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COMMERCIAL Other Function uPs,uCs & Peripheral ICs 75

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
CC3200MODR1M2AMOBT by Texas Instruments

CC3200MODR1M2AMOBT

Texas Instruments

CC3200MODR1M2AMOBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 4-Ch 12-Bit ADC Channels. It operates at -20 to 70 °C and supports I2C, SPI, UART Bus Compatibility. Ideal for IoT applications due to its compact CHIP CARRIER package and low power consumption at 3.6V max supply voltage.

YES

I2C; SPI; UART

NO

NO

0

R-XBCC-B63

e4

20.5 mm

3

25

63

70 Cel

-20 Cel

NO

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

260

2.45 mm

3.6 V

2.3 V

3.3 V

YES

CMOS

COMMERCIAL

NICKEL GOLD

BUTT

1.27 mm

BOTTOM

30

17.5 mm

MICROPROCESSOR CIRCUIT

0

4-Ch 12-Bit

DLPC900ZPC by Texas Instruments

DLPC900ZPC

Texas Instruments

DLPC900ZPC by Texas Instruments is a 516-terminal microprocessor circuit with CMOS technology. It operates b/w 0-55°C, supports I2C, SPI, UART, and USB buses, and has a clock frequency of up to 20 MHz. Ideal for applications requiring a low-voltage supply and high data bus width in a compact grid array package.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

X430FRL152HCRGER by Texas Instruments

X430FRL152HCRGER

Texas Instruments

X430FRL152HCRGER by Texas Instruments is a CMOS microprocessor circuit with 24 terminals in a square chip carrier package. It operates b/w 0 to 70 °C and has a supply voltage range of 1.45V to 1.65V, making it suitable for various commercial applications requiring low power consumption and compact design.

S-PQCC-N24

4 mm

24

70 Cel

0 Cel

PLASTIC/EPOXY

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1 mm

1.65 V

1.45 V

1.5 V

YES

CMOS

COMMERCIAL

NO LEAD

.5 mm

QUAD

4 mm

MICROPROCESSOR CIRCUIT

MCIMX6G0DVM05AA by NXP Semiconductors

MCIMX6G0DVM05AA

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY

260

1.32 mm

1.3 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

6AV2181-8XP00-0AX0 by Siemens

6AV2181-8XP00-0AX0

Siemens

Siemens 6AV2181-8XP00-0AX0 is a surface mount rectangular chip with CMOS technology. It operates at temperatures ranging from 0 to 50°C and has a nominal voltage of 3.3V. This microprocessor circuit is commonly used in commercial applications requiring other function uPs, uCs, and peripheral ICs.

R-XUUC-N

50 Cel

0 Cel

UNSPECIFIED

DIE

RECTANGULAR

UNCASED CHIP

NOT SPECIFIED

3.3 V

YES

CMOS

COMMERCIAL

NO LEAD

UPPER

NOT SPECIFIED

MICROPROCESSOR CIRCUIT

FT245BL-REEL by FTDI

FT245BL-REEL

FTDI

FT245BL-REEL by FTDI is a 32-terminal peripheral IC with a supply voltage range of 4.35V to 5.25V, operating temperature of 0-70°C, and peak reflow temp of 260°C. Ideal for microprocessor circuits, it features CMOS technology and Gull Wing terminal form in a low-profile flatpack package style.

S-PQFP-G32

e3

7 mm

3

32

70 Cel

0 Cel

PLASTIC/EPOXY

LQFP

SQUARE

FLATPACK, LOW PROFILE

260

1.6 mm

5.25 V

4.35 V

5 V

YES

CMOS

COMMERCIAL

MATTE TIN

GULL WING

.8 mm

QUAD

30

7 mm

MICROPROCESSOR CIRCUIT

ADSP-21583KBCZ-4A by Analog Devices

ADSP-21583KBCZ-4A

Analog Devices

ADSP-21583KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals in a GRID ARRAY package. It operates at up to 500 MHz, with supply voltage range of 1.05V to 1.15V. Ideal for SPI and UART bus applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-4A by Analog Devices

ADSP-21584KBCZ-4A

Analog Devices

ADSP-21584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582KBCZ-4A by Analog Devices

