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SN74ACT8997DWR

Texas Instruments

SN74ACT8997DWR by Texas Instruments

SN74ACT8997DWR by Texas Instruments is a CMOS microprocessor circuit with 28 terminals, operating at 5V. It has a package style of small outline and can handle supply voltages from 4.5V to 5.5V. This IC is ideal for applications requiring high-speed data processing in commercial temperature environments.

Median Price

$13.084

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,771 parts In-Stock

1+ parts

-

100+ parts

$11.630

1k+ parts

$10.400

10k+ parts

$9.790

7,771

-

$11.630

$10.400

$9.790

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$14.537

1k+ parts

$13.000

10k+ parts

$12.238

4,000

-

$14.537

$13.000

$12.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,052 parts In-Stock

1+ parts

$12.274

100+ parts

-

1k+ parts

-

10k+ parts

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3,052

$12.274

-

-

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DigiKey Marketplace

USA . 7,771 parts In-Stock

1+ parts

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7,771

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Vyrian

USA . 6,337 parts In-Stock

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6,337

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Connector Distribution Corp

USA . 994 parts In-Stock

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994

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Right Parts Inc.

USA . 994 parts In-Stock

1+ parts

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994

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Bristol Electronics

USA . 942 parts In-Stock

1+ parts

-

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-

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942

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Legend Electronics Inc.

USA . 586 parts In-Stock

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586

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Sea View Technologies

USA . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,417 parts In-Stock

1+ parts

$11.628

100+ parts

-

1k+ parts

-

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2,417

$11.628

-

-

-

Parana Technologies

USA . 1,658 parts In-Stock

1+ parts

$16.261

100+ parts

$1,510.098

1k+ parts

$14.635

10k+ parts

-

1,658

$16.261

$1,510.098

$14.635

-

DigiPath Technology Company

USA . 2,327 parts In-Stock

1+ parts

$17.906

100+ parts

-

1k+ parts

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10k+ parts

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2,327

$17.906

-

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ChromeModa Solutions

Germany . 3,168 parts In-Stock

1+ parts

$18.271

100+ parts

$14.982

1k+ parts

-

10k+ parts

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3,168

$18.271

$14.982

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IDEA Electronic Components Group

UK . 1,682 parts In-Stock

1+ parts

$18.271

100+ parts

$17.357

1k+ parts

$16.444

10k+ parts

-

1,682

$18.271

$17.357

$16.444

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Corohmni

South Africa . 143 parts In-Stock

1+ parts

$45.520

100+ parts

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143

$45.520

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Kepictronics

USA . 3,200 parts In-Stock

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3,200

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Perfect Parts

USA . 886 parts In-Stock

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886

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Microchip USA

USA . 120 parts In-Stock

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120

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Overview

Elevate your electronics projects with the SN74ACT8997DWR by Texas Instruments, a top-quality IC that offers unmatched reliability and performance. Manufactured by a trusted industry leader, this versatile microprocessor circuit is perfect for a wide range of applications. With a compact design and efficient power usage, this IC delivers exceptional value to customers seeking a high-quality solution for their projects. Experience the benefits of Texas Instruments' cutting-edge technology with the SN74ACT8997DWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and resistant to external elements, ensuring the longevity and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power input options for the device.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and allows for easy placement on the PCB.

Power Supplies (V): 5

The 5V power supply is a common and widely available voltage level, making it compatible with various power sources.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, ideal for compact designs and applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures stable operation even under low power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance in a wide range of operating environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows the product to function in cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers corrosion resistance and ensures good electrical conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in case one terminal fails.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65mm allows for slim and compact device profiles.

Width: 7.5 mm

Narrow width of 7.5mm enables efficient use of board space and facilitates compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and component placement during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper solder melting and joint formation for reliable connections.

Length: 17.9 mm

The length of 17.9mm provides adequate space for component placement and routing of traces on the PCB.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard operating temperature ranges in commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC enables advanced processing capabilities and functionalities in the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy inspection during manufacturing processes.

Maximum Supply Current: 100 mA

The maximum supply current of 100mA indicates the power consumption requirements of the product for proper operation.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures stable and consistent power delivery to the device.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy soldering and assembly of the product on the PCB.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74ACT8997DWR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

SN74ACT8997DWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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