Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.
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MR0A08BYS35
Everspin Technologies
MR0A08BYS35 by Everspin: 128KX8 memory IC with 3.3V supply, 35ns access time, and 1048576 bit density. Ideal for commercial applications requiring fast asynchronous operation in a small outline package.
35 ns
R-PDSO-G44
18.41 mm
1048576 bit
MEMORY CIRCUIT
8
3
1
44
131072 words
128K
ASYNCHRONOUS
70 Cel
0 Cel
128KX8
PLASTIC/EPOXY
TSOP2
TSOP44,.46,32
RECTANGULAR
SMALL OUTLINE, THIN PROFILE
3.3
Not Qualified
1.2 mm
.007 Amp
SRAMs
65 mA
3.6 V
3 V
YES
CMOS
COMMERCIAL
GULL WING
.8 mm
DUAL
10.16 mm
DSM2180F3-90T6
STMicroelectronics
DSM2180F3-90T6 from STMicroelectronics is a 128Kx8 asynchronous memory IC with a supply voltage range of 4.5V to 5.5V. It features a compact flatpack design and operates in industrial temperatures from -40 °C to 85°C. Ideal for various electronic applications, it ensures reliable performance in demanding environments.
S-PQFP-G52
e4
10 mm
52
85 Cel
-40 Cel
QFP
SQUARE
FLATPACK
2.35 mm
5.5 V
4.5 V
5
INDUSTRIAL
NICKEL PALLADIUM GOLD
.65 mm
QUAD
DSM2180F3V-15K6
DSM2180F3V-15K6 by STMicroelectronics is a 128Kx8 asynchronous memory IC designed for industrial applications. It operates at a nominal voltage of 3.3V, with a temperature range of -40 °C to 85°C. This surface-mount chip carrier features a compact square design and offers high-density storage in a robust package.
S-PQCC-J52
e3
19.1262 mm
QCCJ
CHIP CARRIER
4.57 mm
MATTE TIN
J BEND
1.27 mm
DSM2180F3V-15T6
DSM2180F3V-15T6 from STMicroelectronics is a 128Kx8 CMOS memory IC designed for industrial applications. It operates asynchronously with a supply voltage range of 3-3.6V and features a compact flatpack design. With a max temp of 85 °C, it ensures reliability in demanding environments.
DSM2190F4V-15K6
DSM2190F4V-15K6 by STMicroelectronics is a 256Kx8 asynchronous memory IC designed for industrial applications. It operates at a nominal voltage of 3.3V, with a temperature range from -40 °C to 85°C. This surface-mount chip carrier features a compact square design and offers high-density storage in various electronic devices.
ALSO CONTAINS 32K X 8 SECONDARY FLASH MEMORY
2097152 bit
262144 words
256K
256KX8
DSM2190F4V-15T6
DSM2190F4V-15T6 by STMicroelectronics is a 256Kx8 asynchronous memory IC with a supply voltage range of 3.0-3.6V. It features a compact flatpack design, operates in industrial temperatures (-40 °C to 85°C), and supports surface mount applications. Ideal for various electronic devices requiring reliable memory solutions.
DSM2150F5V-12T6
DSM2150F5V-12T6 by STMicroelectronics is a 256Kx16 asynchronous memory IC with a supply voltage range of 3.0-3.6V, ideal for industrial applications. It features a compact flatpack design and operates in temperatures from -40 °C to 85°C. This CMOS device supports surface mount technology with a fine pitch terminal layout.
ALSO CONTAINS 32K BYTE OF SECONDARY FLASH MEMORY
S-PQFP-G80
e3/e4
12 mm
4194304 bit
16
80
256KX16
TFQFP
FLATPACK, THIN PROFILE, FINE PITCH
NOT SPECIFIED
TIN/NICKEL PALLADIUM GOLD
.5 mm
XCCACEM16BG388I
Xilinx
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Parallel or Serial: SERIAL;
20
1000000 Write/Erase Cycles
S-PBGA-B388
35 mm
16777216 bit
388
1048576 words
1M
SYNCHRONOUS
1MX16
BGA
BGA388,26X26,50
GRID ARRAY
SERIAL
1.8,3.3
2.87 mm
Flash Memories
240 mA
1.89 V
1.71 V
1.8
BALL
BOTTOM
NOR TYPE
XCCACEM32BG388I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
e0
33554432 bit
2097152 words
2M
2MX16
TIN LEAD
XCCACEM64BG388I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;
133 MHz
67108864 bit
4194304 words
4M
4MX16
M36DR432AD10ZA6T
M36DR432AD10ZA6T by STMicroelectronics is a low-profile, asynchronous memory IC featuring 2M words of mixed FLASH+SRAM with a supply voltage range of 1.65-2.2V. It operates in extreme temperatures from -40 °C to 85 °C and supports surface mount applications. Ideal for industrial use, it offers fast access times up to 100 ns and minimal standby current.
100 ns
SRAM IS ORGANIZED AS 256K X 16
R-PBGA-B66
FLASH+SRAM
66
LFBGA
BGA66,8X12,32
GRID ARRAY, LOW PROFILE, FINE PITCH
1.8/2
1.4 mm
.00001 Amp
Other Memory ICs
26 mA
2.2 V
1.65 V
8 mm
AT88SC0104C-SU
Atmel
AT88SC0104C-SU by Atmel is a 1Kx1 memory circuit IC with 1024-bit memory density. It operates at 3.3V, has I2C control byte 1011CCCC, and supports software write protection. This small outline package IC is ideal for industrial applications requiring secure data storage and retrieval.
10
100000 Write/Erase Cycles
1011CCCC
R-PDSO-G8
4.925 mm
1024 bit
1024 words
1K
1KX1
SOP
SOP8,.25
SMALL OUTLINE
3/5
1.75 mm
I2C
.0001 Amp
EEPROMs
5 mA
2.7 V
3.9 mm
SOFTWARE
XC17S10VOG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
10 MHz
COMMON
4.9 mm
95008 bit
95008 words
95008
95008X1
3-STATE
DIP8,.3
260
.00005 Amp
OTP ROMs
10 mA
5.25 V
4.75 V
Matte Tin (Sn)
30
XC17S10XLVOG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
95752 bit
95752 words
95752
95752X1
XC17S10XLVOG8I
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-609 Code: e3;
XC17S20XLVOG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words: 179160 words;
179160 bit
179160 words
179160
179160X1
TSOP8,.25
XC17S30XLVOG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: TSOP2; Package Shape: RECTANGULAR; Power Supplies (V): 3.3;
249168 bit
249168 words
249168
249168X1
DLPR100DWC
Texas Instruments
DLPR100DWC by Texas Instruments is a memory circuit IC with 2MX8 organization, 8-bit memory width, and 16777216 bit memory density. It operates at temperatures ranging from -40 to 85 °C and has a max standby current of 0.00005 Amp. Ideal for industrial applications requiring small outline package style and surface mount compatibility.
2MX8
2.5/3.3
XC17S10XLPDG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Length: 9.3599 mm;
R-PDIP-T8
9.3599 mm
DIP
IN-LINE
250
4.5974 mm
NO
THROUGH-HOLE
2.54 mm
7.62 mm
XC17S30XLPDG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
XC17S40XLPDG8C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Technology: CMOS;
330696 bit
330696 words
330696
330696X1
MR2A08AMYS35R
Everspin Technologies' MR2A08AMYS35R is a 256Kx8 memory IC with 2097152 bit density. Operating at 3.3V, it has a max access time of 35ns and AEC-Q100 screening level for automotive applications. This small outline, thin profile package is ideal for asynchronous operations in automotive electronics with a temperature range from -40 to 125°C.
