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SN74ABT8996PWR

Texas Instruments

SN74ABT8996PWR by Texas Instruments

SN74ABT8996PWR by Texas Instruments is a BICMOS technology microprocessor circuit with 24 terminals and a supply voltage range of 4.5V to 5.5V. It operates in industrial temperature grades from -40°C to 85°C, making it suitable for various applications requiring high performance and reliability in a compact small outline package style.

Median Price

$6.540

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 37,738 parts In-Stock

1+ parts

-

100+ parts

$6.540

1k+ parts

-

10k+ parts

-

37,738

-

$6.540

-

-

Rochester

USA . 37,648 parts In-Stock

1+ parts

-

100+ parts

$5.660

1k+ parts

$5.070

10k+ parts

$4.770

37,648

-

$5.660

$5.070

$4.770

Verical

USA . 36,000 parts In-Stock

1+ parts

-

100+ parts

$7.075

1k+ parts

$6.338

10k+ parts

$5.963

36,000

-

$7.075

$6.338

$5.963

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,510 parts In-Stock

1+ parts

$5.976

100+ parts

-

1k+ parts

-

10k+ parts

-

4,510

$5.976

-

-

-

Vyrian

USA . 1,196 parts In-Stock

1+ parts

$6.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,196

$6.290

-

-

-

DigiKey Marketplace

USA . 37,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

37,738

-

-

-

-

Sogenti Electronics

Canada . 2,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,536

-

-

-

-

LWI Electronics Inc

India . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,766 parts In-Stock

1+ parts

$5.661

100+ parts

-

1k+ parts

-

10k+ parts

-

2,766

$5.661

-

-

-

Parana Technologies

USA . 1,856 parts In-Stock

1+ parts

$43.068

100+ parts

-

1k+ parts

-

10k+ parts

-

1,856

$43.068

-

-

-

DigiPath Technology Company

USA . 488 parts In-Stock

1+ parts

$47.423

100+ parts

$43.629

1k+ parts

-

10k+ parts

-

488

$47.423

$43.629

-

-

ChromeModa Solutions

Germany . 4,765 parts In-Stock

1+ parts

$48.391

100+ parts

$39.681

1k+ parts

-

10k+ parts

-

4,765

$48.391

$39.681

-

-

IDEA Electronic Components Group

UK . 720 parts In-Stock

1+ parts

$48.391

100+ parts

$45.971

1k+ parts

$43.552

10k+ parts

-

720

$48.391

$45.971

$43.552

-

Corohmni

South Africa . 434 parts In-Stock

1+ parts

$53.355

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$53.355

-

-

-

A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Microchip USA

USA . 351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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351

-

-

-

-

Overview

Looking for top-notch quality and reliability in your microprocessor circuit needs? Look no further than the SN74ABT8996PWR by Texas Instruments. With a reputation for excellence, Texas Instruments delivers cutting-edge technology in a small outline, thin profile package. Ideal for industrial applications, this versatile IC offers a nominal supply voltage of 5V and a wide operating temperature range. Trust Texas Instruments to provide the solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle, making it suitable for standard PCB designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without damage.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish ensures reliable electrical connections and corrosion resistance for long-term performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technology, offering high speed and low power consumption for efficient operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74ABT8996PWR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

SN74ABT8996PWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-655-5564, 5962016555564

NIIN

016555564

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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