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SN74ACT8990W

Texas Instruments

SN74ACT8990W by Texas Instruments

SN74ACT8990W by Texas Instruments is a CMOS microprocessor circuit with 68 terminals, operating at 5V. It comes in a ceramic flatpack package and can function in temperatures ranging from 0 to 70°C. Ideal for various applications requiring peripheral ICs and uPs/uCs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,380 parts In-Stock

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6,380

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Digiode

USA . 3,229 parts In-Stock

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3,229

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Distributors (Availability)

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AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$11.653

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372

$11.653

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Parana Technologies

USA . 1,641 parts In-Stock

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$16.677

100+ parts

-

1k+ parts

$16.938

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1,641

$16.677

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$16.938

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Corohmni

South Africa . 2,989 parts In-Stock

1+ parts

$18.034

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2,989

$18.034

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DigiPath Technology Company

USA . 1,967 parts In-Stock

1+ parts

$18.363

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$16.894

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1,967

$18.363

$16.894

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IDEA Electronic Components Group

UK . 1,611 parts In-Stock

1+ parts

$18.738

100+ parts

$17.801

1k+ parts

$16.864

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1,611

$18.738

$17.801

$16.864

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ChromeModa Solutions

Germany . 1,583 parts In-Stock

1+ parts

$18.738

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$15.365

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1,583

$18.738

$15.365

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One Stop Electronics

USA . 1,005 parts In-Stock

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$33.000

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$33.000

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Corphita

USA . 1,296 parts In-Stock

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1,296

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Overview

Upgrade your electronic designs with the SN74ACT8990W by Texas Instruments, a high-quality microprocessor circuit that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this versatile IC is perfect for a wide range of applications in the electronics industry. Whether you're working on consumer electronics, industrial automation, or telecommunications, this innovative product delivers exceptional value, benefits, and advantages to meet all your needs. Trust Texas Instruments to provide cutting-edge technology and superior quality for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides superior heat dissipation and durability, making this product suitable for high temperature environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Power Supplies (V): 5

Operating at a standard 5V power supply, this product is compatible with most electronic systems, ensuring easy integration and compatibility.

No. of Terminals: 68

With a high number of terminals, this product offers a wide range of connectivity options, making it versatile and suitable for various applications.

Package Style (Meter): FLATPACK

The flatpack design saves space on the circuit board and facilitates efficient layout and placement of components, optimizing overall system performance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows this product to function reliably in demanding environments with elevated temperatures, ensuring long-term durability.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this product can operate effectively in a wide range of temperature conditions, offering flexibility and reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this product provides advanced processing capabilities, enabling complex functions and tasks to be performed efficiently and accurately.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V supply voltage ensures compatibility with standard power sources, simplifying system design and integration.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74ACT8990W attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

QFP

Package Equivalence Code:

QFP68(UNSPEC)

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74ACT8990W Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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