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INDUSTRIAL Cellphone ICs 271

Cellphone ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
SX8652IWLTRT by Semtech

SX8652IWLTRT

Semtech

Semtech's SX8652IWLTRT is a Cellphone IC with 14 terminals, operating temp. range of -40 to 85°C, and 1.8V supply voltage. It features a small outline package suitable for baseband circuits in telecom applications.

R-PDSO-N14

e3

4 mm

2

1

14

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.8 mm

1.8 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

DUAL

3 mm

CC2591RGVRG4 by Texas Instruments

CC2591RGVRG4

Texas Instruments

CC2591RGVRG4 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. This RF front end circuit has a max supply current of 4mA, making it ideal for industrial telecom applications.

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC2591RGVTG4 by Texas Instruments

CC2591RGVTG4

Texas Instruments

RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N16

e4

4 mm

2

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3

Not Qualified

1 mm

Other Telecom ICs

4 mA

3 V

YES

RF FRONT END CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

ADF4360-9BCPZRL by Analog Devices

ADF4360-9BCPZRL

Analog Devices

Analog Devices' ADF4360-9BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, matte tin finish, and industrial temperature grade. Ideal for baseband circuits in telecom applications due to its compact size (4x4mm) and low profile (1mm).

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-9BCPZ by Analog Devices

ADF4360-9BCPZ

Analog Devices

Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

AD8366ACPZ-R7 by Analog Devices

AD8366ACPZ-R7

Analog Devices

AD8366ACPZ-R7 by Analog Devices is a Cellphone IC with 2 functions, operating at -40 to 85 °C. It features a square package style, 32 terminals, and matte tin finish. Ideal for telecom applications as a baseband circuit with a nominal voltage of 5V.

S-XQCC-N32

e3

5 mm

3

2

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

1 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

5 mm

MAX2306EGI by Maxim Integrated

MAX2306EGI

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

240

3/3.3

Not Qualified

.9 mm

Other Telecom ICs

.0415 mA

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

20

5 mm

MAX2902EGI by Maxim Integrated

MAX2902EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2904EGI by Maxim Integrated

MAX2904EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7/4.5

Not Qualified

.9 mm

Other Telecom ICs

4.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2606EUT-T by Maxim Integrated

MAX2606EUT-T

Maxim Integrated

MAX2606EUT-T by Maxim Integrated is a small outline, low profile cellphone IC with 6 terminals. Operating temperature ranges from -40 to 85°C. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2607EUT-T by Maxim Integrated

MAX2607EUT-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2608EUT-T by Maxim Integrated

MAX2608EUT-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2609EUT-T by Maxim Integrated

MAX2609EUT-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;

R-PDSO-G6

e0

2.9 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Not Qualified

1.45 mm

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.95 mm

DUAL

1.625 mm

MAX2361EGM by Maxim Integrated

MAX2361EGM

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N48

e0

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3

Not Qualified

1 mm

Other Telecom ICs

.09 mA

2.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

7 mm

AD6634BBC by Analog Devices

AD6634BBC

Analog Devices

AD6634BBC by Analog Devices is a Cellphone IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5-3.3V. This BASEBAND CIRCUIT technology uses CMOS and is ideal for telecom applications.

S-PBGA-B196

e0

15 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA196,14X14,40

SQUARE

GRID ARRAY

240

2.5,3.3

Not Qualified

Other Telecom ICs

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

15 mm

TRF6901PTR by Texas Instruments

TRF6901PTR

Texas Instruments

TRF6901PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with supply voltage of 2/3.3V and current draw of 0.04mA. Ideal for RF and baseband circuits in telecom applications due to its low profile design and fine pitch style.

S-PQFP-G48

e4

7 mm

1

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

2/3.3

Not Qualified

1.6 mm

Other Telecom ICs

.04 mA

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

7 mm

MAX2620E/D by Maxim Integrated

MAX2620E/D

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1;

X-XUUC-N

e0

1

1

85 Cel

-40 Cel

UNSPECIFIED

DIE

UNSPECIFIED

UNCASED CHIP

240

Not Qualified

3 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

UPPER

20

MAX2620EUA by Maxim Integrated

MAX2620EUA

Maxim Integrated

MAX2620EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C. Telecom IC type for RF and baseband circuits, suitable for industrial applications.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

240

Not Qualified

1.1 mm

3 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

20

3 mm

MAX9982ETP by Maxim Integrated

MAX9982ETP

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX9989ETP by Maxim Integrated

MAX9989ETP

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX1958ETP by Maxim Integrated

MAX1958ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

3.6 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX1959ETP by Maxim Integrated

MAX1959ETP

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

Not Qualified

.8 mm

3.6 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX4003EBL-T by Maxim Integrated

MAX4003EBL-T

Maxim Integrated

MAX4003EBL-T by Maxim Integrated is a CELLPHONE IC with 8 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits. With a very thin profile of 0.67mm, it has a terminal pitch of 0.5mm ideal for telecom applications.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm

MAX4003EUA by Maxim Integrated

MAX4003EUA

Maxim Integrated

MAX4003EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

TRF5901PT by Texas Instruments

TRF5901PT

Texas Instruments

TRF5901PT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, consuming 0.053mA at 3V supply voltage. This RF and baseband circuit uses CMOS technology for industrial applications.

S-PQFP-G48

e4

7 mm

1

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

3

Not Qualified

1.6 mm

Other Telecom ICs

.053 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

7 mm

AD6635BB by Analog Devices

AD6635BB

Analog Devices

AD6635BB by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5V and 3.3V. This BASEBAND CIRCUIT technology uses CMOS and is suitable for industrial telecom applications.