ADSP-SC582KBCZ-4A

Analog Devices

ADSP-SC582KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C with a supply voltage range of 1.05V to 1.15V, making it ideal for commercial applications requiring high-speed processing in a compact GRID ARRAY package.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-3A by Analog Devices

ADSP-SC583KBCZ-3A

Analog Devices

ADSP-SC583KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. The package style is GRID ARRAY, LOW PROFILE, FINE PITCH, making it ideal for compact electronic applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-4A by Analog Devices

ADSP-SC583KBCZ-4A

Analog Devices

ADSP-SC583KBCZ-4A by Analog Devices is a 500 MHz microprocessor circuit with SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. Ideal for applications requiring low profile, fine pitch grid array packages in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-3A by Analog Devices

ADSP-SC584KBCZ-3A

Analog Devices

ADSP-SC584KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features 349 terminals in a SQUARE shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-4A by Analog Devices

ADSP-SC584KBCZ-4A

Analog Devices

ADSP-SC584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC is ideal for commercial applications requiring high-speed processing in a compact form factor.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587KBCZ-4B by Analog Devices

ADSP-SC587KBCZ-4B

Analog Devices

ADSP-SC587KBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates b/w 0 to 70 °C and has SPI and UART bus compatibility. This low profile, fine pitch IC with 349 terminals is ideal for commercial applications requiring high-speed processing.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589KBCZ-4B by Analog Devices

ADSP-SC589KBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

MCIMX283DVM4BR2 by NXP Semiconductors

MCIMX283DVM4BR2

NXP Semiconductors

MCIMX283DVM4BR2 by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C, with supply voltage range of 1.35-1.55 V. Ideal for applications requiring low profile and fine pitch grid array packages.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

SIP007AFS001 by Samsung

SIP007AFS001

Samsung

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 271; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;

R-XXMA-X271

49 mm

271

70 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.45 mm

5 V

3.7 V

4.2 V

NO

CMOS

COMMERCIAL

UNSPECIFIED

1.13 mm

UNSPECIFIED

36 mm

MICROPROCESSOR CIRCUIT

MCIMX280DVM4CR by NXP Semiconductors

MCIMX280DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX283DVM4CR2 by NXP Semiconductors

MCIMX283DVM4CR2

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

MCIMX286DVM4CR by NXP Semiconductors

MCIMX286DVM4CR

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

DLPC900AZPC by Texas Instruments

DLPC900AZPC

Texas Instruments

DLPC900AZPC by Texas Instruments is a MICROPROCESSOR CIRCUIT with 516 terminals, operating at a max clock frequency of 20 MHz. It is used in applications requiring I2C, SPI, UART, and USB bus compatibility.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

MCIMX286DVM4BR by NXP Semiconductors

MCIMX286DVM4BR

NXP Semiconductors

MCIMX286DVM4BR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35-1.55 V, making it ideal for low-power applications in various electronic devices.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

ADSP-21584KBCZ-5A by Analog Devices

ADSP-21584KBCZ-5A

Analog Devices

ADSP-21584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications. With a supply voltage range of 1.05V to 1.15V, it can operate in temperatures from 0 °C to 70°C.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-5A by Analog Devices

ADSP-SC584KBCZ-5A

Analog Devices

ADSP-SC584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style with 349 terminals for various applications.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587KBCZ-5B by Analog Devices

ADSP-SC587KBCZ-5B

Analog Devices

ADSP-SC587KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style and is ideal for commercial applications requiring high-speed processing capabilities.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589KBCZ-5B by Analog Devices

ADSP-SC589KBCZ-5B

Analog Devices

ADSP-SC589KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features a CMOS technology. Ideal for applications requiring high-speed processing in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

MCIMX233DAG4C by NXP Semiconductors

MCIMX233DAG4C

NXP Semiconductors

MCIMX233DAG4C by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -10 to 70 °C, with supply voltage range of 1-1.55 V. Ideal for applications requiring low profile, fine pitch ICs in commercial temperature grade environments.

S-PQFP-G128

e3

14 mm

3

128

70 Cel

-10 Cel

PLASTIC/EPOXY

LFQFP

QFP128,.63SQ,16

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

1.6 mm

1.55 V

1 V

1.35 V

YES

CMOS

COMMERCIAL

TIN

GULL WING

.4 mm

QUAD

40

14 mm

SYSTEM ON CHIP