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INDUSTRIAL Cellphone ICs 271

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
MAX2150ETI-T by Maxim Integrated

MAX2150ETI-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3/3.3

Not Qualified

.9 mm

Other Telecom ICs

.107 mA

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

CC1150RSTR by Texas Instruments

CC1150RSTR

Texas Instruments

The Texas Instruments CC1150RSTR is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC1150RST by Texas Instruments

CC1150RST

Texas Instruments

CC1150RST by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

AD8341ACPZ-REEL7 by Analog Devices

AD8341ACPZ-REEL7

Analog Devices

AD8341ACPZ-REEL7 by Analog Devices is a 24-terminal cellphone IC with 5V power supply, operating b/w -40 to 85°C. It features RF and baseband circuitry in a square chip carrier package suitable for industrial applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.145 mA

5 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

TRF370333IRGER by Texas Instruments

TRF370333IRGER

Texas Instruments

TRF370333IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 235mA. This RF and baseband circuit has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.

S-PQCC-N24

e4

4 mm

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

235 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TRF370333IRGETG4 by Texas Instruments

TRF370333IRGETG4

Texas Instruments

TRF370333IRGETG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square package suitable for surface mounting.

S-PQCC-N24

e4

4 mm

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.235 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

MAX2058ETL-T by Maxim Integrated

MAX2058ETL-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MAX2058ETL by Maxim Integrated

MAX2058ETL

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

e0

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

MAX9985ETX-T by Maxim Integrated

MAX9985ETX-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MAX9985ETX by Maxim Integrated

MAX9985ETX

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e0

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

CC1000PW by Texas Instruments

CC1000PW

Texas Instruments

CC1000PW by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry for telecom applications, and CMOS technology in a small outline package suitable for industrial use.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1000YZR by Texas Instruments

CC1000YZR

Texas Instruments

CC1000YZR by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

CC1000YZ by Texas Instruments

CC1000YZ

Texas Instruments

CC1000YZ by Texas Instruments is a cellphone IC with 28 terminals in a rectangular grid array package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a thin profile of 0.652mm, it supports power supplies of 2.5/3.3V for industrial-grade performance.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

ADF7021BCPZ-RL7 by Analog Devices

ADF7021BCPZ-RL7

Analog Devices

Analog Devices' ADF7021BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for baseband circuits in telecom applications due to its compact square package shape and low profile design.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

AD6657BBCZRL by Analog Devices

AD6657BBCZRL

Analog Devices

AD6657BBCZRL by Analog Devices is a cellphone IC with 144 terminals in a square grid array package. It operates b/w -40 to 85 °C, with a supply voltage of 1.8V for RF and baseband circuits. The low-profile, fine-pitch design makes it suitable for industrial telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD6657BBCZ by Analog Devices

AD6657BBCZ

Analog Devices

AD6657BBCZ by Analog Devices is a cellphone IC with 144 terminals in a square package. It operates b/w -40 to 85 °C and has a supply voltage of 1.8 V, suitable for RF and baseband circuits in telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

ADL5387ACPZ-WP by Analog Devices

ADL5387ACPZ-WP

Analog Devices

ADL5387ACPZ-WP by Analog Devices is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, square package shape, and quad terminal position. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

BIPOLAR

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

CC1101RTKR by Texas Instruments

CC1101RTKR

Texas Instruments

CC1101RTKR by Texas Instruments is a cellphone IC with power supplies of 1.8/3.6V, operating temperature range of -40 to 85°C, and RF & baseband circuit type. Its package style is chip carrier with very thin profile, suitable for industrial telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3 MSL.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

CC1101RTK by Texas Instruments

CC1101RTK

Texas Instruments

CC1101RTK by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a package style of chip carrier. Ideal for industrial applications requiring RF communication in compact form factors.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TRF3710IRGZT by Texas Instruments

TRF3710IRGZT

Texas Instruments

TRF3710IRGZT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

ACFM-7102-BLK by Broadcom

ACFM-7102-BLK

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Qualification: Not Qualified;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

ACFM-7102-TR1 by Broadcom

ACFM-7102-TR1

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

CC1000-RTB1 by Texas Instruments

CC1000-RTB1

Texas Instruments

CC1000-RTB1 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. This CMOS technology device has a small outline package style suitable for industrial applications.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1000-RTR1 by Texas Instruments

CC1000-RTR1

Texas Instruments

CC1000-RTR1 by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuit for telecom applications, and CMOS technology in a small outline package. Ideal for industrial use due to its nickel palladium gold finish and dual terminal position.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

ADF7020-1BCPZ-RL by Analog Devices

ADF7020-1BCPZ-RL

Analog Devices

Analog Devices' ADF7020-1BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 3V, RF and baseband circuitry, and a compact square package suitable for telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

MAX4003EBL by Maxim Integrated

MAX4003EBL

Maxim Integrated

MAX4003EBL by Maxim Integrated is a CELLPHONE IC with 8 terminals in a SQUARE package. It features GRID ARRAY style, operates b/w -40 to 85°C, and has RF & BASEBAND CIRCUIT applications. The IC has a very thin profile of 0.67mm, uses TIN LEAD finish, and requires 3V supply voltage for operation.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm

CC1110F16RSP by Texas Instruments

CC1110F16RSP

Texas Instruments

The Texas Instruments CC1110F16RSP is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial applications.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F32RSPR by Texas Instruments

CC1110F32RSPR

Texas Instruments

The Texas Instruments CC1110F32RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit make it ideal for industrial telecom applications. With a low profile of 0.9mm and terminal pitch of 0.5mm, it offers high performance in compact designs.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F32RSP by Texas Instruments

CC1110F32RSP

Texas Instruments

CC1110F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F8RSPR by Texas Instruments

CC1110F8RSPR

Texas Instruments

The Texas Instruments CC1110F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit for telecom applications. Nominal voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3 make it ideal for industrial use.

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

CC1110F8RSP by Texas Instruments

CC1110F8RSP

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e4

6 mm

3

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

.9 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

6 mm

MAX2029ETP-T by Maxim Integrated

MAX2029ETP-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.65 mm

QUAD

5 mm

MAX2029ETP by Maxim Integrated

MAX2029ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

5 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

AD6655ABCPZ-150 by Analog Devices

AD6655ABCPZ-150

Analog Devices

AD6655ABCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V and max current of 0.805mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.805 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZ-80 by Analog Devices

AD6655ABCPZ-80

Analog Devices

AD6655ABCPZ-80 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and low supply current of 0.42mA. Ideal for baseband circuits, this square chip carrier package is surface mountable with a terminal pitch of 0.5mm.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.42 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZRL7-125 by Analog Devices

AD6655ABCPZRL7-125

Analog Devices

AD6655ABCPZRL7-125 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and max current of 0.705mA. This BASEBAND CIRCUIT IC comes in a square chip carrier package with matte tin finish, suitable for industrial applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.705 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

9 mm

AD6655ABCPZRL7-150 by Analog Devices

AD6655ABCPZRL7-150

Analog Devices

AD6655ABCPZRL7-150 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and consumes 0.805mA current. This BASEBAND CIRCUIT IC comes in a SQUARE package style, suitable for telecom applications.

S-XQCC-N64

e3

9 mm

3

1

64

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8

Not Qualified

1 mm

Other Telecom ICs

.805 mA

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

Matte Tin (Sn)

NO LEAD

.5 mm

QUAD

30

9 mm

MAX2392ETI by Maxim Integrated

MAX2392ETI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

e0

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.04 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

MAX2396EGI by Maxim Integrated

MAX2396EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

e0

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.038 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

MAX2401ETI by Maxim Integrated

MAX2401ETI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;

R-XQCC-N28

1

28

85 Cel

-40 Cel

UNSPECIFIED

QCCN

LCC28,.2SQ,20

RECTANGULAR

CHIP CARRIER

3

Not Qualified

Other Telecom ICs

.043 mA

3 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

SA601DK,112 by NXP Semiconductors

SA601DK,112

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA601DK,118 by NXP Semiconductors

SA601DK,118

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

4.4 mm

SA620DK,112 by NXP Semiconductors

SA620DK,112

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

SA620DK,118 by NXP Semiconductors

SA620DK,118

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G20

e4

6.5 mm

1

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

Not Qualified

1.5 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.65 mm

DUAL

30

4.4 mm

ACFM-7101-TR1G by Broadcom

ACFM-7101-TR1G

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

ADS58C20IPFPR by Texas Instruments

ADS58C20IPFPR

Texas Instruments

Texas Instruments ADS58C20IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.

3.45 V

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

ADS58C20IPFP by Texas Instruments

ADS58C20IPFP

Texas Instruments

Texas Instruments ADS58C20IPFP is an 80-terminal cellphone IC with a max analog input of 3.45V, operating b/w -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.

3.45 V

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm

ADS58C23IPFPR by Texas Instruments

ADS58C23IPFPR

Texas Instruments

Texas Instruments ADS58C23IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. Ideal for RF and baseband circuits, this IC has a compact square package style with gull wing terminals suitable for surface mount applications.

3.45 V

S-PQFP-G80

e4

12 mm

3

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

HTFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

260

1.2 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

12 mm