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GC4016-PBZ

Texas Instruments

GC4016-PBZ by Texas Instruments

Texas Instruments GC4016-PBZ is a 160-terminal IC with CMOS technology, operating b/w -40 to 85°C. It features a 2.5V supply voltage, square package style, and ball terminal form. Ideal for telecom circuits, it has a peak reflow temp of 260°C and MSL level of 3 for industrial applications.

Median Price

$51.440

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 671 parts In-Stock

1+ parts

$51.440

100+ parts

$50.420

1k+ parts

$49.390

10k+ parts

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671

$51.440

$50.420

$49.390

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Distributors (In-Stock)

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Vyrian

USA . 3,184 parts In-Stock

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3,184

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Digiode

USA . 535 parts In-Stock

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535

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Goldney Electronics S.L.

Spain . 8 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 923 parts In-Stock

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$1.676

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923

$1.676

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Northwest PG Solutions

USA . 2,297 parts In-Stock

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$1.844

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2,297

$1.844

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AZTECH Wire

Italy . 337 parts In-Stock

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$9.578

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337

$9.578

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Parana Technologies

USA . 1,582 parts In-Stock

1+ parts

$14.791

100+ parts

$1,373.560

1k+ parts

$13.312

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1,582

$14.791

$1,373.560

$13.312

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DigiPath Technology Company

USA . 266 parts In-Stock

1+ parts

$16.287

100+ parts

$14.984

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266

$16.287

$14.984

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ChromeModa Solutions

Germany . 4,186 parts In-Stock

1+ parts

$16.619

100+ parts

$13.628

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4,186

$16.619

$13.628

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IDEA Electronic Components Group

UK . 366 parts In-Stock

1+ parts

$16.619

100+ parts

$15.788

1k+ parts

$14.957

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366

$16.619

$15.788

$14.957

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One Stop Electronics

USA . 660 parts In-Stock

1+ parts

$63.000

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660

$63.000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Corphita

USA . 3,769 parts In-Stock

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3,769

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A-Z Elektronik GmbH

Germany . 110 parts In-Stock

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Kepictronics

USA . 73 parts In-Stock

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73

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Overview

Unleash the power of cutting-edge technology with the GC4016-PBZ by Texas Instruments. As a trusted industry leader, Texas Instruments delivers unparalleled quality and reliability in their products. The GC4016-PBZ falls under the category of Other Function Telecom Interface ICs, offering a wide range of applications for various telecom circuits. With its innovative design and advanced features, this product provides customers with exceptional value, benefits, and advantages. Upgrade your telecom systems with the GC4016-PBZ and experience seamless performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making this product easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards.

No. of Terminals: 160

A high number of terminals provide versatility in connectivity options for various telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Other Function Telecom Interface ICs GC4016-PBZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B160

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

160

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Trade Compliance

GC4016-PBZ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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