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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCZU47DR-L2FSVE1156I by Xilinx

XCZU47DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FSVG1517I by Xilinx

XCZU47DR-L2FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVE1156E by Xilinx

XCZU48DR-1FFVE1156E

Xilinx

XCZU48DR-1FFVE1156E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for Other Function uPs,uCs & Peripheral ICs applications due to its low supply voltage range of 0.825-0.876 V and high peak reflow temperature of 245C.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVE1156I by Xilinx

XCZU48DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVG1517E by Xilinx

XCZU48DR-1FFVG1517E

Xilinx

XCZU48DR-1FFVG1517E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for various applications requiring Other Function uPs,uCs & Peripheral ICs in a GRID ARRAY package style.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVG1517I by Xilinx

XCZU48DR-1FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVE1156E by Xilinx

XCZU48DR-1FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVE1156I by Xilinx

XCZU48DR-1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVG1517E by Xilinx

XCZU48DR-1FSVG1517E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVG1517I by Xilinx

XCZU48DR-1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVE1156E by Xilinx

XCZU48DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVE1156I by Xilinx

XCZU48DR-2FFVE1156I

Xilinx

XCZU48DR-2FFVE1156I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Suitable for industrial applications, it features a grid array package style and 1156 terminals for surface mount assembly.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVG1517E by Xilinx

XCZU48DR-2FFVG1517E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVG1517I by Xilinx

XCZU48DR-2FFVG1517I

Xilinx

XCZU48DR-2FFVG1517I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVE1156E by Xilinx

XCZU48DR-2FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVE1156I by Xilinx

XCZU48DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVG1517E by Xilinx

XCZU48DR-2FSVG1517E

Xilinx

XCZU48DR-2FSVG1517E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It has 1517 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVG1517I by Xilinx

XCZU48DR-2FSVG1517I

Xilinx

The Xilinx XCZU48DR-2FSVG1517I is a programmable SoC with CMOS technology. It operates in industrial temperature range (-40 to 100 °C) and has a max supply voltage of 0.876 V. With 1517 terminals in a grid array package, it's ideal for various applications requiring high-performance computing and processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FFVE1156I by Xilinx

XCZU48DR-L1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FFVG1517I by Xilinx

XCZU48DR-L1FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FSVE1156I by Xilinx

XCZU48DR-L1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FSVG1517I by Xilinx

XCZU48DR-L1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FFVE1156I by Xilinx

XCZU48DR-L2FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FFVG1517I by Xilinx

XCZU48DR-L2FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FSVE1156I by Xilinx

XCZU48DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FSVG1517I by Xilinx

XCZU48DR-L2FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-1FFVF1760E by Xilinx

XCZU49DR-1FFVF1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-1FFVF1760I by Xilinx

XCZU49DR-1FFVF1760I

Xilinx

XCZU49DR-1FFVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w -40 to 100 °C. Ideal for industrial applications requiring a supply voltage range of 0.825V to 0.876V.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU49DR-1FSVF1760E by Xilinx

XCZU49DR-1FSVF1760E

Xilinx

XCZU49DR-1FSVF1760E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for Other Function uPs,uCs & Peripheral ICs applications requiring a supply voltage range of 0.825-0.876 V and peak reflow temperature of 240C.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-1FSVF1760I by Xilinx

XCZU49DR-1FSVF1760I

Xilinx

XCZU49DR-1FSVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This IC is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FFVF1760E by Xilinx

XCZU49DR-2FFVF1760E

Xilinx

XCZU49DR-2FFVF1760E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for applications requiring low power consumption and high performance.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FFVF1760I by Xilinx

XCZU49DR-2FFVF1760I

Xilinx

XCZU49DR-2FFVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals, operates b/w -40 to 100 °C, and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FSVF1760E by Xilinx

XCZU49DR-2FSVF1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FSVF1760I by Xilinx

XCZU49DR-2FSVF1760I

Xilinx

XCZU49DR-2FSVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It has 1760 terminals, operates b/w -40 to 100 °C, and supports a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance computing in a compact form factor.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-L1FFVF1760I by Xilinx

XCZU49DR-L1FFVF1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-L1FSVF1760I by Xilinx

XCZU49DR-L1FSVF1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-L2FFVF1760I by Xilinx

XCZU49DR-L2FFVF1760I

Xilinx

The Xilinx XCZU49DR-L2FFVF1760I is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, suitable for industrial applications. Operating temperature ranges from -40 to 100 °C, with supply voltage b/w 0.698V to 0.742V.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

AT32UC3A4256HHB-C1UR by Microchip Technology

AT32UC3A4256HHB-C1UR

Microchip Technology

Microchip AT32UC3A4256HHB-C1UR is a CMOS microprocessor with 100 terminals in a square grid array package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V. Ideal for industrial applications requiring high-performance processing in compact form factors.

