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COMMERCIAL Other Function uPs,uCs & Peripheral ICs 75

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XOMAPL137AZKB3 by Texas Instruments

XOMAPL137AZKB3

Texas Instruments

XOMAPL137AZKB3 by Texas Instruments is a 256-terminal IC with power supplies of 1.2V, 1.8/3.3V, operating b/w 0-70°C. It features a square package shape made of plastic/epoxy material and is surface mountable. Ideal for commercial applications requiring high-performance microcontrollers and peripheral functions in a compact grid array package style.

S-PBGA-B256

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.2,1.8/3.3

Not Qualified

Other Microprocessor ICs

YES

COMMERCIAL

BALL

1 mm

BOTTOM

MF0UL1101DUD,005 by NXP Semiconductors

MF0UL1101DUD,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -20 Cel; Package Equivalence Code: DIE OR CHIP;

70 Cel

-20 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

COMMERCIAL

MICROPROCESSOR CIRCUIT

MF0UL1101DUF,005 by NXP Semiconductors

MF0UL1101DUF,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Maximum Operating Temperature: 70 Cel;

70 Cel

-20 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

COMMERCIAL

MICROPROCESSOR CIRCUIT

MF0UL2101DUD,005 by NXP Semiconductors

MF0UL2101DUD,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Qualification: Not Qualified;

70 Cel

-20 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

COMMERCIAL

MICROPROCESSOR CIRCUIT

MF0UL2101DUF,005 by NXP Semiconductors

MF0UL2101DUF,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -20 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 70 Cel;

70 Cel

-20 Cel

DIE OR CHIP

Not Qualified

Other Microprocessor ICs

COMMERCIAL

MICROPROCESSOR CIRCUIT

R3910-CFAB-E1B by Onsemi

R3910-CFAB-E1B

Onsemi

R3910-CFAB-E1B by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in rectangular package style is ideal for various microelectronic assemblies.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

R3910-CFAB-E1T by Onsemi

R3910-CFAB-E1T

Onsemi

R3910-CFAB-E1T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40°C. It has a supply voltage of 1.25V and can withstand peak reflow temperature of 260°C for up to 30 seconds. Ideal for commercial applications requiring compact surface-mount peripheral ICs.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

3

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

30

3.81 mm

MICROPROCESSOR CIRCUIT

SA3291A-E1-T by Onsemi

SA3291A-E1-T

Onsemi

SA3291A-E1-T by Onsemi is a CMOS microprocessor circuit with 32 terminals. It operates b/w 0-40 °C, ideal for commercial applications. With a nominal voltage of 1.25V, it's suitable for various uPs and uCs functions in surface mount assemblies.

SEATED HGT-NOM

R-XXMA-N32

6.35 mm

32

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.777 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.68 mm

MICROPROCESSOR CIRCUIT

SB3229-E1-T by Onsemi

SB3229-E1-T

Onsemi

SB3229-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating from 0 to 40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in rectangular package style is ideal for various uPs and uCs functions.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

SB3229-E1 by Onsemi

SB3229-E1

Onsemi

Onsemi's SB3229-E1 is a CMOS microprocessor circuit with 25 terminals, operating b/w 0-40 °C. It has a nominal voltage of 1.25V and is designed for commercial applications requiring a compact MICROELECTRONIC ASSEMBLY package style.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

SB3231-E1-T by Onsemi

SB3231-E1-T

Onsemi

SB3231-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals, operating from 0 to 40 °C. It has a nominal voltage of 1.25V and is designed for commercial temperature grade applications. This surface-mount IC in a rectangular package is ideal for various microelectronic assemblies.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

SB3231-E1 by Onsemi

SB3231-E1

Onsemi

SB3231-E1 by Onsemi is a CMOS microprocessor circuit with 25 terminals. It operates b/w 0-40 °C, ideal for commercial applications. This rectangular surface-mount IC has a nominal voltage of 1.25V, suitable for various microelectronic assemblies.

SEATED HGT-NOM

R-XXMA-N25

5.59 mm

25

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.525 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.81 mm

MICROPROCESSOR CIRCUIT

SA3229-E1-T by Onsemi

SA3229-E1-T

Onsemi

SA3229-E1-T by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. Operating temperature range of 0-40°C makes it suitable for commercial applications. With a nominal voltage of 1.25V, it's ideal for various uPs and uCs functions requiring surface mount technology.

R-PBCC-B25

5.59 mm

25

40 Cel

0 Cel

PLASTIC/EPOXY

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

1.781 mm

1.25 V

YES

CMOS

COMMERCIAL

BUTT

BOTTOM

NOT SPECIFIED

3.18 mm

MICROPROCESSOR CIRCUIT

SA3229-E1 by Onsemi

SA3229-E1

Onsemi

SA3229-E1 by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. It operates b/w 0-40 °C, suitable for commercial applications. With a nominal voltage of 1.25V, it's ideal for various uPs and uCs functions requiring surface mount technology.

R-PBCC-B25

5.59 mm

25

40 Cel

0 Cel

PLASTIC/EPOXY

BCC

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

1.781 mm

1.25 V

YES

CMOS

COMMERCIAL

BUTT

BOTTOM

NOT SPECIFIED

3.18 mm

MICROPROCESSOR CIRCUIT

RF430FRL154HCRGER by Texas Instruments

RF430FRL154HCRGER

Texas Instruments

RF430FRL154HCRGER by Texas Instruments is a MICROPROCESSOR CIRCUIT with I2C and SPI compatibility. It features 24 terminals in a CHIP CARRIER package style, suitable for commercial applications with an operating temperature range of 0 to 70°C. This CMOS technology device has a very thin profile and is surface mountable.

IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE

I2C; SPI

0

S-PQCC-N24

e4

4 mm

2

24

70 Cel

0 Cel

PLASTIC/EPOXY

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

260

1 mm

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

MICROPROCESSOR CIRCUIT

SA3291A-E1 by Onsemi

SA3291A-E1

Onsemi

SA3291A-E1 by Onsemi is a CMOS microprocessor circuit with 32 terminals. Operating temp range: 0-40 °C, supply voltage: 1.25V. Ideal for commercial applications requiring compact surface-mount microelectronic assemblies.

SEATED HGT-NOM

R-XXMA-N32

6.35 mm

32

40 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.777 mm

1.25 V

YES

CMOS

COMMERCIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

3.68 mm

MICROPROCESSOR CIRCUIT

9LPRS511EGLFT by Integrated Device Technology

9LPRS511EGLFT

Integrated Device Technology

9LPRS511EGLFT by Integrated Device Technology is a 64-terminal microprocessor circuit with CMOS technology. Operating at 3.3V, it has a temp range of 0-70°C and peak reflow temp of 260°C. Ideal for applications requiring small outline, thin profile ICs in commercial-grade environments.

R-PDSO-G64

e3

1

64

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP64,.32,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3.3

Not Qualified

Clock Generators

3.3 V

YES

CMOS

COMMERCIAL

TIN

GULL WING

.5 mm

DUAL

MICROPROCESSOR CIRCUIT

MXD1210C/D by Maxim Integrated

MXD1210C/D

Maxim Integrated

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR;

R-XUUC-N8

e0

1

8

70 Cel

0 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

Not Qualified

.5 mA

5.5 V

4.5 V

5 V

YES

CMOS

COMMERCIAL

TIN LEAD

NO LEAD

UPPER

MICROPROCESSOR CIRCUIT

MXD1210CPA by Maxim Integrated

MXD1210CPA

Maxim Integrated

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

R-PDIP-T8

e0

9.375 mm

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

Not Qualified

4.572 mm

.5 mA

5.5 V

4.5 V

5 V

NO

CMOS

COMMERCIAL

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

MICROPROCESSOR CIRCUIT

MXD1210CWE by Maxim Integrated

MXD1210CWE

Maxim Integrated

MXD1210CWE by Maxim Integrated is a CMOS microprocessor circuit with 16 terminals. It operates b/w 0-70°C, with supply voltage range of 4.5-5.5V. Ideal for applications requiring small outline surface mount packages in commercial temperature grade environments.

R-PDSO-G16

e0

9.9 mm

1

16

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

.5 mA

5.5 V

4.5 V

5 V

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MICROPROCESSOR CIRCUIT

MXD1210CSA by Maxim Integrated

MXD1210CSA

Maxim Integrated

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

.5 mA

5.5 V

4.5 V

5 V

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MICROPROCESSOR CIRCUIT

SN74ACT8997DWR by Texas Instruments

SN74ACT8997DWR

Texas Instruments

SN74ACT8997DWR by Texas Instruments is a CMOS microprocessor circuit with 28 terminals, operating at 5V. It has a package style of small outline and can handle supply voltages from 4.5V to 5.5V. This IC is ideal for applications requiring high-speed data processing in commercial temperature environments.

