Loading...

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
ST33HTPH2E32AAF1 by STMicroelectronics

ST33HTPH2E32AAF1

STMicroelectronics

ST33HTPH2E32AAF1 by STMicroelectronics is a cryptographic authenticator designed for industrial applications. It operates b/w -40 °C to 105 °C, features a compact 5mm x 5mm square package with 32 terminals, and runs on a nominal voltage of 1.8V. Ideal for secure device authentication in IoT and embedded systems.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATWINC1500-MR210PB1952-T by Microchip Technology

ATWINC1500-MR210PB1952-T

Microchip Technology

Microchip's ATWINC1500-MR210PB1952-T is a CMOS network controller with 28 terminals, operating at 2.7-3.6V, ideal for industrial applications. With a compact rectangular package style and surface mount design, it offers a wide temperature range from -40 to 85°C for versatile use in various electronic systems.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

1.016 mm

UNSPECIFIED

NOT SPECIFIED

14.73 mm

NETWORK CONTROLLER

SIP007AFS001 by Samsung

SIP007AFS001

Samsung

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 271; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;

R-XXMA-X271

49 mm

271

70 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.45 mm

5 V

3.7 V

4.2 V

NO

CMOS

COMMERCIAL

UNSPECIFIED

1.13 mm

UNSPECIFIED

36 mm

MICROPROCESSOR CIRCUIT

MCIMX280CVM4CR2 by NXP Semiconductors

MCIMX280CVM4CR2

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX280DVM4CR by NXP Semiconductors

MCIMX280DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283CVM4CR2 by NXP Semiconductors

MCIMX283CVM4CR2

NXP Semiconductors

MCIMX283CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch grid array packages.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283DVM4CR2 by NXP Semiconductors

MCIMX283DVM4CR2

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286CVM4CR2 by NXP Semiconductors

MCIMX286CVM4CR2

NXP Semiconductors

MCIMX286CVM4CR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4CR by NXP Semiconductors

MCIMX286DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

XC7Z015-1CL485I by Xilinx

XC7Z015-1CL485I

Xilinx

The Xilinx XC7Z015-1CL485I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a square grid array package, it's ideal for various applications requiring low profile and fine pitch components.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

PROGRAMMABLE SYSTEM ON CHIP

MIMX8DX6AVLFZAC by NXP Semiconductors

MIMX8DX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8DX6AVLFZAC is a System on Chip with 609 terminals, operating temperature range of -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and is designed for automotive applications requiring high performance in a compact form factor.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX6AVLFZAC by NXP Semiconductors

MIMX8QX6AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX6AVLFZAC is a System on Chip with 609 terminals, operating at -40 to 125 °C. It features a supply voltage range of 1.05V to 1.15V and uses CMOS technology. Ideal for automotive applications requiring high performance in a compact grid array package style.

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

ATMXT224T-CCU027 by Microchip Technology

ATMXT224T-CCU027

Microchip Technology

CAPACITIVE TOUCH SCREEN CONTROLLERS; Terminal Form: BALL; No. of Terminals: 64; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B64

5 mm

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA64,8X8,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.6 mm

3.47 V

3 V

3.3 V

YES

CMOS

BALL

.5 mm

BOTTOM

5 mm

CAPACITIVE TOUCH SCREEN CONTROLLERS

ATWINC1500-MR210PB1172 by Microchip Technology

ATWINC1500-MR210PB1172

Microchip Technology

ATWINC1500-MR210PB1172 by Microchip operates at 2.7-3.6V, with temp range -40 to 85°C. Its MICROELECTRONIC ASSEMBLY style has 28 terminals and CMOS tech for INDUSTRIAL applications in MICROPROCESSOR CIRCUITS.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210PB1944 by Microchip Technology

ATWINC1500-MR210PB1944

Microchip Technology

ATWINC1500-MR210PB1944 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1510-MR210PB1944 by Microchip Technology

ATWINC1510-MR210PB1944

Microchip Technology

Microchip Technology's ATWINC1510-MR210PB1944 is a CMOS microprocessor circuit with 28 terminals. It operates b/w -40 to 85°C, ideal for industrial applications. With a supply voltage range of 2.7V to 3.6V, it offers high performance in compact MICROELECTRONIC ASSEMBLY package style.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

MEC1705Q-C2-I/SZ by Microchip Technology

MEC1705Q-C2-I/SZ

Microchip Technology

MEC1705Q-C2-I/SZ by Microchip Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.71-1.89 V. This IC is ideal for industrial applications requiring very thin profile and fine pitch grid array package style.

ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE

S-PBGA-B144

9 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

9 mm

MICROPROCESSOR CIRCUIT

ATSAMA5D27-WLSOM1 by Microchip Technology

ATSAMA5D27-WLSOM1

Microchip Technology

ATSAMA5D27-WLSOM1 by Microchip: Operates at 3-5.5V, -40 to 85°C. With 188 terminals, it's a CMOS microprocessor circuit ideal for various applications requiring high-performance computing in a compact square package.

S-XUUC-N188

188

85 Cel

-40 Cel

UNSPECIFIED

DIE

SQUARE

UNCASED CHIP

NOT SPECIFIED

5.5 V

3 V

3.3 V

YES

CMOS

NO LEAD

UPPER

NOT SPECIFIED

MICROPROCESSOR CIRCUIT

MIMX8MN6DVTJZAA by NXP Semiconductors

MIMX8MN6DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MCIMX6S6AVM08ACR by NXP Semiconductors

MCIMX6S6AVM08ACR

NXP Semiconductors

MCIMX6S6AVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with a supply voltage range of 1.275V to 1.5V. Ideal for automotive applications due to its low profile and fine pitch package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

XC7Z045-1FBG676CES by Xilinx

XC7Z045-1FBG676CES

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

PROGRAMMABLE SYSTEM ON CHIP

66AK2G12ABYT100 by Texas Instruments

66AK2G12ABYT100

Texas Instruments

66AK2G12ABYT100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 0.95V to 1.05V, making it ideal for automotive applications. This package features a grid array with 625 terminals in a low profile, fine pitch design for surface mount assembly.

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

DLPC900AZPC by Texas Instruments

DLPC900AZPC

Texas Instruments

DLPC900AZPC by Texas Instruments is a MICROPROCESSOR CIRCUIT with 516 terminals, operating at a max clock frequency of 20 MHz. It is used in applications requiring I2C, SPI, UART, and USB bus compatibility.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210PB1140 by Microchip Technology

ATWINC1500-MR210PB1140

Microchip Technology

ATWINC1500-MR210PB1140 by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.

SEATED HGT-NOM

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

4.2 V

3 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210UB1140 by Microchip Technology

ATWINC1500-MR210UB1140

Microchip Technology

ATWINC1500-MR210UB1140 by Microchip operates at 3-4.2V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit in a rectangular package style, ideal for industrial applications requiring surface mount technology. With 28 terminals and compact dimensions of 21.72mm x 14.73mm x 2.113mm, it offers high performance in various uP and uC functions.

SEATED HGT-NOM

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

4.2 V

3 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

MCIMX286DVM4BR by NXP Semiconductors

MCIMX286DVM4BR

NXP Semiconductors

MCIMX286DVM4BR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35-1.55 V, making it ideal for low-power applications in various electronic devices.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MKW01Z128CHNR by NXP Semiconductors

MKW01Z128CHNR

NXP Semiconductors

MICROPROCESSOR CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD; Maximum Time At Peak Reflow Temperature (s): 40;

e4

3

260

NICKEL GOLD

40

MICROPROCESSOR CIRCUIT

DRA784BSGABFQ1 by Texas Instruments

DRA784BSGABFQ1

Texas Instruments

DRA784BSGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, operating at 32 MHz clock frequency. Ideal for automotive applications, it features a max supply voltage of 1.11 V and can withstand temperatures from -40 to 125 °C.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA784BSGABFRQ1 by Texas Instruments

DRA784BSGABFRQ1

Texas Instruments

DRA784BSGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFQ1 by Texas Instruments

DRA785BSGABFQ1

Texas Instruments

The Texas Instruments DRA785BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Designed for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02V to 1.11V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFRQ1 by Texas Instruments

DRA785BSGABFRQ1

Texas Instruments

The Texas Instruments DRA785BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFQ1 by Texas Instruments

DRA788BSGABFQ1

Texas Instruments

The Texas Instruments DRA788BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level. The package style is GRID ARRAY, FINE PITCH with 367 terminals in PLASTIC/EPOXY material.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFRQ1 by Texas Instruments

DRA788BSGABFRQ1

Texas Instruments

The Texas Instruments DRA788BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 screening level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-5A by Analog Devices

ADSP-21584KBCZ-5A

Analog Devices

ADSP-21584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications. With a supply voltage range of 1.05V to 1.15V, it can operate in temperatures from 0 °C to 70°C.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-5A by Analog Devices

ADSP-21584BBCZ-5A

Analog Devices

ADSP-21584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-5A by Analog Devices

ADSP-21584CBCZ-5A

Analog Devices

ADSP-21584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-5A by Analog Devices

ADSP-SC584KBCZ-5A

Analog Devices

ADSP-SC584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style with 349 terminals for various applications.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587KBCZ-5B by Analog Devices

ADSP-SC587KBCZ-5B

Analog Devices

ADSP-SC587KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style and is ideal for commercial applications requiring high-speed processing capabilities.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587BBCZ-5B by Analog Devices

ADSP-SC587BBCZ-5B

Analog Devices

ADSP-SC587BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 85 °C, it's ideal for various embedded system designs.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589KBCZ-5B by Analog Devices

ADSP-SC589KBCZ-5B

Analog Devices

ADSP-SC589KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features a CMOS technology. Ideal for applications requiring high-speed processing in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589BBCZ-5B by Analog Devices

ADSP-SC589BBCZ-5B

Analog Devices

ADSP-SC589BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) and has 349 terminals in a low profile grid array package for various applications.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-5A by Analog Devices

ADSP-SC584BBCZ-5A

Analog Devices

ADSP-SC584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile package style (1.5 mm height) for various applications requiring high-speed processing.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-5A by Analog Devices

ADSP-SC584CBCZ-5A

Analog Devices

ADSP-SC584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has SPI and UART bus compatibility, suitable for INDUSTRIAL applications requiring low profile, fine pitch GRID ARRAY package style.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

EFR32MG13P732F512IM48-DR by Silicon Labs

EFR32MG13P732F512IM48-DR

Silicon Labs

EFR32MG13P732F512IM48-DR by Silicon Labs is a System on Chip with 48 terminals, operating from -40 to 125 °C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. This chip is ideal for applications requiring low power consumption in compact designs.

S-XQCC-N48

7 mm

48

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

3.8 V

1.62 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

7 mm

SYSTEM ON CHIP

EFR32MG13P733F512IM48-D by Silicon Labs

EFR32MG13P733F512IM48-D

Silicon Labs

EFR32MG13P733F512IM48-D by Silicon Labs is a System on Chip with 48 terminals, operating from -40 to 125°C. It has a supply voltage range of 1.62V to 3.8V and uses CMOS technology. Ideal for applications requiring low-profile, surface-mount components in various electronic devices.

S-XQCC-N48

e3

7 mm

2

48

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.28SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.9 mm

3.8 V

1.62 V

3.3 V

YES

CMOS

MATTE TIN

NO LEAD

.5 mm

QUAD

40

7 mm

SYSTEM ON CHIP

EFR32FG13P232F512GM48-D by Silicon Labs

EFR32FG13P232F512GM48-D

Silicon Labs

SoC; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260;

e3

2

260

MATTE TIN

40

SoC

ECE1200-I/LD by Microchip Technology

ECE1200-I/LD

Microchip Technology

ECE1200-I/LD by Microchip: CMOS microprocessor circuit with 40 terminals, operates b/w -40 to 85 °C. Supply voltage range of 1.71V to 1.89V, in a square chip carrier package for various applications requiring low-profile and surface mount technology.

S-PQCC-N40

5 mm

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.9 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

NO LEAD

.4 mm

QUAD

5 mm

MICROPROCESSOR CIRCUIT

10AS057K2F40E1HG by Intel

10AS057K2F40E1HG

Intel

10AS057K2F40E1HG by Intel is a Square GRID ARRAY package with 1517 terminals, operating b/w 0-100°C. It features SoC technology from TSMC, with a terminal pitch of 1mm. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B1517

40 mm

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517,39X39,40

SQUARE

GRID ARRAY

3.5 mm

YES

TSMC

BALL

1 mm

BOTTOM

40 mm

SoC