by Maxim Integrated is a telecom IC with 28 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V, consumes 0.00688mA current, and features GULL WING terminals for industrial applications in telecom circuits.
MIA-M10Q-00B
XB3-24AUT-J
XB3-24AUT-J by Digi International is a TELECOM CIRCUIT with 1 Mbps Data Rate. Operating Temperature ranges from -40 to 85 °C. It is used in telecom interfaces for various applications due to its RECTANGULAR package shape and SPECIAL SHAPE style.
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STA8089FGAD
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
STA8090GATR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
STA8090FGBDTR
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
STA8090FGB
STA8090FGB by STMicroelectronics is a Telecom Interface IC with 99 terminals in a grid array package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, 1.2V supply voltage, and thin profile design for telecom circuit applications.
STA8090FGBD
STA8090GADTR
STA8088CWG
STA8088CFB
STA8088CWTR
STA8088G
STA8058A
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 104; Package Code: FBGA; Package Shape: RECTANGULAR;
STA8088
STA8088CFG
STA8088CW
STA8088CF
STA8088CWGTR
STA8058TR
STA8088CFGB
STA8088A
STA8088CFGBTR
Supply Digital Components
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