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AFE7700IABJ

Texas Instruments

AFE7700IABJ by Texas Instruments

AFE7700IABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for industrial telecom circuits, it features fine pitch (0.8mm) ball terminals and moisture sensitivity level of MSL3.

Median Price

$729.872

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,161 parts In-Stock

1+ parts

$729.872

100+ parts

$660.660

1k+ parts

$629.200

10k+ parts

-

1,161

$729.872

$660.660

$629.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,095 parts In-Stock

1+ parts

$693.378

100+ parts

-

1k+ parts

-

10k+ parts

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1,095

$693.378

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Vyrian

USA . 8,069 parts In-Stock

1+ parts

-

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-

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8,069

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,364 parts In-Stock

1+ parts

$11.362

100+ parts

-

1k+ parts

$11.788

10k+ parts

-

2,364

$11.362

-

$11.788

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IDEA Electronic Components Group

UK . 2,276 parts In-Stock

1+ parts

$12.766

100+ parts

$12.128

1k+ parts

$11.489

10k+ parts

-

2,276

$12.766

$12.128

$11.489

-

ChromeModa Solutions

Germany . 2,176 parts In-Stock

1+ parts

$12.766

100+ parts

$10.468

1k+ parts

-

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-

2,176

$12.766

$10.468

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AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$20.210

100+ parts

-

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252

$20.210

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Corphita

USA . 2,016 parts In-Stock

1+ parts

$656.885

100+ parts

-

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2,016

$656.885

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DigiPath Technology Company

USA . 1,405 parts In-Stock

1+ parts

-

100+ parts

$11.510

1k+ parts

-

10k+ parts

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1,405

-

$11.510

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Native Components

USA . 336 parts In-Stock

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336

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Northwest PG Solutions

USA . 19 parts In-Stock

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19

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Overview

Experience superior quality and performance with the AFE7700IABJ by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers innovative solutions for a wide range of applications. The AFE7700IABJ offers exceptional value, providing customers with unmatched benefits and advantages. Take your projects to the next level with this cutting-edge product, designed to meet your telecom interface IC needs. Trust Texas Instruments for reliability, efficiency, and excellence in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments, making it versatile and reliable.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring consistent performance in various environments.

Terminal Finish: TIN SILVER COPPER

Provides good electrical conductivity and corrosion resistance, enhancing the overall reliability of the IC.

Maximum Seated Height: 2.65 mm

Compact size allows for efficient use of space on the PCB, ideal for designs with limited room.

Width: 17 mm

Optimal width for fitting in standard PCB layouts, making integration into existing systems seamless.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly process, ensuring proper soldering and connection.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards, suitable for rugged applications and harsh operating conditions.

Moisture Sensitivity Level (MSL): 3

Able to withstand moderate exposure to moisture during storage or operation, reducing the risk of damage from humidity.

Technical Specifications

Other Function Telecom Interface ICs AFE7700IABJ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Additional Features:

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

AFE7700IABJ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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