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Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.

Other Function uPs,uCs & Peripheral ICs

Available Parts 2,371

Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
ADSP-SC589BBCZ-4B by Analog Devices

ADSP-SC589BBCZ-4B

Analog Devices

ADSP-SC589BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589KBCZ-4B by Analog Devices

ADSP-SC589KBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ATWILC1000B-MU-Y by Microchip Technology

ATWILC1000B-MU-Y

Microchip Technology

ATWILC1000B-MU-Y by Microchip Technology is a SoC peripheral IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 85 °C and has a nominal voltage of 1.1 V. Ideal for applications requiring low-profile, surface-mount solutions with CMOS technology.

S-XQCC-N40

5 mm

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC40,.2SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.1 V

YES

CMOS

MATTE TIN

NO LEAD

.4 mm

QUAD

5 mm

SoC

XCZU11EG-2FFVB1517E by Xilinx

XCZU11EG-2FFVB1517E

Xilinx

XCZU11EG-2FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in compact designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1156E by Xilinx

XCZU11EG-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1760E by Xilinx

XCZU11EG-2FFVC1760E

Xilinx

XCZU11EG-2FFVC1760E by Xilinx is a CMOS microprocessor circuit with 1760 terminals in a grid array package. Operating b/w 0-100°C, it has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and advanced processing capabilities.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVF1517E by Xilinx

XCZU11EG-2FFVF1517E

Xilinx

XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU15EG-2FFVB1156E by Xilinx

XCZU15EG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU15EG-2FFVC900E by Xilinx

XCZU15EG-2FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVC1760E by Xilinx

XCZU17EG-2FFVC1760E

Xilinx

XCZU17EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVD1760E by Xilinx

XCZU17EG-2FFVD1760E

Xilinx

XCZU17EG-2FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high processing power and advanced functionalities in compact designs.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVE1924E by Xilinx

XCZU17EG-2FFVE1924E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1924

e1

45 mm

4

1924

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVC1760E by Xilinx

XCZU19EG-2FFVC1760E

Xilinx

XCZU19EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact designs.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVD1760E by Xilinx

XCZU19EG-2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVE1924E by Xilinx

XCZU19EG-2FFVE1924E

Xilinx

XCZU19EG-2FFVE1924E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1924 terminals in a GRID ARRAY package style, with a max supply voltage of 0.876 V. Ideal for applications requiring high processing power and efficiency in environments up to 100°C.

R-PBGA-B1924

e1

45 mm

4

1924

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR CIRCUIT

XCZU2CG-2SBVA484E by Xilinx

XCZU2CG-2SBVA484E

Xilinx

XCZU2CG-2SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high performance and low power consumption in compact designs.

R-PBGA-B484

e1

19 mm

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

2.61 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XCZU2CG-2SFVC784E by Xilinx

XCZU2CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU2EG-2SFVC784E by Xilinx

XCZU2EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU3CG-2SFVC784E by Xilinx

XCZU3CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU3EG-2SBVA484E by Xilinx

XCZU3EG-2SBVA484E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B484

e1

19 mm

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

2.61 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

19 mm

PROGRAMMABLE SoC

XCZU3EG-2SFVA625E by Xilinx

XCZU3EG-2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B625

e1

21 mm

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

3.43 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

21 mm

MICROPROCESSOR CIRCUIT

XCZU3EG-2SFVC784E by Xilinx

XCZU3EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU4CG-2FBVB900E by Xilinx

XCZU4CG-2FBVB900E

Xilinx

XCZU4CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.88 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU4CG-2SFVC784E by Xilinx

XCZU4CG-2SFVC784E

Xilinx

XCZU4CG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with 0.85V supply voltage. Its 784-ball grid array package is ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU4EG-2FBVB900E by Xilinx

XCZU4EG-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.88 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU4EG-2SFVC784E by Xilinx

XCZU4EG-2SFVC784E

Xilinx

XCZU4EG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package with 784 terminals is ideal for applications requiring high-performance computing in compact spaces.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU4EV-2FBVB900E by Xilinx