S-PBGA-B324

e0

19 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

225

2.5,3.3

Not Qualified

3.5 mm

Other Telecom ICs

2.5 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD SILVER

BALL

1 mm

BOTTOM

19 mm

MAX2046ETJ-T by Maxim Integrated

MAX2046ETJ-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N32

e0

5 mm

1

1

32

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2010ETI-T by Maxim Integrated

MAX2010ETI-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5

Not Qualified

.8 mm

Other Telecom ICs

.0121 mA

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

ADF4360-7BCPZRL by Analog Devices

ADF4360-7BCPZRL

Analog Devices

Analog Devices' ADF4360-7BCPZRL is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-8BCPZRL by Analog Devices

ADF4360-8BCPZRL

Analog Devices

Analog Devices' ADF4360-8BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85 °C.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

TRF6903PTR by Texas Instruments

TRF6903PTR

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

S-PQFP-G48

e4

7 mm

1

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

2.5/3.3

Not Qualified

1.6 mm

Other Telecom ICs

2.7 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

QUAD

30

7 mm

GC5316IZED by Texas Instruments

GC5316IZED

Texas Instruments

GC5316IZED by Texas Instruments is a Cellphone IC with 388 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.5V and 3.3V. This RF and baseband circuit has a terminal pitch of 1mm, making it ideal for telecom applications.

S-PBGA-B388

e1

27 mm

3

1

388

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA388,26X26,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.5,3.3

Not Qualified

2.5 mm

Other Telecom ICs

1.5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

27 mm

TRF4903PW by Texas Instruments

TRF4903PW

Texas Instruments

TRF4903PW by Texas Instruments is a cellphone IC with 24 terminals, operating voltage of 2.7V, and max supply current of 0.042mA. It features RF and baseband circuits for telecom applications, in a small outline package suitable for industrial temperature range.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

2.7

Not Qualified

1.2 mm

Other Telecom ICs

.042 mA

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

MAX2388EGC-T by Maxim Integrated

MAX2388EGC-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: SQUARE;

S-XQCC-N12

e0

3 mm

1

1

12

85 Cel

-40 Cel

UNSPECIFIED

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

Not Qualified

.9 mm

2.7 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

3 mm

MAX2620EUA-T by Maxim Integrated

MAX2620EUA-T

Maxim Integrated

MAX2620EUA-T by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature ranges from -40 to 85°C. It's a RF and baseband circuit for telecom applications with nominal voltage of 3V.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

MAX2685EEE-T by Maxim Integrated

MAX2685EEE-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;

R-PDSO-G16

e0

4.89 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

Not Qualified

1.73 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.635 mm

DUAL

3.9 mm

MAX2690EUB-T by Maxim Integrated

MAX2690EUB-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G10

e0

3 mm

1

1

10

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.092 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.5 mm

DUAL

2.9465 mm

MAX4003EUA-T by Maxim Integrated

MAX4003EUA-T

Maxim Integrated

MAX4003EUA-T by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications.

S-PDSO-G8

e0

3 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.1 mm

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

GULL WING

.65 mm

DUAL

3 mm

MAX5865ETM-T by Maxim Integrated

MAX5865ETM-T

Maxim Integrated

MAX5865ETM-T by Maxim Integrated is a 48-terminal cellphone IC with 2 channels. It operates b/w -40 to 85°C, offering an output voltage of up to 3V in OFFSET BINARY code. Ideal for RF and baseband circuits, this CMOS technology chip has a compact square package style suitable for telecom applications.

1.5 V

DIFFERENTIAL

S-XQCC-N48

e0

7 mm

2

1

48

85 Cel

-40 Cel

VOLTAGE

OFFSET BINARY

3 V

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8,3.3

Not Qualified

8

.8 mm

Codecs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

7 mm

MAX9989ETP-T by Maxim Integrated

MAX9989ETP-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

AD6636BBCZ by Analog Devices

AD6636BBCZ

Analog Devices

Analog Devices' AD6636BBCZ is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.8V, making it ideal for telecom applications.

S-PBGA-B256

e1

17 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

1.85 mm

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

AD6636CBCZ by Analog Devices

AD6636CBCZ

Analog Devices

AD6636CBCZ by Analog Devices is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 1.8V, making it ideal for cellphone applications.

S-PBGA-B256

e1

17 mm

3

1

256

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

1.85 mm

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

AD8340ACPZ-WP by Analog Devices

AD8340ACPZ-WP

Analog Devices

AD8340ACPZ-WP by Analog Devices is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a supply voltage of 5V and max current draw of 0.15mA. This RF and baseband circuit technology is ideal for industrial telecom applications requiring very thin profile components.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.15 mA

5 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

AD8348ARUZ by Analog Devices

AD8348ARUZ

Analog Devices

AD8348ARUZ by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is RECTANGULAR, PLASTIC/EPOXY material, with GULL WING terminals and a small outline of 9.7mm x 4.4mm x 1.2mm dimensions.

R-PDSO-G28

e3

9.7 mm

1

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

5

Not Qualified

1.2 mm

Other Telecom ICs

5 V

YES

BIPOLAR

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

30

4.4 mm

ADF4360-0BCPZ by Analog Devices

ADF4360-0BCPZ

Analog Devices

Analog Devices' ADF4360-0BCPZ is a 24-terminal cellphone IC with 3.3V supply, operating from -40 to 85°C. It features BICMOS tech, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package style.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-0BCPZRL by Analog Devices

ADF4360-0BCPZRL

Analog Devices

Analog Devices' ADF4360-0BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package style with a very thin profile for industrial use.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-1BCPZ by Analog Devices

ADF4360-1BCPZ

Analog Devices

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

ADF4360-2BCPZ by Analog Devices

ADF4360-2BCPZ

Analog Devices

Analog Devices' ADF4360-2BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3.3

Not Qualified

1 mm

Other Telecom ICs

3.3 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm