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PM5981B-FEI

Microchip Technology

PM5981B-FEI by Microchip Technology

PM5981B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals in PLASTIC/EPOXY material. It is a TELECOM CIRCUIT IC designed for telecom interfaces, featuring surface mount capability and ball-shaped bottom terminals.

Median Price

$1,345.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,736 parts In-Stock

1+ parts

$1,345.110

100+ parts

$1,019.120

1k+ parts

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10k+ parts

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2,736

$1,345.110

$1,019.120

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DigiKey

USA . 3 parts In-Stock

1+ parts

$1,345.110

100+ parts

-

1k+ parts

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10k+ parts

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3

$1,345.110

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,141 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,141

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Chip Stock

USA . 391 parts In-Stock

1+ parts

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100+ parts

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391

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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100+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,221 parts In-Stock

1+ parts

$1,143.340

100+ parts

-

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10,221

$1,143.340

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XL Components Corporation

Australia . 7,637 parts In-Stock

1+ parts

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7,637

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QualityLine Systems

Poland . 3,566 parts In-Stock

1+ parts

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3,566

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Marpe Global Electronics

Taiwan . 1,744 parts In-Stock

1+ parts

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1,744

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Upgrade your telecom interface with the PM5981B-FEI by Microchip Technology. Experience top-quality manufacturing and reliability in one package. This innovative solution offers seamless integration, increased efficiency, and enhanced performance for a wide range of telecom applications. Trust Microchip Technology to deliver the value and benefits you need to stay ahead in today's competitive market. Elevate your telecom systems with the PM5981B-FEI and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and thermal properties, making the package reliable for long-term use.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Square shape helps in efficient placement on circuit board and allows for a more uniform distribution of components.

No. of Terminals: 1932

Having a high number of terminals allows for greater connectivity options and versatility in use cases.

Package Style (Meter): GRID ARRAY

Grid array package style provides high density packaging, enabling more functionality in a compact form factor.

Terminal Position: BOTTOM

Bottom terminal position allows for better heat dissipation and easier soldering during assembly.

Terminal Form: BALL

Ball terminal form provides a reliable connection and ensures consistent performance over time.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type ensures compatibility and optimized performance in telecommunication systems.

Technical Specifications

Other Function Telecom Interface ICs PM5981B-FEI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B1932

No. of Functions:

1

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM5981B-FEI Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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