Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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PM5981B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals in PLASTIC/EPOXY material. It is a TELECOM CIRCUIT IC designed for telecom interfaces, featuring surface mount capability and ball-shaped bottom terminals.
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Marpe Global Electronics
Netroflash
PLASTIC/EPOXY material provides good durability and thermal properties, making the package reliable for long-term use.
Surface mount design allows for easy installation on circuit boards, saving space and simplifying manufacturing processes.
Square shape helps in efficient placement on circuit board and allows for a more uniform distribution of components.
Having a high number of terminals allows for greater connectivity options and versatility in use cases.
Grid array package style provides high density packaging, enabling more functionality in a compact form factor.
Bottom terminal position allows for better heat dissipation and easier soldering during assembly.
Ball terminal form provides a reliable connection and ensures consistent performance over time.
Specifically designed for telecom applications, this IC type ensures compatibility and optimized performance in telecommunication systems.
Other Function Telecom Interface ICs PM5981B-FEI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology
JESD-30 Code:
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Surface Mount:
Telecom IC Type:
Terminal Form:
Terminal Position:
PM5981B-FEI Telecommunications trade compliance attributes, and parameters.
ECCN
5A991.B
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Assembly/Origin - PM59yyy 20/Apr/2020
PCN Packaging - Label and Packing 01/Oct/2018
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
KSZ9031RNXIA
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
Synsemi
RN41N-I/RM
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
1554216004
Molex
WIRE AND CABLE;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LAN8720AI-CP-TR
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
XBP9X-DMUS-001
Digi International
XBP9X-DMUS-001 by Digi Int. is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 37 terminals, operating from -40 to 85 °C at 3.3V. It's a 0.25 Mbps TELECOM CIRCUIT IC ideal for telecom interfaces due to its surface mount capability and NO LEAD terminal form.
SN65DSI83ZQET
Texas Instruments
SN65DSI83ZQET by Texas Instruments is a telecom interface IC with 64 terminals in a square grid array package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a nominal voltage of 1.8V and terminal pitch of 0.5mm, ideal for telecom circuit applications.
L80-M39
Quectel Wireless Solutions
L80-M39 by Quectel is a telecom interface IC with 1 function. It has a square package shape, 12 terminals, and a max operating temperature of 85°C. This IC is commonly used in industrial applications requiring reliable telecom circuitry.
MRF39RAT-I/LY
MRF39RAT-I/LY by Microchip is a telecom IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use at 3.3V supply voltage. With a compact size of 5x5mm and terminal pitch of 0.65mm, it's ideal for telecom interface applications requiring surface mount technology.
BGT24MR2E6327XUMA1
Infineon Technologies
BGT24MR2E6327XUMA1 by Infineon is a Telecom IC with 32 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It operates at 3.3V and features a thin profile design for telecom circuit applications.
SN65DSI86IPAPQ1
SN65DSI86IPAPQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 85°C, with terminal finish of NiPdAu. This IC is suitable for industrial applications requiring a nominal voltage of 1.2V and features gull wing terminal form.
ATA5551M-PPMY
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -40 Cel; Terminal Position: UNSPECIFIED;
WT32I-A-AI6IAP
Silicon Labs
The Silicon Labs WT32I-A-AI6IAP is a telecom IC with 50 terminals, rectangular package shape, and industrial temperature grade. It is surface mountable and has a microelectronic assembly package style. Ideal for telecom circuit applications with operating temperatures ranging from -40°C to 85°C.
RN42HID-I/RM
Microchip Technology's RN42HID-I/RM is a telecom IC with 32 terminals, operating at 3.3V. It offers a data rate of 3 Mbps and operates in industrial temperature range (-40 to 85°C). Ideal for applications requiring high-speed wireless communication.
MAX5980GTJ+T
Analog Devices
MAX5980GTJ+T by Analog Devices is a telecom interface IC with 32 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105 °C and has a nominal voltage of 54 V. This IC is commonly used in telecom circuits for various applications.
RCB-F9T
U-blox Ag
GNSS Module;
MRF24J40MD-I/RM
MRF24J40MD-I/RM by Microchip: Telecom IC with 12 terminals, 3.3V supply voltage, -40 to 85°C operating temp range. Ideal for industrial telecom applications requiring a compact MICROELECTRONIC ASSEMBLY package style.
455-00002
Laird Technologies
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XB3-24DMCM-J
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
TDK5101FHTMA1
Infineon's TDK5101FHTMA1 is a telecom IC with 10 terminals in a small outline, thin profile package. Operating b/w -40°C to 125°C, it has matte tin finish and dual terminal position suitable for automotive applications. With a nominal voltage of 3V, it is designed for telecom circuits requiring precise temperature control.
CY7B933-JXIT
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
BQ51013BYFPT
BQ51013BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5 V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.
RN4678-V/RM113
RN4678-V/RM113 by Microchip Tech is a surface mount telecom IC with 33 terminals in a rectangular package. Operating temp range from -20 to 70°C, nominal voltage of 1.9V. Ideal for telecom circuits due to its compact size and gold over nickel terminal finish.
BGM13P22F512GA-V2R
TELECOM CIRCUIT;
SA602AD/01,112
NXP Semiconductors
SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.
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PM5980B-FEI
PM5980B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals. It is a TELECOM CIRCUIT IC for telecom applications, featuring PLASTIC/EPOXY material and BOTTOM terminal position. Suitable for surface mount assembly, it offers high functionality in a compact SQUARE package shape.
PM5991B-FEI
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
PM5990B-FEI
TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
Supply Digital Components
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