Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.
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XCZU9CG-2FFVC900E
Xilinx
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B900
e1
31 mm
4
900
100 Cel
0 Cel
PLASTIC/EPOXY
BGA
RECTANGULAR
GRID ARRAY
245
3.42 mm
.876 V
.825 V
.85 V
YES
CMOS
OTHER
Tin/Silver/Copper (Sn/Ag/Cu)
BALL
1 mm
BOTTOM
30
MICROPROCESSOR CIRCUIT
XCZU9EG-2FFVB1156E
The Xilinx XCZU9EG-2FFVB1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance computing and signal processing capabilities.
R-PBGA-B1156
35 mm
1156
XCZU9EG-2FFVC900E
EFR32FG1P131F256GM48-C0R
Silicon Labs
EFR32FG1P131F256GM48-C0R by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.85-3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
S-XQCC-N48
7 mm
48
85 Cel
-40 Cel
UNSPECIFIED
HVQCCN
LCC48,.27SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.9 mm
3.8 V
1.85 V
3.3 V
NO LEAD
.5 mm
QUAD
SoC
EFR32FG1P131F256GM48-C0
SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N48;
EFR32FG1V131F256GM48-C0
EFR32FG1V131F256GM48-C0 by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.85-3.8 V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
MPXY8510DK016T1
NXP Semiconductors
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;
S-XQCC-N32
9 mm
32
125 Cel
HQCCN
CHIP CARRIER, HEAT SINK/SLUG
NOT SPECIFIED
2.3 mm
3.6 V
1.8 V
3 V
AUTOMOTIVE
.65 mm
MPXY8600DK6T1
LC898124EP2XC-MH
Onsemi
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 27; Package Code: VFBGA; Package Shape: RECTANGULAR;
R-PBGA-B27
3.89 mm
1
27
-30 Cel
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
260
.33 mm
2.6 V
2.8 V
TIN SILVER COPPER
.4 mm
1.3 mm
JN5169-001-M03-2
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 27; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
R-XXMA-N27
21 mm
MICROELECTRONIC ASSEMBLY
2 V
INDUSTRIAL
1.27 mm
16 mm
CC3220MODSM2MOBR
Texas Instruments
The Texas Instruments CC3220MODSM2MOBR is a CORTEX-M4 microprocessor with 256 RAM words and 1024000 ROM words. It features 4 ADC channels, 4 timers, and connectivity options like I2C, I2S, SD, SPI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
0
CORTEX-M4
NO
FIXED POINT
R-XBCC-B63
e4
20.5 mm
3
2
25
63
8
BCC
CHIP CARRIER
262144
256
1024000
FLASH
2.45 mm
2400 rpm
2.3 V
NICKEL GOLD
BUTT
17.5 mm
I2C, I2S, SD, SPI, UART
TIMER(4), WDT
4-Ch 12-Bit
MCIMX6Y2DVM09AA
MCIMX6Y2DVM09AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.375-1.5 V. This IC has 289 terminals in a GRID ARRAY package, suitable for various uP and uC applications.
S-PBGA-B289
14 mm
289
95 Cel
LFBGA
BGA289,17X17,32
GRID ARRAY, LOW PROFILE, FINE PITCH
1.32 mm
1.5 V
1.375 V
.8 mm
40
SYSTEM ON CHIP
MCIMX6Y7DVM09AA
SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
XAZU2EG-1SBVA484Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;
S-PBGA-B484
19 mm
484
FBGA
GRID ARRAY, FINE PITCH
250
2.61 mm
XAZU2EG-1SFVA625I
Xilinx XAZU2EG-1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with 0.85 V supply voltage. This IC has 625 terminals in a GRID ARRAY package style, suitable for industrial applications requiring fine pitch components.
S-PBGA-B625
625
3.43 mm
XAZU2EG-1SFVA625Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;
XAZU2EG-1SFVC784I
Xilinx XAZU2EG-1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C. The package style is GRID ARRAY, FINE PITCH, making it suitable for various applications requiring high performance and reliability.
