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SN74ABT8996PWLE

Texas Instruments

SN74ABT8996PWLE by Texas Instruments

SN74ABT8996PWLE by Texas Instruments is a BICMOS technology microprocessor circuit with 24 terminals and a supply voltage range of 4.5V to 5.5V. It operates in industrial temperature grades from -40°C to 85°C, making it suitable for various applications requiring high performance and reliability in a compact small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,709 parts In-Stock

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5,709

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Digiode

USA . 3,973 parts In-Stock

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3,973

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$11.065

100+ parts

-

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477

$11.065

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One Stop Electronics

USA . 167 parts In-Stock

1+ parts

$18.000

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-

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167

$18.000

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Parana Technologies

USA . 1,634 parts In-Stock

1+ parts

$22.628

100+ parts

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$23.287

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1,634

$22.628

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$23.287

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Corohmni

South Africa . 26 parts In-Stock

1+ parts

$23.317

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26

$23.317

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ChromeModa Solutions

Germany . 2,723 parts In-Stock

1+ parts

$25.425

100+ parts

$20.848

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2,723

$25.425

$20.848

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IDEA Electronic Components Group

UK . 1,338 parts In-Stock

1+ parts

$25.425

100+ parts

$24.154

1k+ parts

$22.882

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1,338

$25.425

$24.154

$22.882

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Corphita

USA . 1,250 parts In-Stock

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1,250

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DigiPath Technology Company

USA . 583 parts In-Stock

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$22.923

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583

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$22.923

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Overview

Unlock the power of advanced technology with the SN74ABT8996PWLE by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers superior quality and reliability in every product. This versatile microprocessor circuit is perfect for a wide range of applications in the Other Function uPs,uCs & Peripheral ICs category. Experience the value and benefits of this innovative product, with its high performance, compact design, and wide operating temperature range. Discover the advantages that the SN74ABT8996PWLE can bring to your project today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness.

Surface Mount: YES

Enables easy integration onto circuit boards.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power input options.

Package Shape: RECTANGULAR

Facilitates efficient placement on PCBs.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold conditions.

Nominal Supply Voltage: 5 V

Common standard voltage for compatibility with various systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74ABT8996PWLE attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SN74ABT8996PWLE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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