125 Cel
AEC-Q100
.02 Amp
135 mA
AUTOMOTIVE
MR2A08AMYS35
MR2A08AMYS35 by Everspin Technologies is a 256Kx8 memory IC with CMOS technology. It operates at 3.3V, has a max access time of 35ns, and is AEC-Q100 screened for automotive applications. With a small outline package style and gull wing terminal form, it is suitable for various memory circuit needs in automotive electronics.
CY8C24033-24PVXI
Cypress Semiconductor
CY8C24033-24PVXI by Cypress: 8KX1 memory circuit with 8192-bit density. Operates synchronously, industrial grade, -40 to 85°C range. Ideal for applications requiring small outline, shrink pitch package and CMOS technology.
R-PDSO-G56
18.415 mm
8192 bit
56
8192 words
8K
8KX1
SSOP
SMALL OUTLINE, SHRINK PITCH
2.794 mm
.635 mm
7.5057 mm
MT29C4G48MAZAPAKQ-5IT
Micron Technology
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
S-PBGA-B168
e1
FLASH+SDRAM
168
128KX16
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.75 mm
1.95 V
1.7 V
TIN SILVER COPPER
MT29C2G48MAKLCJI-6IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: TFBGA; Package Shape: SQUARE; Terminal Pitch: .5 mm;
TFBGA
BGA168,23X23,20
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
MT29C4G96MAZBBCJV-48IT
MEMORY CIRCUIT; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; Package Body Material: PLASTIC/EPOXY;
IT IS ALSO HAVING 4GBIT (X 32) LPDDR
4294967296 bit
FLASH+LPDDR
268435456 words
256M
256MX16
1 mm
MT29C4G48MAZBBAKB-48IT
Micron Technology's MT29C4G48MAZBBAKB-48IT is a 256MX16 FLASH+LPDDR memory IC with 4294967296 bit density. Operating at 1.8V, it features synchronous mode and CMOS technology. Ideal for applications requiring high memory capacity in compact devices with limited space and power constraints.
IT IS ALSO HAVING 2GBIT (X 32) LPDDR
MT29C8G96MAZBBDJV-48IT
MEMORY CIRCUIT; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Additional Features: IT IS ALSO HAVING 4GBIT (X 32) LPDDR;
8589934592 bit
536870912 words
512M
512MX16
M39L0R8090U3ZE6E
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 133; Package Code: VFBGA; Package Shape: SQUARE; Technology: CMOS;
S-PBGA-B133
536870912 bit
133
33554432 words
32M
32MX16
MR10Q010CMB
MR10Q010CMB by Everspin Technologies is a 128Kx8 memory IC with CMOS technology. Operating at 3.3V, it offers synchronous operation and industrial temperature grade suitability. With a package style of grid array and low profile, it is ideal for applications requiring high-speed data storage in compact spaces.
R-PBGA-B24
24
LBGA
GRID ARRAY, LOW PROFILE
1.35 mm
6 mm
ST25TA02K-AC6B5
ST25TA02K-AC6B5 from STMicroelectronics is a CMOS memory IC designed for industrial applications, featuring a 256x8 organization and operating in asynchronous mode. It supports a wide temperature range from -40 °C to 85 °C. This unencased chip is ideal for compact designs requiring reliable data storage.
X-XUUC-N
2048 bit
256 words
256
256X8
UNSPECIFIED
DIE
UNCASED CHIP
NO LEAD
UPPER
ST25TA02KD-C6C5
ST25TA02KD-C6C5 from STMicroelectronics is a compact, dual-terminal memory IC with an industrial temperature range of -40 °C to 85 °C. It features asynchronous operation, 256x8 organization, and a very thin profile (0.6mm height). Ideal for space-constrained applications in various electronic devices.
R-PDSO-N8
3 mm
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
.6 mm
2 mm
ST25TA02KD-C6H5
ST25TA02KD-C6H5 from STMicroelectronics is a CMOS memory IC with 256x8 organization, operating b/w -40 °C to 85 °C. It features a compact chip carrier design and asynchronous mode for efficient data access. Ideal for industrial applications requiring reliable non-volatile storage.