S-PBGA-B100

7 mm

100

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA100,10X10,25

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1 mm

3.3 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

7 mm

MICROPROCESSOR CIRCUIT

MIMXRT1064CVL5A by NXP Semiconductors

MIMXRT1064CVL5A

NXP Semiconductors

The NXP MIMXRT1064CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105 °C, with supply voltage ranging from 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

10 mm

SoC

NT3H1201W0FHKH by NXP Semiconductors

NT3H1201W0FHKH

NXP Semiconductors

NT3H1201W0FHKH by NXP Semiconductors is an 8-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 95°C, with a supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring a compact chip carrier package style and surface mount compatibility.

S-PQCC-N8

1.6 mm

1

8

95 Cel

-40 Cel

PLASTIC/EPOXY

QCCN

SQUARE

CHIP CARRIER

260

.5 mm

3.6 V

1.7 V

YES

CMOS

INDUSTRIAL

NO LEAD

QUAD

1.6 mm

MICROPROCESSOR CIRCUIT

ATMXT224S-MAUR by Microchip Technology

ATMXT224S-MAUR

Microchip Technology

Microchip Technology's ATMXT224S-MAUR is a 56-terminal, CMOS technology capacitive touch screen controller with a supply voltage range of 1.71V to 3.47V. Operating b/w -40°C to 85°C, it is ideal for applications requiring precise touch input control in compact spaces due to its square shape and low seated height of 0.6mm.

S-XQCC-N56

6 mm

56

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC56,.24SQ,14

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

3.47 V

1.71 V

1.8 V

YES

CMOS

NO LEAD

.35 mm

QUAD

6 mm

CAPACITIVE TOUCH SCREEN CONTROLLERS

CC-WMX-J97C-TN by Digi International

CC-WMX-J97C-TN

Digi International

CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.

S-XBGA-N400

50 mm

400

70 Cel

-20 Cel

UNSPECIFIED

LGA

SQUARE

GRID ARRAY

YES

CMOS

OTHER

NO LEAD

2 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

CC-WMX-L87C-TE by Digi International

CC-WMX-L87C-TE

Digi International

CC-WMX-L87C-TE by Digi International is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 400 terminals in a SQUARE GRID ARRAY package style, suitable for INDUSTRIAL applications. Operating temperature ranges from -40 to 85°C, making it ideal for various embedded systems requiring high performance.

S-XBGA-N400

50 mm

400

85 Cel

-40 Cel

UNSPECIFIED

LGA

SQUARE

GRID ARRAY

YES

CMOS

INDUSTRIAL

NO LEAD

2 mm

BOTTOM

50 mm

MICROPROCESSOR CIRCUIT

ST33HTPH2028AAF3 by STMicroelectronics

ST33HTPH2028AAF3

STMicroelectronics

ST33HTPH2028AAF3 by STMicroelectronics is a cryptographic authenticator in a compact 28-terminal SOIC package. It operates b/w -40 °C to 105 °C, with a nominal voltage of 1.8V, making it ideal for industrial applications requiring secure authentication. Its thin profile and gull-wing terminals facilitate easy surface mounting.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

R-PDSO-G28

9.7 mm

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

1.8 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2032AAF3 by STMicroelectronics

ST33HTPH2032AAF3

STMicroelectronics

ST33HTPH2032AAF3 by STMicroelectronics is a 32-terminal IC with CMOS technology, operating from -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for industrial applications requiring secure data processing in compact spaces.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2E28AAF0 by STMicroelectronics

ST33HTPH2E28AAF0

STMicroelectronics

ST33HTPH2E28AAF0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It features a cryptographic authenticator for industrial applications. The small outline package has a thin profile and gull wing terminals, suitable for surface mount assembly at 0.65mm pitch.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

R-PDSO-G28

9.7 mm

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

1.8 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2E28AAF1 by STMicroelectronics

ST33HTPH2E28AAF1

STMicroelectronics

ST33HTPH2E28AAF1 by STMicroelectronics is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105°C, suitable for industrial applications. This small outline IC has 28 terminals, gull wing form, and a package size of 4.4x9.7 mm for surface mount assembly.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

R-PDSO-G28

9.7 mm

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

1.8 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2E32AAF0 by STMicroelectronics

ST33HTPH2E32AAF0

STMicroelectronics

ST33HTPH2E32AAF0 by STMicroelectronics is a cryptographic authenticator designed for industrial applications. It features a compact 5x5 mm size, operates b/w -40 °C to 105 °C, and runs on a nominal voltage of 1.8V. Ideal for secure device authentication in various electronic systems.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.8 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

5 mm

CRYPTOGRAPHIC AUTHENTICATOR