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STA8090FG

STMicroelectronics

STA8090FG by STMicroelectronics

STA8090FG by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max operating temp of 85 °C and operates at a nominal voltage of 1.2V. Its robust CMOS technology ensures reliable performance in demanding environments.

Median Price

$6.664

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,184 parts In-Stock

1+ parts

$5.627

100+ parts

$5.472

1k+ parts

$5.318

10k+ parts

-

2,184

$5.627

$5.472

$5.318

-

Verical

USA . 2,184 parts In-Stock

1+ parts

$5.627

100+ parts

$5.472

1k+ parts

$5.318

10k+ parts

-

2,184

$5.627

$5.472

$5.318

-

Chip1Stop

Japan . 2,184 parts In-Stock

1+ parts

$7.700

100+ parts

-

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-

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-

2,184

$7.700

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-

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Mouser Electronics

USA . 92 parts In-Stock

1+ parts

$11.170

100+ parts

$8.290

1k+ parts

-

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92

$11.170

$8.290

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 45 parts In-Stock

1+ parts

$7.058

100+ parts

-

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-

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45

$7.058

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Digiode

USA . 2,854 parts In-Stock

1+ parts

$7.315

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-

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2,854

$7.315

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Vyrian

USA . 6,258 parts In-Stock

1+ parts

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6,258

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Anansix

USA . 2,214 parts In-Stock

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2,214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,830 parts In-Stock

1+ parts

$6.930

100+ parts

-

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-

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3,830

$6.930

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IDEA Electronic Components Group

UK . 586 parts In-Stock

1+ parts

$8.267

100+ parts

-

1k+ parts

$7.440

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-

586

$8.267

-

$7.440

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MKK Technologies

India . 1,285 parts In-Stock

1+ parts

$15.546

100+ parts

-

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1,285

$15.546

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DigiPath Technology Company

USA . 1,285 parts In-Stock

1+ parts

$15.546

100+ parts

-

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1,285

$15.546

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RC Electronics

USA . 15,000 parts In-Stock

1+ parts

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15,000

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A-Z Elektronik GmbH

Germany . 6,179 parts In-Stock

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6,179

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Parana Technologies

USA . 945 parts In-Stock

1+ parts

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$9.885

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945

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$9.885

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Glotronic Ltd.

UK . 291 parts In-Stock

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291

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Perfect Parts

USA . 101 parts In-Stock

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101

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Authorized Procurement Solutions

USA . 45 parts In-Stock

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45

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Overview

Elevate your telecom solutions with the STA8090FG from STMicroelectronics, a trusted leader in innovation. This high-performance interface IC boasts exceptional reliability and a robust design that thrives in demanding environments, ensuring seamless connectivity for industrial applications. With its compact footprint and advanced features, the STA8090FG delivers unmatched value, enabling you to enhance your systems while optimizing efficiency and performance. Discover the future of telecom today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Being surface mount allows for a compact design and efficient use of PCB space, facilitating easier integration into diverse systems.

Package Shape: RECTANGULAR

A rectangular package shape is optimal for effective PCB layout and provides flexibility in design configurations.

No. of Terminals: 99

With 99 terminals, this IC can support complex circuitry and provide ample connectivity options for various telecom functions.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch grid array style allows for high-density packaging, which is essential in modern telecom applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85 °C, making it reliable for use in demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for use in extreme conditions, ensuring reliable performance.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier connections in dense applications and enhances thermal performance.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm aids in maintaining a low profile design, which is beneficial for space-constrained applications.

Width: 5 mm

The width of 5 mm is suitable for compact designs, allowing manufacturers to optimize space on the PCB.

Length: 6 mm

A length of 6 mm contributes to the compact overall size, enabling integration into smaller electronic devices and systems.

Temperature Grade: INDUSTRIAL

Being classified as industrial grade ensures higher standards of reliability, making it suitable for rugged applications in telecom and other sectors.

Technology: CMOS

The use of CMOS technology enhances power efficiency and performance, making it ideal for low-power telecom applications.

Terminal Form: BALL

Ball terminal form provides excellent solderability and connection reliability, essential for long-term performance.

Telecom IC Type: TELECOM CIRCUIT

Designed explicitly as a telecom circuit IC, it assures optimal performance in telecommunications applications.

Nominal Supply Voltage: 1.2 V

With a low nominal supply voltage of 1.2 V, this IC supports energy-efficient designs and reduces overall power consumption.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density connections, which is an advantage for modern telecom systems requiring compact layouts.

Technical Specifications

Other Function Telecom Interface ICs STA8090FG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B99

Length:

6 mm

No. of Functions:

1

No. of Terminals:

99

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

STA8090FG Telecommunications trade compliance attributes, and parameters.

ECCN

7A994

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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