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BGA Other Function uPs,uCs & Peripheral ICs 568

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TCI6630K2LCMS by Texas Instruments

TCI6630K2LCMS

Texas Instruments

TCI6630K2LCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at a supply voltage range of 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for high-performance computing applications requiring advanced processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA2 by Texas Instruments

TCI6630K2LDCMSA2

Texas Instruments

TCI6630K2LDCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LDCMSA by Texas Instruments

TCI6630K2LDCMSA

Texas Instruments

Texas Instruments TCI6630K2LDCMSA is a CMOS MICROPROCESSOR CIRCUIT with 900 BALL terminals in a GRID ARRAY package. It operates b/w 0.902V to 0.997V, with a peak reflow temperature of 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA2 by Texas Instruments

TCI6630K2LSCMSA2

Texas Instruments

TCI6630K2LSCMSA2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, suitable for surface mount applications. Operating b/w 0.902V to 0.997V, it offers high performance in various electronic systems.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LSCMSA by Texas Instruments

TCI6630K2LSCMSA

Texas Instruments

TCI6630K2LSCMSA by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. This IC is suitable for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS2 by Texas Instruments

TCI6630K2LXCMS2

Texas Instruments

TCI6630K2LXCMS2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates on a supply voltage range of 0.902V to 0.997V, making it suitable for high-performance computing applications requiring advanced CMOS technology and surface mount compatibility. With a peak reflow temperature of 245°C, this device offers reliable performance in demanding environments.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA2 by Texas Instruments

TCI6630K2LXCMSA2

Texas Instruments

Texas Instruments TCI6630K2LXCMSA2 is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages b/w 0.902V to 0.997V, utilizing CMOS technology. Ideal for applications requiring high-performance computing in compact form factors.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMSA by Texas Instruments

TCI6630K2LXCMSA

Texas Instruments

TCI6630K2LXCMSA by Texas Instruments is a microprocessor circuit with a max supply voltage of 0.997V and a min supply voltage of 0.902V. It is used in applications requiring high-performance processing capabilities.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

TCI6630K2LXCMS by Texas Instruments

TCI6630K2LXCMS

Texas Instruments

TCI6630K2LXCMS by Texas Instruments is a MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates at supply voltages ranging from 0.902V to 0.997V and can withstand peak reflow temperatures up to 245°C. Ideal for applications requiring high-performance processing capabilities in compact electronic devices.

S-PBGA-B900

e1

4

900

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

.997 V

.902 V

.95 V

YES

CMOS

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

DLPC230TZDQRQ1 by Texas Instruments

DLPC230TZDQRQ1

Texas Instruments

DLPC230TZDQRQ1 by Texas Instruments is a CMOS microprocessor circuit with 324 terminals in a grid array package. It operates b/w -40 to 105 °C, suitable for industrial applications. With a supply voltage range of 1.045V to 1.155V, it is ideal for various functions in automotive electronics and other peripheral ICs.

S-PBGA-B324

23 mm

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

2.352 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT

DLPC6401ZFF by Texas Instruments

DLPC6401ZFF

Texas Instruments

DLPC6401ZFF by Texas Instruments is a CMOS microprocessor circuit with 419 terminals in a square grid array package. It operates b/w 0-55°C, with supply voltage range of 1.116-1.26V. Ideal for applications requiring high-performance processing in commercial-grade environments.

S-PBGA-B419

23 mm

419

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.36 mm

1.26 V

1.116 V

1.2 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT

DLPC900ZPC by Texas Instruments

DLPC900ZPC

Texas Instruments

DLPC900ZPC by Texas Instruments is a 516-terminal microprocessor circuit with CMOS technology. It operates b/w 0-55°C, supports I2C, SPI, UART, and USB buses, and has a clock frequency of up to 20 MHz. Ideal for applications requiring a low-voltage supply and high data bus width in a compact grid array package.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

XC7Z030-1SBG485C by Xilinx

XC7Z030-1SBG485C

Xilinx

XC7Z030-1SBG485C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 485 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.

S-PBGA-B485

19 mm

485

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-1SBG485I by Xilinx

XC7Z030-1SBG485I

Xilinx

XC7Z030-1SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. With 485 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-2SBG485E by Xilinx

XC7Z030-2SBG485E

Xilinx

The Xilinx XC7Z030-2SBG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-2SBG485I by Xilinx

XC7Z030-2SBG485I

Xilinx

XC7Z030-2SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This GRID ARRAY package has 485 terminals and is ideal for various applications requiring high-performance uPs/uCs & Peripheral ICs.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-3SBG485E by Xilinx

XC7Z030-3SBG485E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-L2FBG484I by Xilinx

XC7Z030-L2FBG484I

Xilinx

XC7Z030-L2FBG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals and a package size of 23mm x 23mm. It operates at a supply voltage range of 0.95V to 1.05V and can withstand temperatures from -40°C to 100°C. This versatile IC is commonly used in various applications requiring high-performance microcontrollers and peripheral integration.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-L2FBG676I by Xilinx

XC7Z030-L2FBG676I

Xilinx

The Xilinx XC7Z030-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-L2FFG676I by Xilinx

XC7Z030-L2FFG676I

Xilinx

XC7Z030-L2FFG676I by Xilinx is a 676-terminal System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-L2SBG485I by Xilinx

XC7Z030-L2SBG485I

Xilinx

The Xilinx XC7Z030-L2SBG485I is a System on Chip with 485 terminals, operating b/w -40 to 100°C. It utilizes CMOS technology, has a terminal pitch of 0.8mm, and a package style of Grid Array. Ideal for applications requiring low power consumption and high performance in compact spaces.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z035-1FBG676C by Xilinx

XC7Z035-1FBG676C

Xilinx

The Xilinx XC7Z035-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 676 terminals in a square grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FBG676I by Xilinx

XC7Z035-1FBG676I

Xilinx

XC7Z035-1FBG676I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FFG676C by Xilinx

XC7Z035-1FFG676C

Xilinx

The Xilinx XC7Z035-1FFG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FFG676I by Xilinx

XC7Z035-1FFG676I

Xilinx

The Xilinx XC7Z035-1FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FFG900C by Xilinx

XC7Z035-1FFG900C

Xilinx

XC7Z035-1FFG900C by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 85 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-1FFG900I by Xilinx

XC7Z035-1FFG900I

Xilinx

XC7Z035-1FFG900I by Xilinx is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FBG676E by Xilinx

XC7Z035-2FBG676E

Xilinx

The Xilinx XC7Z035-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FBG676I by Xilinx

XC7Z035-2FBG676I

Xilinx

The Xilinx XC7Z035-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG676E by Xilinx

XC7Z035-2FFG676E

Xilinx

XC7Z035-2FFG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG676I by Xilinx

XC7Z035-2FFG676I

Xilinx

The Xilinx XC7Z035-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG900E by Xilinx

XC7Z035-2FFG900E

Xilinx

XC7Z035-2FFG900E by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for various applications in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B900

31 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FFG900I by Xilinx

XC7Z035-2FFG900I

Xilinx

The Xilinx XC7Z035-2FFG900I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-3FBG676E by Xilinx

XC7Z035-3FBG676E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-3FFG676E by Xilinx

XC7Z035-3FFG676E

Xilinx

XC7Z035-3FFG676E by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-100 °C with supply voltage range of 0.95-1.05 V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-3FFG900E by Xilinx

XC7Z035-3FFG900E

Xilinx

XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B900

31 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-L2FBG676I by Xilinx

XC7Z035-L2FBG676I

Xilinx

The Xilinx XC7Z035-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-L2FFG676I by Xilinx

XC7Z035-L2FFG676I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .95 V;

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-L2FFG900I by Xilinx

XC7Z035-L2FFG900I

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z045-L2FBG676I by Xilinx

XC7Z045-L2FBG676I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA676,26X26,40;

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-L2FFG676I by Xilinx

XC7Z045-L2FFG676I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z045-L2FFG900I by Xilinx

XC7Z045-L2FFG900I

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z100-L2FFG1156I by Xilinx

XC7Z100-L2FFG1156I

Xilinx

XC7Z100-L2FFG1156I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 1156 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B1156

35 mm

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

GRID ARRAY

3.1 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

35 mm

SYSTEM ON CHIP

XC7Z100-L2FFG900I by Xilinx

XC7Z100-L2FFG900I

Xilinx

XC7Z100-L2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

27 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

DLPC410ZYR by Texas Instruments

DLPC410ZYR

Texas Instruments

DLPC410ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

3 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

1 mm

BOTTOM

NOT SPECIFIED

27 mm

MICROPROCESSOR CIRCUIT

CYTMA525-49FNI25ZZT by Cypress Semiconductor

CYTMA525-49FNI25ZZT

Cypress Semiconductor

CYTMA525-49FNI25ZZT by Cypress Semiconductor is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 1.71V to 5.5V, featuring a GRID ARRAY package style with 49 terminals for surface mount applications in various electronic devices.

IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY

R-PBGA-B49

49

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

5.5 V

1.71 V

YES

CMOS

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

DRA746APGABCQ1 by Texas Instruments

DRA746APGABCQ1

Texas Instruments

DRA746APGABCQ1 by Texas Instruments is an AEC-Q100 compliant microprocessor circuit with 760 terminals in a grid array package. It operates at a speed of 1500 rpm, suitable for automotive applications due to its CMOS technology and tin silver copper terminal finish. The device can withstand peak reflow temperatures up to 250°C for 30 seconds, making it ideal for automotive electronic systems.

X-PBGA-B760

e1

3

760

PLASTIC/EPOXY

BGA

UNSPECIFIED

GRID ARRAY

250

AEC-Q100

1500 rpm

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XA7Z030-1FBV484Q by Xilinx

XA7Z030-1FBV484Q

Xilinx

The Xilinx XA7Z030-1FBV484Q is a CMOS microprocessor circuit with 484 ball terminals. It operates in automotive-grade temperatures (-40 to 125 °C) and is AEC-Q100 screened. This square grid array package is ideal for automotive applications requiring high-performance processing capabilities.

S-PBGA-B484

484

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

AEC-Q100

YES

CMOS

AUTOMOTIVE

BALL

BOTTOM

MICROPROCESSOR CIRCUIT