S-PBGA-B784
23 mm
784
3.32 mm
XAZU2EG-1SFVC784Q
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XAZU2EG-L1SFVA625I
Xilinx XAZU2EG-L1SFVA625I is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 625 terminals in a GRID ARRAY, FINE PITCH package style. Operating from -40 to 100 °C, it's ideal for industrial applications requiring low power consumption at 0.72 V supply voltage.
.72 V
XAZU2EG-L1SFVC784I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
XAZU3EG-1SFVA625I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;
XAZU3EG-1SFVA625Q
XAZU3EG-1SFVC784I
XAZU3EG-1SFVC784Q
Xilinx XAZU3EG-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8 mm and nominal voltage of 0.85 V.
XAZU3EG-L1SFVA625I
XAZU3EG-L1SFVC784I
XAZU4EV-1SFVC784Q
Xilinx XAZU4EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125°C, suitable for AUTOMOTIVE applications. Featuring 784 terminals in a GRID ARRAY package style, it has a terminal pitch of 0.8mm and nominal voltage of 0.85V.
XAZU4EV-L1SFVC784I
XAZU5EV-1SFVC784I
XAZU5EV-1SFVC784Q
Xilinx XAZU5EV-1SFVC784Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, FINE PITCH with 784 terminals and measures 23x23 mm in size.
XAZU5EV-L1SFVC784I
Xilinx XAZU5EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This package features 784 terminals in a GRID ARRAY, FINE PITCH style, suitable for various uPs and uCs applications.
XC7Z007S-1CLG225C
XC7Z007S-1CLG225C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95V to 1.05V. This low profile chip in a grid array package is ideal for various applications requiring high performance and compact design.
S-PBGA-B225
13 mm
225
BGA225,15X15,32
1.5 mm
1.05 V
.95 V
1 V
XC7Z007S-1CLG225I
XC7Z007S-1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various embedded applications.
XC7Z007S-1CLG400C
The Xilinx XC7Z007S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch designs in the Other Function uPs,uCs & Peripheral ICs category.
S-PBGA-B400
17 mm
400
BGA400,20X20,32
1.6 mm
XC7Z007S-2CLG225E
The Xilinx XC7Z007S-2CLG225E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages.
XC7Z007S-2CLG225I
XC7Z007S-2CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 225 terminals in a low profile grid array package, it's ideal for various uPs and uCs applications.
XC7Z007S-2CLG400E
The Xilinx XC7Z007S-2CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components.
XC7Z007S-2CLG400I
The Xilinx XC7Z007S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low profile chip has 400 terminals and is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs.
XC7Z012S-1CLG485C
The Xilinx XC7Z012S-1CLG485C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities.
S-PBGA-B485
485
BGA485,22X22,32
XC7Z012S-1CLG485I
XC7Z012S-1CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.
XC7Z012S-2CLG485E
The Xilinx XC7Z012S-2CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 485 terminals in a low profile grid array package, it's ideal for embedded applications requiring high processing power in compact form factors.
XC7Z012S-2CLG485I
XC7Z012S-2CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a low profile grid array package, it's ideal for various embedded applications.
XC7Z014S-1CLG400C
The Xilinx XC7Z014S-1CLG400C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 400 terminals in a low profile grid array package, it's ideal for various embedded applications.
XC7Z014S-1CLG400I
XC7Z014S-1CLG400I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 400 terminals in a low profile, fine pitch grid array package, it's ideal for various applications requiring high-performance processing capabilities.
XC7Z014S-1CLG484C
XC7Z014S-1CLG484C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. This low profile chip in a square package is ideal for various applications requiring high performance and compact design.
BGA484,22X22,32
XC7Z014S-1CLG484I
XC7Z014S-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for applications requiring low profile and fine pitch components.
XC7Z014S-2CLG400E
The Xilinx XC7Z014S-2CLG400E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile and fine pitch grid array packages in Other Function uPs,uCs & Peripheral ICs category.
XC7Z014S-2CLG400I
The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.
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