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SN74ALS6300DWR

Texas Instruments

SN74ALS6300DWR by Texas Instruments

SN74ALS6300DWR by Texas Instruments is a CMOS microprocessor circuit with 24 terminals. It operates b/w 0-70°C, with supply voltage range of 4.75-5.25V and max current draw of 185mA. Ideal for applications requiring small outline surface mount packages in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,990 parts In-Stock

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7,990

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Digiode

USA . 1,964 parts In-Stock

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1,964

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Distributors (Availability)

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AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$5.069

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514

$5.069

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One Stop Electronics

USA . 678 parts In-Stock

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$14.000

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678

$14.000

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Parana Technologies

USA . 177 parts In-Stock

1+ parts

$32.347

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$104.603

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177

$32.347

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$104.603

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DigiPath Technology Company

USA . 1,416 parts In-Stock

1+ parts

$35.618

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1,416

$35.618

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ChromeModa Solutions

Germany . 3,319 parts In-Stock

1+ parts

$36.345

100+ parts

$29.803

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3,319

$36.345

$29.803

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IDEA Electronic Components Group

UK . 512 parts In-Stock

1+ parts

$36.345

100+ parts

$34.528

1k+ parts

$32.710

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512

$36.345

$34.528

$32.710

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Corohmni

South Africa . 3,075 parts In-Stock

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$39.609

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3,075

$39.609

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Corphita

USA . 1,291 parts In-Stock

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Overview

Elevate your electronics projects with the SN74ALS6300DWR by Texas Instruments! This high-quality peripheral IC, designed with precision and reliability in mind, offers unmatched value and performance for a wide range of applications. Whether you're working on microprocessor circuits or other functions for uPs and uCs, this compact and efficient component delivers superior results. Trust in Texas Instruments' reputation for excellence and experience the benefits of top-notch technology with the SN74ALS6300DWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps protect the internal components of the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, suitable for automated assembly processes.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power input, accommodating a wider range of applications.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures compatibility with various power sources, enabling consistent performance.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliability in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature enables operation in colder environments without compromising performance.

Terminal Position: DUAL

Dual terminal position allows for versatile connections and compatibility with different circuit configurations.

Width: 7.5 mm

Compact width size makes this IC suitable for space-constrained applications, saving valuable board space.

Length: 15.4 mm

Optimal length size provides a balance between functionality and space efficiency, fitting well in various electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance and efficiency.

Maximum Supply Current: 185 mA

High maximum supply current ensures sufficient power for the IC to operate efficiently, supporting its functionality.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V makes this IC compatible with common power sources, ensuring hassle-free integration.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74ALS6300DWR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

185 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

SN74ALS6300DWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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