0

R-PDSO-G28

e4

17.9 mm

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

260

5

Not Qualified

2.65 mm

Other Microprocessor ICs

100 mA

5.5 V

4.5 V

5 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

7.5 mm

MICROPROCESSOR CIRCUIT

SN74ACT8997DW by Texas Instruments

SN74ACT8997DW

Texas Instruments

SN74ACT8997DW by Texas Instruments is a CMOS microprocessor circuit with 28 terminals, operating at 5V and supporting a supply current of up to 100mA. It has a temperature range of 0-70°C, making it suitable for commercial applications requiring high-speed processing in compact designs. This small outline package with gull wing terminals is ideal for surface mount assembly in various electronic devices.

0

R-PDSO-G28

e4

17.9 mm

1

28

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

SMALL OUTLINE

260

5

Not Qualified

2.65 mm

Other Microprocessor ICs

100 mA

5.5 V

4.5 V

5 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

7.5 mm

MICROPROCESSOR CIRCUIT

TL16PNP100AFN by Texas Instruments

TL16PNP100AFN

Texas Instruments

TL16PNP100AFN by Texas Instruments is a 44-terminal CMOS microprocessor circuit with a supply voltage range of 4.75V to 5.25V, ideal for commercial applications. It features a square chip carrier package style, J bend terminal form, and operates b/w 0°C to 70°C temperature range.

S-PQCC-J44

16.585 mm

44

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

NOT SPECIFIED

5

Not Qualified

4.57 mm

Bus Controllers

.7 mA

5.25 V

4.75 V

5 V

YES

CMOS

COMMERCIAL

J BEND

1.27 mm

QUAD

NOT SPECIFIED

16.585 mm

MICROPROCESSOR CIRCUIT

TL16PNP100APT by Texas Instruments

TL16PNP100APT

Texas Instruments

TL16PNP100APT by Texas Instruments is a 48-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-70 °C, with supply voltage of 4.75-5.25 V. Ideal for applications requiring low profile, fine pitch FLATPACK package style.

S-PQFP-G48

7 mm

48

70 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

NOT SPECIFIED

5

Not Qualified

1.6 mm

Bus Controllers

.7 mA

5.25 V

4.75 V

5 V

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

7 mm

MICROPROCESSOR CIRCUIT

AD892TJP by Analog Devices

AD892TJP

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

ALSO REQUIRES 12V SUPPLY

S-PQCC-J44

e0

16.5862 mm

44

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

Not Qualified

4.57 mm

5 V

YES

CMOS

COMMERCIAL

TIN LEAD

J BEND

1.27 mm

QUAD

16.5862 mm

MICROPROCESSOR CIRCUIT

TI380FPAAFNL by Texas Instruments

TI380FPAAFNL

Texas Instruments

TI380FPAAFNL by Texas Instruments is a 52-terminal microprocessor circuit with CMOS technology. It operates b/w 0-70°C, with supply voltage range of 4.75-5.25V. Ideal for applications requiring high-performance peripheral ICs in commercial-grade environments.

S-PQCC-J52

19.13 mm

52

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

4.57 mm

5.25 V

4.75 V

5 V

YES

CMOS

COMMERCIAL

J BEND

1.27 mm

QUAD

19.13 mm

MICROPROCESSOR CIRCUIT

SN75LVDS88BRDD by Texas Instruments

SN75LVDS88BRDD

Texas Instruments

SN75LVDS88BRDD by Texas Instruments is a CMOS peripheral IC with 100 terminals. It operates b/w 0-70°C, with supply voltage range of 3-3.6V. Ideal for microprocessor circuits, it comes in a square package style suitable for surface mount applications.

S-PQFP-G100

14 mm

100

70 Cel

0 Cel

PLASTIC/EPOXY

HVFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1 mm

3.6 V

3 V

3.3 V

YES

CMOS

COMMERCIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

14 mm

MICROPROCESSOR CIRCUIT

PSD854F2V-90M by STMicroelectronics

PSD854F2V-90M

STMicroelectronics

PSD854F2V-90M by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 52 terminals in a flatpack package. It operates b/w 0 °C and 70°C, offering an impressive max access time of just 90 ns. Ideal for embedded applications requiring efficient data storage and retrieval.

.00000009 ns

S-PQFP-G52

e4

52

70 Cel

0 Cel

PLASTIC/EPOXY

QFP

QFP52,.52SQ

SQUARE

FLATPACK

3.3

Not Qualified

2359296 Bits

.0001 Amp

Other uPs/uCs/Peripheral ICs

3.3 V

YES

CMOS

COMMERCIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

.635 mm

QUAD

N

PSD854F2V-90J by STMicroelectronics

PSD854F2V-90J

STMicroelectronics

PSD854F2V-90J by STMicroelectronics is a CMOS IC with a 3.3V supply, featuring 52 terminals in a square chip carrier package. It operates b/w 0 °C and 70°C, with an impressive access time of just 90 ns. Ideal for various embedded applications requiring efficient data storage.

.00000009 ns

S-PQCC-J52

e3

52

70 Cel

0 Cel

PLASTIC/EPOXY

QCCJ

LDCC52,.8SQ

SQUARE

CHIP CARRIER

3.3

Not Qualified

2359296 Bits

.0001 Amp

Other uPs/uCs/Peripheral ICs

3.3 V

YES

CMOS

COMMERCIAL

Matte Tin (Sn)

J BEND

1.27 mm

QUAD

N

LH79520N0M000B1 by NXP Semiconductors

LH79520N0M000B1

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: QFP; Package Shape: SQUARE;

S-PQFP-G176

176

70 Cel

0 Cel

PLASTIC/EPOXY

QFP

QFP176,.87SQ,16

SQUARE

FLATPACK

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

GULL WING

.4 mm

QUAD

LH7A400N0E000B3A by NXP Semiconductors

LH7A400N0E000B3A

NXP Semiconductors

NXP Semiconductors' LH7A400N0E000B3A is a ceramic package IC with 256 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications requiring fine pitch grid array style packaging in commercial-grade environments.

S-XBGA-B256

256

70 Cel

0 Cel

CERAMIC

FBGA

BGA256,16X16,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

LH7A404N0E000B0A by NXP Semiconductors

LH7A404N0E000B0A

NXP Semiconductors

Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE;

S-XBGA-B324

324

70 Cel

0 Cel

CERAMIC

FBGA

BGA324,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

1.8,3.3

Not Qualified

Other uPs/uCs/Peripheral ICs

YES

COMMERCIAL

BALL

.8 mm

BOTTOM

PCA9504ADGG,112 by NXP Semiconductors

PCA9504ADGG,112

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G56

e4

14 mm

1

56

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

DUAL

6.1 mm

MICROPROCESSOR CIRCUIT

PCA9504ADGG,118 by NXP Semiconductors

PCA9504ADGG,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR;

R-PDSO-G56

e4

14 mm

1

56

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Not Qualified

1.2 mm

3.6 V

3 V

3.3 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

.5 mm

DUAL

6.1 mm

MICROPROCESSOR CIRCUIT

FT245BM by FTDI

FT245BM

FTDI

FT245BM by FTDI is a 32-terminal peripheral IC with supply voltage range of 4.35V to 5.25V, operating temperature from 0°C to 70°C. It features GULL WING terminals, CMOS technology, and is ideal for MICROPROCESSOR CIRCUIT applications requiring low profile FLATPACK packaging.

S-PQFP-G32

e0

7 mm

3

32

70 Cel

0 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

250

Not Qualified

1.6 mm

5.25 V

4.35 V

5 V

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

.8 mm

QUAD

7 mm

MICROPROCESSOR CIRCUIT

R3920-CFAB-E1T by Onsemi

R3920-CFAB-E1T

Onsemi

R3920-CFAB-E1T by Onsemi is a CMOS microprocessor circuit with 25 terminals in a rectangular chip carrier package. It operates at temperatures from 0 to 40°C, with a clock frequency of up to 4.218 MHz. Ideal for applications requiring low power consumption and fixed-point processing in commercial-grade environments.

NO

4.218 MHz

FIXED POINT

NO

R-PBCC-B25

5.59 mm

25

40 Cel

0 Cel

PLASTIC/EPOXY

BCC

LGA25,3X8,27

RECTANGULAR

CHIP CARRIER

NOT SPECIFIED

1.781 mm

1.25 V

YES

CMOS

COMMERCIAL

BUTT

.686 mm

BOTTOM

NOT SPECIFIED

3.18 mm

MICROPROCESSOR CIRCUIT

TIR1000PWRG4 by Texas Instruments

TIR1000PWRG4

Texas Instruments

TIR1000PWRG4 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 3/5V power supplies, suitable for UART bus compatibility. It operates b/w 0-70°C, has a small outline package style, and features dual terminal position. Ideal for applications requiring low power consumption and compact design.

CAN ALSO OPERATE AT 5V SUPPLY

UART

R-PDSO-G8

e4

4.4 mm

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3/5

Not Qualified

1.2 mm

Serial IO/Communication Controllers

3.3 V

2.7 V

3 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

3 mm

MICROPROCESSOR CIRCUIT

MXD1210CSA-T by Maxim Integrated

MXD1210CSA-T

Maxim Integrated

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

R-PDSO-G8

e0

4.9 mm

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

Not Qualified

1.75 mm

.5 mA

5.5 V

4.5 V

5 V

YES

CMOS

COMMERCIAL

TIN LEAD

GULL WING

1.27 mm

DUAL

3.9 mm

MICROPROCESSOR CIRCUIT

TIR1000PSRG4 by Texas Instruments

TIR1000PSRG4

Texas Instruments

TIR1000PSRG4 by Texas Instruments is a CMOS microprocessor circuit with 8 terminals, operating b/w 0-70°C. It has a supply voltage range of 2.7-3.3V and is surface mountable in a small outline package style. Ideal for commercial applications requiring compact and efficient processing capabilities.

CAN ALSO OPERATE AT 5V SUPPLY

R-PDSO-G8

e4

6.2 mm

1

8

70 Cel

0 Cel

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

260

Not Qualified

2 mm

3.3 V

2.7 V

3 V

YES

CMOS

COMMERCIAL

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

30

5.3 mm

MICROPROCESSOR CIRCUIT

DS2413P by Maxim Integrated

DS2413P

Maxim Integrated

DS2413P by Maxim Integrated is a small outline peripheral IC with 6 terminals, operating at 0-70°C. It has a supply voltage range of 2.8-5.25V and uses CMOS technology for microprocessor circuits. Ideal for applications requiring dual terminal position and surface mount packaging in commercial temperature grades.

R-PDSO-C6

e0

3.94 mm

1

6

70 Cel

0 Cel

PLASTIC/EPOXY

SOC

RECTANGULAR

SMALL OUTLINE

245

Not Qualified

1.5 mm

5.25 V

2.8 V

3.3 V

YES

CMOS

COMMERCIAL

TIN LEAD

C BEND

1.27 mm

DUAL

3.76 mm

MICROPROCESSOR CIRCUIT

66AK2G12ABY100 by Texas Instruments

66AK2G12ABY100

Texas Instruments

The Texas Instruments 66AK2G12ABY100 is a System on Chip with CMOS technology. It operates b/w 0-70°C, with supply voltage range of 0.95-1.05V. With 625 terminals in a low profile grid array package, it's ideal for various commercial applications requiring high performance and integration capabilities.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

66AK2G12ABY60 by Texas Instruments

66AK2G12ABY60

Texas Instruments

The Texas Instruments 66AK2G12ABY60 is a System on Chip with CMOS technology. It operates b/w 0-70°C, has a supply voltage range of 0.855-0.945V, and features a grid array package with 625 terminals. Ideal for applications requiring low profile, fine pitch ICs in commercial-grade environments.

S-PBGA-B625

e1

21 mm

3

625

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

.945 V

.855 V

.9 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

MCIMX280DVM4C by NXP Semiconductors

MCIMX280DVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283DVM4C by NXP Semiconductors

MCIMX283DVM4C

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4C by NXP Semiconductors

MCIMX286DVM4C

NXP Semiconductors

MCIMX286DVM4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35V to 1.55V. This low-profile, fine-pitch IC with 289 terminals is ideal for various applications requiring high performance in a compact form factor.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

ATTPM20P-G3MA1-10-B by Microchip Technology

ATTPM20P-G3MA1-10-B

Microchip Technology

Microchip Technology's ATTPM20P-G3MA1-10-B is a CMOS microprocessor circuit with 8 terminals, operating b/w 0-70 °C. It supports SPI bus compatibility, with supply voltage ranging from 1.8V to 3.3V. Ideal for applications requiring small outline and thin profile packages in commercial temperature grade environments.

SPI

R-PDSO-N8

3 mm

8

70 Cel

0 Cel

PLASTIC/EPOXY

HVSON

SOLCC8,.11,20

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

TS 16949

.6 mm

3.3 V

1.8 V

YES

CMOS

COMMERCIAL

NO LEAD

.5 mm

DUAL

2 mm

MICROPROCESSOR CIRCUIT

DLPC6401ZFF by Texas Instruments

DLPC6401ZFF

Texas Instruments

DLPC6401ZFF by Texas Instruments is a CMOS microprocessor circuit with 419 terminals in a square grid array package. It operates b/w 0-55°C, with supply voltage range of 1.116-1.26V. Ideal for applications requiring high-performance processing in commercial-grade environments.

S-PBGA-B419

23 mm

419

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.36 mm

1.26 V

1.116 V

1.2 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT