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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX233DAG4C by NXP Semiconductors

MCIMX233DAG4C

NXP Semiconductors

MCIMX233DAG4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -10 to 70 °C, with supply voltage range of 1-1.55 V. Ideal for applications requiring low profile, fine pitch ICs in commercial temperature grade environments.

S-PQFP-G128

e3

14 mm

3

128

70 Cel

-10 Cel

PLASTIC/EPOXY

LFQFP

QFP128,.63SQ,16

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

1.55 V

1 V

1.35 V

YES

CMOS

COMMERCIAL

TIN

GULL WING

.4 mm

QUAD

40

14 mm

SYSTEM ON CHIP

MIMX8DX2AVLFZAC by NXP Semiconductors

MIMX8DX2AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX2AVOFZAC by NXP Semiconductors

MIMX8DX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX5AVLFZAC by NXP Semiconductors

MIMX8DX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVLFZAC by NXP Semiconductors

MIMX8QX2AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX2AVLFZAC is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.05-1.15 V, making it ideal for automotive applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVOFZAC by NXP Semiconductors

MIMX8QX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVLFZAC by NXP Semiconductors

MIMX8QX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX5AVLFZAC by NXP Semiconductors

MIMX8QX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX1AVOFZAC by NXP Semiconductors

MIMX8DX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVOFZAC by NXP Semiconductors

MIMX8QX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX1AVLFZAC by NXP Semiconductors

MIMX8DX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

ST33HTPH2X32AHD4 by STMicroelectronics

ST33HTPH2X32AHD4

STMicroelectronics

ST33HTPH2X32AHD4 by STMicroelectronics is a 32-terminal cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105°C, has a low profile of 1mm, and requires a supply voltage of 1.8V. Ideal for secure authentication applications in compact electronic devices due to its small square chip carrier package style.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

S-XQCC-N32

5 mm

32

105 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

1 mm

1.8 V

YES

CMOS

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

5 mm

CRYPTOGRAPHIC AUTHENTICATOR

EFR32MG22C224F512GN32-C by Silicon Labs

EFR32MG22C224F512GN32-C

Silicon Labs

SYSTEM ON CHIP; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD;

e4

2

260

NICKEL PALLADIUM GOLD

40

SYSTEM ON CHIP

XAZU11EG-1FFVF1517Q by Xilinx

XAZU11EG-1FFVF1517Q

Xilinx

MICROPROCESSOR CIRCUIT; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 245; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;

e1

4

245

TIN SILVER COPPER

30

MICROPROCESSOR CIRCUIT

XAZU7EV-1FBVB900I by Xilinx

XAZU7EV-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

CAN, I2C, SPI, UART

0

S-PBGA-B900

e1

31 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

245

2.97 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XAZU11EG-1FFVF1517I by Xilinx

XAZU11EG-1FFVF1517I

Xilinx

MICROPROCESSOR CIRCUIT; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4; Maximum Time At Peak Reflow Temperature (s): 30;

e1

4

245

TIN SILVER COPPER

30

MICROPROCESSOR CIRCUIT

XAZU7EV-1FBVB900Q by Xilinx

XAZU7EV-1FBVB900Q

Xilinx

Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.

CAN, I2C, SPI, UART

0

S-PBGA-B900

e1

31 mm

4

900

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

245

2.97 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

AGFA006R16A3E3V by Intel

AGFA006R16A3E3V

Intel

AGFA006R16A3E3V by Intel is a rectangular-shaped SoC FPGA with 1546 terminals. It operates b/w 0°C to 100°C and is surface mountable. This IC is commonly used in various applications requiring other function uPs, uCs, and peripheral integration.

R-PBGA-B1546

1546

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGFA006R16A2E3V by Intel

AGFA006R16A2E3V

Intel

Intel AGFA006R16A2E3V is a SoC FPGA with 1546 terminals, operating from 0 to 100°C. It features plastic/epoxy body material, rectangular shape, and ball terminal form. Ideal for applications requiring high-performance computing in compact designs.

R-PBGA-B1546

1546

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

BM83SM1-00AB by Microchip Technology

BM83SM1-00AB

Microchip Technology

The Microchip Technology BM83SM1-00AB is a 50-terminal, surface-mount IC with a supply voltage range of 3.2V to 4.2V. It operates in temperatures from -40°C to 85°C and features a programmable RFSoC technology for various applications requiring a compact rectangular package style with gold over nickel terminal finish.

R-XXMA-N50

32 mm

1

50

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

2.5 mm

4.2 V

3.2 V

3.8 V

YES

CMOS

GOLD OVER NICKEL

NO LEAD

1 mm

UNSPECIFIED

15 mm

PROGRAMMABLE RFSoC

BM83SM1-00TA by Microchip Technology

BM83SM1-00TA

Microchip Technology

BM83SM1-00TA by Microchip Tech is a 50-terminal IC with max supply voltage of 4.2V and min of 3.2V. It operates b/w -40 to 85°C, ideal for PROGRAMMABLE RFSoC applications due to its CMOS technology and compact rectangular package style.

R-XXMA-N50

32 mm

1

50

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

2.5 mm

4.2 V

3.2 V

3.8 V

YES

CMOS

GOLD OVER NICKEL

NO LEAD

1 mm

UNSPECIFIED

15 mm

PROGRAMMABLE RFSoC

MIMXRT106ACVL5B by NXP Semiconductors

MIMXRT106ACVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT106ACVL5B is a low-profile, fine-pitch SoC with 196 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for applications requiring high-performance uPs and uCs in compact designs.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMXRT1062CVL5B by NXP Semiconductors

MIMXRT1062CVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1062CVL5B is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.15-1.26V. Ideal for applications requiring high-performance microcontrollers in compact designs.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

SE050D2HQ1/Z01PAZ by NXP Semiconductors

SE050D2HQ1/Z01PAZ

NXP Semiconductors

CRYPTOGRAPHIC AUTHENTICATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-PQCC-N20

e4

3 mm

1

20

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.12SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.33 mm

3.6 V

1.62 V

1.8 V

YES

CMOS

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.4 mm

QUAD

30

3 mm

CRYPTOGRAPHIC AUTHENTICATOR

CY8C4247AZS-M485 by Infineon Technologies

CY8C4247AZS-M485

Infineon Technologies

CY8C4247AZS-M485 by Infineon is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.71V to 1.89V. Ideal for applications requiring low-profile, fine-pitch ICs in automotive electronics meeting AEC-Q100 standards.

S-PQFP-G64

10 mm

3

64

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

AEC-Q100

1.6 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PROGRAMMABLE SoC

CY8C4246AZS-M443 by Infineon Technologies

CY8C4246AZS-M443

Infineon Technologies

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G48;

S-PQFP-G48

7 mm

3

48

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

AEC-Q100

1.6 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

7 mm

PROGRAMMABLE SoC

MIMX8MM5DVTLZCA by NXP Semiconductors

MIMX8MM5DVTLZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

Tin/Silver (Sn/Ag)

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5DVTLZDA by NXP Semiconductors

MIMX8MM5DVTLZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

Tin/Silver (Sn/Ag)

BALL

.5 mm

BOTTOM

40

14 mm

SoC

2751807 by Phoenix Contact

2751807

Phoenix Contact

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Minimum Supply Voltage: 4.5 V;

R-PQFP-G100

100

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

5.5 V

4.5 V

5 V

YES

CMOS

GULL WING

QUAD

MICROCONTROLLER

ATECC608B-TNGTLSS-G by Microchip Technology

ATECC608B-TNGTLSS-G

Microchip Technology

ATECC608B-TNGTLSS-G by Microchip: 5.5V max supply, 1MHz clock freq, cryptographic authenticator for industrial use. Small outline package with 8 terminals, operates from -40 to 85°C. Ideal for secure applications needing high-level authentication and encryption.

1 MHz

0

R-PDSO-G8

e4

4.9 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

1.75 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

3.9 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TFLXTLSS-PROTO by Microchip Technology

ATECC608B-TFLXTLSS-PROTO

Microchip Technology

ATECC608B-TFLXTLSS-PROTO by Microchip Tech is a cryptographic authenticator IC with 1MHz clock freq, 2-5.5V supply range, and -40 to 85°C temp range. Ideal for secure applications in industrial settings due to its compact size and dual-terminal design.

1 MHz

0

R-PDSO-G8

e4

4.9 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

SOP

SOP8,.23

RECTANGULAR

SMALL OUTLINE

1.75 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

3.9 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TNGTLSU-B by Microchip Technology

ATECC608B-TNGTLSU-B

Microchip Technology

ATECC608B-TNGTLSU-B by Microchip Technology is a cryptographic authenticator IC with a max supply voltage of 5.5V and operating temperature range of -40 to 85°C. It features a small outline package style, surface mount capability, and terminal finish in Ni/Pd/Au for secure applications requiring high reliability.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TFLXTLSU by Microchip Technology

ATECC608B-TFLXTLSU

Microchip Technology

Microchip ATECC608B-TFLXTLSU is a cryptographic authenticator IC with 8 terminals, operating from -40 to 85°C. It supports up to 1 MHz clock frequency and has a small outline package suitable for industrial applications. The IC features CMOS technology, dual terminal position, and nickel/palladium/gold finish.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TNGTLSU-C by Microchip Technology

ATECC608B-TNGTLSU-C

Microchip Technology

ATECC608B-TNGTLSU-C by Microchip operates at 2-5.5V, with a temp range of -40 to 85°C. It's a cryptographic authenticator IC in a small outline package suitable for industrial applications. Features include dual terminals, 1MHz clock frequency, and nickel/palladium/gold finish.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATECC608B-TNGTLSU-G by Microchip Technology

ATECC608B-TNGTLSU-G

Microchip Technology

Microchip ATECC608B-TNGTLSU-G is a cryptographic authenticator IC with 8 terminals, operating from -40 to 85°C. It supports up to 1 MHz clock frequency, ideal for secure applications in industrial settings due to its CMOS technology and Ni/Pd/Au terminal finish.

1 MHz

0

R-PDSO-N8

e4

3 mm

8

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.12,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.6 mm

5.5 V

2 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

DUAL

2 mm

CRYPTOGRAPHIC AUTHENTICATOR

MGM220PC22HNA2 by Silicon Labs

MGM220PC22HNA2

Silicon Labs

Silicon Labs' MGM220PC22HNA2 is a SoC with 31 terminals, operating at -40 to 105°C. It has a supply voltage range of 1.8-3.8V and compact dimensions of 12.9mm x 15mm, suitable for IoT applications requiring low power consumption and high reliability in surface-mount designs.

ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE

R-XXMA-N31

15 mm

3

31

105 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.4 mm

3.8 V

1.8 V

3 V

YES

CMOS

NO LEAD

1.2 mm

UNSPECIFIED

12.9 mm

SoC

LS1043ASE7MNLB by NXP Semiconductors

LS1043ASE7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN7MNLB by NXP Semiconductors

LS1043ASN7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8KNLB by NXP Semiconductors

LS1043ASN8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8KNLB by NXP Semiconductors

LS1043ASE8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8MNLB by NXP Semiconductors

LS1043ASE8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASN7KNLB by NXP Semiconductors

LS1043ASN7KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8MNLB by NXP Semiconductors

LS1043ASN8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

CY8C4147AZE-S275T by Infineon Technologies

CY8C4147AZE-S275T

Infineon Technologies

PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;

S-PQFP-G64

10 mm

64

125 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

AEC-Q100

1.6 mm

5.5 V

1.8 V

3.3 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PSoC

CY8C4147AZS-S255T by Infineon Technologies

CY8C4147AZS-S255T

Infineon Technologies

PSoC; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;

S-PQFP-G64

10 mm

3

64

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP64,.47SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

AEC-Q100

1.6 mm

5.5 V

1.8 V

3.3 V

YES

CMOS

GULL WING

.5 mm

QUAD

10 mm

PSoC

CY8C4147LQA-S443T by Infineon Technologies

CY8C4147LQA-S443T

Infineon Technologies

PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Equivalence Code: LCC40,.24SQ,20;

S-XQCC-N40

6 mm

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.6 mm

5.5 V

1.8 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

6 mm

PSoC

CY8C4147LQE-S273T by Infineon Technologies

CY8C4147LQE-S273T

Infineon Technologies

PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Supply Voltage: 5.5 V;

S-XQCC-N40

6 mm

40

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.6 mm

5.5 V

1.8 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

6 mm

PSoC

CY8C4147LQE-S473T by Infineon Technologies

CY8C4147LQE-S473T

Infineon Technologies

PSoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Screening Level: AEC-Q100;

S-XQCC-N40

6 mm

40

125 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.6 mm

5.5 V

1.8 V

3.3 V

YES

CMOS

NO LEAD

.5 mm

QUAD

6 mm

PSoC