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SN74ABT8996PW

Texas Instruments

SN74ABT8996PW by Texas Instruments

SN74ABT8996PW by Texas Instruments is a BICMOS technology microprocessor circuit with 24 terminals, operating at 5V. It has a package style of small outline, thin profile, and shrink pitch for industrial applications. With a supply voltage range of 4.5V to 5.5V and an operating temperature range from -40°C to 85°C, it is suitable for various peripheral IC designs requiring high performance in compact spaces.

Median Price

$15.274

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,250 parts In-Stock

1+ parts

$13.610

100+ parts

$11.889

1k+ parts

$8.199

10k+ parts

-

4,250

$13.610

$11.889

$8.199

-

Rochester

USA . 6,472 parts In-Stock

1+ parts

-

100+ parts

$13.550

1k+ parts

$12.120

10k+ parts

$11.410

6,472

-

$13.550

$12.120

$11.410

DigiKey

USA . 6,472 parts In-Stock

1+ parts

-

100+ parts

$17.830

1k+ parts

-

10k+ parts

-

6,472

-

$17.830

-

-

Verical

USA . 4,320 parts In-Stock

1+ parts

-

100+ parts

$16.938

1k+ parts

$15.150

10k+ parts

$14.262

4,320

-

$16.938

$15.150

$14.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,515 parts In-Stock

1+ parts

$11.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,515

$11.850

-

-

-

Digiode

USA . 596 parts In-Stock

1+ parts

$12.445

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$12.445

-

-

-

LWI Electronics Inc

India . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,233 parts In-Stock

1+ parts

$11.790

100+ parts

-

1k+ parts

-

10k+ parts

-

4,233

$11.790

-

-

-

Microchip USA

USA . 1,009 parts In-Stock

1+ parts

$33.180

100+ parts

$32.710

1k+ parts

$32.470

10k+ parts

$32.230

1,009

$33.180

$32.710

$32.470

$32.230

Corohmni

South Africa . 11 parts In-Stock

1+ parts

$58.256

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$58.256

-

-

-

Parana Technologies

USA . 2,245 parts In-Stock

1+ parts

$72.226

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

$72.226

-

-

-

ChromeModa Solutions

Germany . 4,732 parts In-Stock

1+ parts

$81.153

100+ parts

$66.545

1k+ parts

-

10k+ parts

-

4,732

$81.153

$66.545

-

-

IDEA Electronic Components Group

UK . 797 parts In-Stock

1+ parts

$81.153

100+ parts

$77.095

1k+ parts

$73.038

10k+ parts

-

797

$81.153

$77.095

$73.038

-

DigiPath Technology Company

USA . 2,305 parts In-Stock

1+ parts

-

100+ parts

$73.168

1k+ parts

-

10k+ parts

-

2,305

-

$73.168

-

-

Overview

Enhance your electronic projects with the SN74ABT8996PW by Texas Instruments. With a reputation for superior quality and reliability, Texas Instruments delivers cutting-edge solutions in the category of Other Function uPs, uCs & Peripheral ICs. This versatile product offers customers unmatched value, benefits, and advantages for various applications. Upgrade your designs with the SN74ABT8996PW today and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the ICs inside, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, increasing its versatility in different systems.

Package Shape: RECTANGULAR

The rectangular shape of the package enables easy integration into standard PCB layouts, enhancing compatibility with existing designs.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the IC to function reliably in harsh environments, ensuring consistent performance in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish ensures good conductivity and corrosion resistance, leading to reliable connections and long-term durability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC offers advanced processing capabilities, making it suitable for handling complex tasks and applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in electronics, ensuring compatibility with a wide range of systems and power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74ABT8996PW attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SN74ABT8996PW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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