R-PDSO-N5
1.7 mm
BCC
.4 mm
ST25TA16K-AB6B3
ST25TA16K-AB6B3 from STMicroelectronics is an industrial-grade CMOS memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount chip offers 8192 words organized in 8Kx8 format for versatile applications.
65536 bit
8KX8
ST25TA512-AC6B5
ST25TA512-AC6B5 from STMicroelectronics is a CMOS memory IC with a density of 512 bits, organized as 64x8. It operates asynchronously and supports temperatures from -40 °C to 85 °C. Ideal for industrial applications, it features a no-lead design for efficient surface mounting.
512 bit
64 words
64
64X8
ST25TA64K-AB6B3
ST25TA64K-AB6B3 from STMicroelectronics is an industrial-grade memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount chip is perfect for applications requiring reliable data storage in compact designs.
ST25TA02KP-C6C5
ST25TA02KP-C6C5 from STMicroelectronics is a compact, dual-terminal memory IC with a 256x8 organization and operates asynchronously. It features an industrial temperature range of -40 °C to 85 °C and comes in a very thin profile package. Ideal for space-constrained applications requiring reliable data storage.
MT29C4G48MAYBBAHK-48AIT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 137; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B137;
R-PBGA-B137
13 mm
137
512MX8
Tin/Silver/Copper (Sn/Ag/Cu)
10.5 mm
ST25TA02K-AC6G5
ST25TA02K-AC6G5 from STMicroelectronics is a CMOS memory IC designed for industrial applications, featuring a 256x8 organization and operating temperatures from -40 °C to 85 °C. Its asynchronous mode ensures efficient data access. Ideal for compact, surface-mount designs.
O-XUUC-N
ROUND
ST25TA02KP-C6G5
ST25TA02KP-C6G5 from STMicroelectronics is a CMOS memory IC with 256K x 8 organization, operating b/w -40 °C to 85 °C. This surface-mount chip features asynchronous operation and no lead terminals, ideal for industrial applications requiring reliable data storage.
ST25TA16KAB6G3
ST25TA16KAB6G3 from STMicroelectronics is an industrial-grade memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount, no-lead chip is perfect for various applications in electronics.
ST25TA64K-AB6G3
ST25TA64K-AB6G3 from STMicroelectronics is a CMOS memory IC with 8K x 8 organization, operating b/w -40 °C to 85 °C. This surface-mount, no-lead chip is ideal for industrial applications requiring reliable asynchronous data storage. With a density of 65536 bits, it ensures efficient performance in compact designs.
47C04-E/SN
Microchip Technology
47C04-E/SN by Microchip Technology is a small outline memory IC with 512x8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. Ideal for automotive applications, it has a supply voltage range of 4.5V to 5.5V and operates in temperatures from -40°C to 125°C.
400 ns
4096 bit
EEPROM+SRAM
512 words
512
512X8
SOP8,.23
40
47C04-E/ST
47C04-E/ST by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 512x8 organization. Operating at 5V, it has a memory density of 4096 bit and max access time of 400ns. Ideal for automotive applications due to its small outline, thin profile package style and wide temperature range from -40°C to 125°C.
4.4 mm
TSSOP
TSSOP8,.25
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
47C04-I/ST
47C04-I/ST by Microchip Technology is a CMOS memory IC with EEPROM+SRAM, 512X8 organization, and 4096-bit memory density. It operates synchronously at temperatures ranging from -40 to 85°C. This small outline package with 0.65mm terminal pitch is ideal for industrial applications requiring fast access times.
47C04T-E/SN
47C04T-E/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 512x8 organization. Operating at 5V, it has a max access time of 400ns and is suitable for automotive applications due to its temperature grade.
47C04T-E/ST
47C04T-E/ST by Microchip Technology is a small outline, thin profile EEPROM+SRAM memory IC with 512x8 organization. Operating at 5V, it has a max access time of 400ns and is suitable for automotive applications due to its temperature grade of -40 to 125°C.
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