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AD9082BBPZRL-4D2AC

Analog Devices

AD9082BBPZRL-4D2AC by Analog Devices

AD9082BBPZRL-4D2AC by Analog Devices is a telecom IC with 324 terminals, operating temperature range of -40 to 85 °C. It features a grid array package style, ball terminal form, and nominal voltage of 1V. Ideal for telecom circuits, this IC is designed for industrial applications requiring fine pitch surface mount technology.

Median Price

$2,752.570

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,000 parts In-Stock

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$2,752.570

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2,000

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$2,752.570

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Distributors (In-Stock)

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Vyrian

USA . 8,066 parts In-Stock

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Digiode

USA . 989 parts In-Stock

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Parana Technologies

USA . 2,017 parts In-Stock

1+ parts

$14.902

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$13.859

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2,017

$14.902

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$13.859

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IDEA Electronic Components Group

UK . 672 parts In-Stock

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$16.024

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$15.223

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$15.223

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672

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$15.223

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AZTECH Wire

Italy . 1,057 parts In-Stock

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$18.110

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DigiPath Technology Company

USA . 1,882 parts In-Stock

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$24.997

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$23.998

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$23.998

1,882

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$23.998

Semicontronic

India . 1,517 parts In-Stock

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$2,339.680

100+ parts

$2,281.188

1k+ parts

$2,269.490

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$2,281.188

$2,269.490

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Component Stockers USA

USA . 1,692 parts In-Stock

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$2,076.340

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1,692

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Native Components

USA . 544 parts In-Stock

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Corphita

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Northwest PG Solutions

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Overview

Unlock the potential of your telecom systems with the AD9082BBPZRL-4D2AC by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-quality products that guarantee reliability and performance. This versatile Telecom Interface IC is perfect for a wide range of applications, offering seamless integration and efficient functionality. Experience the benefits of superior design and innovation with the AD9082BBPZRL-4D2AC, providing unmatched value and advantages for all your telecom needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and protection for the internal components, making the product durable and long-lasting.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 324

Offers a high level of connectivity options, enabling versatile applications and interfaces.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under extreme temperature conditions, making the product suitable for industrial use.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without any issues, enhancing the product's usability in various settings.

Terminal Position: BOTTOM

Facilitates easy connection to the circuit board and simplifies the installation process.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables a compact design and precise placement of terminals, enhancing overall performance and reliability.

Width: 15 mm

Compact size allows for efficient use of space on the circuit board and easy integration into different systems.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly, leading to a strong and reliable connection.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes without any damage, ensuring a secure and stable connection.

Length: 15 mm

Compact size makes the product versatile and suitable for a wide range of applications and installations.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous demands of industrial environments, ensuring consistent performance and reliability.

Terminal Form: BALL

Provides a secure and reliable connection, reducing the chances of connectivity issues or signal loss.

Nominal Supply Voltage: 1 V

Operates efficiently at a low voltage, saving energy and reducing power consumption.

Terminal Pitch: 0.8 mm

Fine pitch allows for a high density of terminals, enabling more functions and features in a compact design.

Moisture Sensitivity Level (MSL): 3

Can withstand moderate exposure to moisture during storage or operation, ensuring long-term reliability and performance.

Technical Specifications

Other Function Telecom Interface ICs AD9082BBPZRL-4D2AC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

JESD-30 Code:

S-PBGA-B324

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

324

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.72 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

AD9082BBPZRL-4D2AC Telecommunications trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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