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AFE7952IABJ

Texas Instruments

AFE7952IABJ by Texas Instruments

AFE7952IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It offers a data rate of 29500 Mbps and operates at a peak reflow temperature of 260°C. Ideal for high-speed telecommunications applications due to its fine pitch design and tin silver copper terminal finish.

Median Price

$1,437.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,214 parts In-Stock

1+ parts

$1,437.000

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1,214

$1,437.000

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Distributors (In-Stock)

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Digiode

USA . 4,908 parts In-Stock

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$1,365.150

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4,908

$1,365.150

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Vyrian

USA . 8,605 parts In-Stock

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8,605

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$21.750

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715

$21.750

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Ampacity Inc.

Singapore . 904 parts In-Stock

1+ parts

$1,221.450

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904

$1,221.450

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Semicontronic

India . 743 parts In-Stock

1+ parts

$1,221.450

100+ parts

$1,190.914

1k+ parts

$1,184.806

10k+ parts

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743

$1,221.450

$1,190.914

$1,184.806

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Corphita

USA . 2,301 parts In-Stock

1+ parts

$1,293.300

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2,301

$1,293.300

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Corohmni

South Africa . 64 parts In-Stock

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$1,437.000

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64

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Northwest PG Solutions

USA . 1,537 parts In-Stock

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1,537

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Native Components

USA . 194 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the AFE7952IABJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge telecom interface ICs that offer unmatched performance and versatility. This product is ideal for a wide range of applications, providing customers with exceptional value and benefits. Trust in Texas Instruments to provide you with the innovative solutions you need to stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable allows for easy installation and replacement of the IC, making it convenient for manufacturers.

No. of Terminals: 400

Having a high number of terminals allows for complex functions and connectivity options, making the IC versatile for various telecom applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper ensures good electrical conductivity and resistance to corrosion, enhancing the reliability of the IC.

Maximum Seated Height: 2.65 mm

The low seated height allows for compact and slim designs, making it suitable for space-constrained applications.

Data Rate: 29500 Mbps

The high data rate capabilities of 29500 Mbps make this IC ideal for handling high-speed telecommunications and data transfer requirements.

Technical Specifications

Other Function Telecom Interface ICs AFE7952IABJ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Additional Features:

RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000

Data Rate:

29500 Mbps

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

400

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

AFE7952IABJ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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