XCZU4EV-2FBVB900E

Xilinx

XCZU4EV-2FBVB900E by Xilinx is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.88 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU4EV-2SFVC784E by Xilinx

XCZU4EV-2SFVC784E

Xilinx

XCZU4EV-2SFVC784E by Xilinx is a rectangular, surface mount microprocessor circuit with 784 terminals. It operates on a supply voltage range of 0.825 V to 0.876 V and has a max operating temperature of 100°C. This IC is commonly used in various applications requiring high-performance computing and advanced processing capabilities.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU5CG-2FBVB900E by Xilinx

XCZU5CG-2FBVB900E

Xilinx

XCZU5CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.88 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU5CG-2SFVC784E by Xilinx

XCZU5CG-2SFVC784E

Xilinx

XCZU5CG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 784 terminals in a GRID ARRAY, FINE PITCH package style. Operating b/w 0-100°C, it has a nominal voltage of 0.85V and terminal pitch of 0.8mm, suitable for various embedded applications.

S-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

3.32 mm

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU5EG-2FBVB900E by Xilinx

XCZU5EG-2FBVB900E

Xilinx

XCZU5EG-2FBVB900E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package IC is ideal for various applications requiring high performance and flexibility in a compact form factor.

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

RECTANGULAR

GRID ARRAY

245

2.88 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

31 mm

PROGRAMMABLE SoC

XCZU5EG-2SFVC784E by Xilinx

XCZU5EG-2SFVC784E

Xilinx

XCZU5EG-2SFVC784E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance computing and programmable logic solutions.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA784,28X28,32

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

PROGRAMMABLE SoC

XCZU5EV-2FBVB900E by Xilinx

XCZU5EV-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.88 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU5EV-2SFVC784E by Xilinx

XCZU5EV-2SFVC784E

Xilinx

XCZU5EV-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. With 784 terminals in a GRID ARRAY package, it's ideal for high-performance computing applications.

R-PBGA-B784

e1

23 mm

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

3.32 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR CIRCUIT

XCZU6CG-2FFVB1156E by Xilinx

XCZU6CG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU6CG-2FFVC900E by Xilinx

XCZU6CG-2FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU6EG-2FFVB1156E by Xilinx

XCZU6EG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU6EG-2FFVC900E by Xilinx

XCZU6EG-2FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU7CG-2FBVB900E by Xilinx

XCZU7CG-2FBVB900E

Xilinx

XCZU7CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.97 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU7CG-2FFVC1156E by Xilinx

XCZU7CG-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU7CG-2FFVF1517E by Xilinx

XCZU7CG-2FFVF1517E

Xilinx

XCZU7CG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in surface mount designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU7EG-2FBVB900E by Xilinx

XCZU7EG-2FBVB900E

Xilinx

XCZU7EG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, with dimensions of 31mm x 31mm. Operating b/w 0 to 100 °C, it has a supply voltage range of 0.825V to 0.876V making it ideal for high-performance computing applications.

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.97 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU7EG-2FFVC1156E by Xilinx

XCZU7EG-2FFVC1156E

Xilinx

The Xilinx XCZU7EG-2FFVC1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance processing capabilities in compact form factors.

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU7EG-2FFVF1517E by Xilinx

XCZU7EG-2FFVF1517E

Xilinx

The Xilinx XCZU7EG-2FFVF1517E is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, with a rectangular shape and PLASTIC/EPOXY body material. Operating b/w 0 to 100 °C, it's ideal for applications requiring high performance and low power consumption.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU7EV-2FBVB900E by Xilinx

XCZU7EV-2FBVB900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

2.97 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU7EV-2FFVC1156E by Xilinx

XCZU7EV-2FFVC1156E

Xilinx

XCZU7EV-2FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high performance and reliability in compact designs.

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU7EV-2FFVF1517E by Xilinx

XCZU7EV-2FFVF1517E

Xilinx

XCZU7EV-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU9CG-2FFVB1156E by Xilinx

XCZU9CG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT