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PM5980B-FEI

Microchip Technology

PM5980B-FEI by Microchip Technology

PM5980B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals. It is a TELECOM CIRCUIT IC for telecom applications, featuring PLASTIC/EPOXY material and BOTTOM terminal position. Suitable for surface mount assembly, it offers high functionality in a compact SQUARE package shape.

Median Price

$1,589.680

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,880 parts In-Stock

1+ parts

$1,589.680

100+ parts

$1,204.410

1k+ parts

-

10k+ parts

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2,880

$1,589.680

$1,204.410

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$1,309.104

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$1,309.104

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-

-

Maritex

Poland . 36 parts In-Stock

1+ parts

$2,314.870

100+ parts

-

1k+ parts

-

10k+ parts

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36

$2,314.870

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Vyrian

USA . 8,961 parts In-Stock

1+ parts

-

100+ parts

-

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8,961

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$19.410

100+ parts

-

1k+ parts

-

10k+ parts

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437

$19.410

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-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1,309.104

100+ parts

-

1k+ parts

$1,243.649

10k+ parts

$1,217.466

100

$1,309.104

-

$1,243.649

$1,217.466

Ampacity Inc.

Singapore . 25,411 parts In-Stock

1+ parts

$1,351.230

100+ parts

-

1k+ parts

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10k+ parts

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25,411

$1,351.230

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Montano Global Distributors

Canada . 5,860 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,860

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NIA Electronics

USA . 4,724 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,724

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-

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Ledger Components

France . 4,724 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,724

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-

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LMD Electronica

Estonia . 1,541 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,541

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-

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LOOK Integrated Logistics

Peru . 190 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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190

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Overview

Experience the superior quality and reliability of Microchip Technology with the PM5980B-FEI, a cutting-edge Other Function Telecom Interface ICs. Designed with precision and innovation, this product offers countless applications in the telecom industry. Trust in the value and benefits that come with choosing Microchip Technology, a leading manufacturer in the field. Upgrade your technology with the PM5980B-FEI and unlock a world of possibilities for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the product on circuit boards.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the circuit board.

No. of Terminals: 1932

With a high number of terminals, this product can support complex telecom interfaces and connections.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and signal routing capabilities.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and enhances signal integrity.

Terminal Form: BALL

The ball terminal form ensures reliable connections and efficient power delivery.

Telecom IC Type: TELECOM CIRCUIT

This telecom circuit IC is specifically designed for telecom applications, ensuring optimal performance and reliability.

Technical Specifications

Other Function Telecom Interface ICs PM5980B-FEI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B1932

No. of Functions:

1

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM5980B-FEI Telecommunications trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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