Loading...

CC2560BYFVR

Texas Instruments

CC2560BYFVR by Texas Instruments

CC2560BYFVR by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

Median Price

$3.219

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

1+ parts

$2.430

100+ parts

$2.380

1k+ parts

$2.330

10k+ parts

-

10,000

$2.430

$2.380

$2.330

-

Texas Instruments

USA . 27,000 parts In-Stock

1+ parts

$4.008

100+ parts

$3.512

1k+ parts

$1.984

10k+ parts

-

27,000

$4.008

$3.512

$1.984

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,326 parts In-Stock

1+ parts

$3.808

100+ parts

-

1k+ parts

-

10k+ parts

-

2,326

$3.808

-

-

-

Vyrian

USA . 4,084 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,084

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 249 parts In-Stock

1+ parts

$0.031

100+ parts

-

1k+ parts

-

10k+ parts

$0.030

249

$0.031

-

-

$0.030

Corphita

USA . 779 parts In-Stock

1+ parts

$3.607

100+ parts

-

1k+ parts

-

10k+ parts

-

779

$3.607

-

-

-

Parana Technologies

USA . 231 parts In-Stock

1+ parts

$10.859

100+ parts

$1,008.413

1k+ parts

$9.773

10k+ parts

-

231

$10.859

$1,008.413

$9.773

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$10.981

100+ parts

$9.993

1k+ parts

$9.004

10k+ parts

-

150

$10.981

$9.993

$9.004

-

DigiPath Technology Company

USA . 1,631 parts In-Stock

1+ parts

$11.957

100+ parts

$11.000

1k+ parts

-

10k+ parts

-

1,631

$11.957

$11.000

-

-

ChromeModa Solutions

Germany . 4,633 parts In-Stock

1+ parts

$12.201

100+ parts

$10.005

1k+ parts

-

10k+ parts

-

4,633

$12.201

$10.005

-

-

IDEA Electronic Components Group

UK . 2,352 parts In-Stock

1+ parts

$12.201

100+ parts

$11.591

1k+ parts

$10.981

10k+ parts

-

2,352

$12.201

$11.591

$10.981

-

AZTECH Wire

Italy . 863 parts In-Stock

1+ parts

$16.370

100+ parts

-

1k+ parts

-

10k+ parts

-

863

$16.370

-

-

-

Northwest PG Solutions

USA . 1,607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,607

-

-

-

-

Overview

Elevate your telecom interface with the CC2560BYFVR by Texas Instruments. Boasting superior quality and reliability, this innovative product offers seamless connectivity for a variety of applications. With Texas Instruments renowned reputation for excellence in manufacturing, you can trust that you're getting the best in the industry. Experience the value and benefits of this versatile IC, from its compact design to its high performance capabilities. Upgrade your telecom systems with the CC2560BYFVR and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and resistance to harsh environmental conditions, making this product a reliable choice for telecom applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, allowing for efficient use of space on the circuit board.

No. of Terminals: 54

The high number of terminals allows for versatile connectivity options, making this product suitable for complex telecom interface configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for operation in both extreme cold and hot conditions, providing flexibility in deployment.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish provides excellent electrical conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, enhancing the overall design efficiency of the telecom interface.

Width: 2.925 mm

The narrow width of the package allows for high-density mounting on the circuit board, conserving valuable space in telecom equipment.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage of 3.6 V is suitable for telecom applications, providing stable and efficient power delivery to the interface IC.

Technical Specifications

Other Function Telecom Interface ICs CC2560BYFVR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

3.265 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.575 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.925 mm

Trade Compliance

CC2560BYFVR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20