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TCA5013ZAHR

Texas Instruments

TCA5013ZAHR by Texas Instruments

TCA5013ZAHR by Texas Instruments is a 48-terminal, telecom interface IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This square-shaped IC is designed for telecom circuits, featuring a thin profile package body suitable for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,289 parts In-Stock

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8,289

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Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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6,000

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Digiode

USA . 3,520 parts In-Stock

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3,520

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LWI Electronics Inc

India . 425 parts In-Stock

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425

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Distributors (Availability)

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Parana Technologies

USA . 1,155 parts In-Stock

1+ parts

$5.432

100+ parts

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$6.137

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1,155

$5.432

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$6.137

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DigiPath Technology Company

USA . 1,501 parts In-Stock

1+ parts

$5.981

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$5.502

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1,501

$5.981

$5.502

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ChromeModa Solutions

Germany . 2,361 parts In-Stock

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$6.103

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$5.004

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2,361

$6.103

$5.004

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IDEA Electronic Components Group

UK . 2,072 parts In-Stock

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$6.103

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$5.493

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2,072

$6.103

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$5.493

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AZTECH Wire

Italy . 417 parts In-Stock

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$8.616

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417

$8.616

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One Stop Electronics

USA . 546 parts In-Stock

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$726.000

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546

$726.000

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Lixinc

USA . 13,785 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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3,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Corphita

USA . 1,551 parts In-Stock

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1,551

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Overview

Upgrade your telecom systems with the TCA5013ZAHR by Texas Instruments, a top-quality telecom interface IC that offers unparalleled performance and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this product is designed for a wide range of applications in the telecommunications sector. With its advanced features and cutting-edge technology, the TCA5013ZAHR provides customers with exceptional value, benefits, and advantages. Say goodbye to connectivity issues and experience seamless communication with this innovative product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and insulation, making the product resistant to damage and suitable for a variety of environments.

Surface Mount: YES

Allows for easy installation and integration into electronic circuits, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square shape provides a compact design, allowing for efficient use of space on a circuit board.

No. of Terminals: 48

A higher number of terminals offer more connectivity options and versatility in system design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array, thin profile, and fine pitch package style enables high density mounting and enhances signal transmission performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability in various operating conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity, corrosion resistance, and solderability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and allows for easy access during assembly and maintenance.

Maximum Seated Height: 1.2 mm

Low seated height minimizes the overall height of the component, making it suitable for compact electronic devices.

Width: 5 mm

N/A

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time reduces the risk of heat damage to the component during soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and secure connections.

Length: 5 mm

N/A

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: BALL

Ball terminal form facilitates easy connection and enhances signal transmission efficiency.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance in communication networks.

Nominal Supply Voltage: 3.3 V

Standard supply voltage simplifies power management and compatibility with other components in the system.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and enhances electrical signal integrity.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the component has a moderate level of moisture sensitivity, requiring appropriate handling and storage procedures.

Technical Specifications

Other Function Telecom Interface ICs TCA5013ZAHR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B48

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TCA5013ZAHR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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