Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Everspin Technologies' MR2A08AMYS35R is a 256Kx8 memory IC with 2097152 bit density. Operating at 3.3V, it has a max access time of 35ns and AEC-Q100 screening level for automotive applications. This small outline, thin profile package is ideal for asynchronous operations in automotive electronics with a temperature range from -40 to 125°C.
Median Price
-
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Nova Conductors
AZTECH Wire
$18.650
Bastille Electronics
Durable material for long-lasting usage.
Compatible with commonly used power supplies.
Allows for independent operation without the need for synchronization.
Can operate efficiently in high-temperature environments.
Provides sufficient width for storing data efficiently.
CMOS technology offers low power consumption and high noise immunity.
Fast access time for quick data retrieval.
Other Function Memory ICs MR2A08AMYS35R attributes and parameters. Explore more Other Function Memory ICs devices from Everspin Technologies
Maximum Access Time:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Screening Level:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MR2A08AMYS35R Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Trace Code Chgs 20/Oct/2021
PCN Assembly/Origin - Mult Dev Thickness Chg 13/Apr/2021
Everspin Technologies, Inc. Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-transfer Torque MRAM (STT-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 120 Million MRAM and STT-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. Core Competence with MRAM: From Perpendicular to Field-Switched Everspin’s knowledge and experience in magnetic memory design, manufacture and delivery into relevant applications is unique within the semiconductor industry. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. Manufacturing - The Capacity to Deliver In 2014, Everspin partnered with GLOBALFOUNDRIES for full turn-key 300mm high-volume production of in-plane and perpendicular MTJ ST-MRAM on advanced technology nodes including 40nm, 28nm and beyond. In addition, Everspin owns and operates an integrated magnetic fabrication line located in Chandler, Arizona, where Everspin produces MRAM products are based on 180nm, 130nm, and 90nm process technology nodes. Product package and test operations are located in China, Taiwan and other Asian countries.
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Infineon Technologies
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Silicon Transistor
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
MBRS140T3G
Onsemi
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
Philips Components
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
Pro-an Electronic
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
NXP Semiconductors
TMS27C32-100NL4
Texas Instruments
Other Memory ICs;
5962-01-218-1995
The Texas Instruments 5962-01-218-1995 is a MOS memory circuit IC with 24 terminals in an in-line rectangular package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage and retrieval. The through-hole terminals spaced at 2.54mm pitch ensure secure connections in electronic devices.
ATSHA204A-MAHCZ-T
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-N8;
TMS27C291-50N
TMS27P32N25
DS1217M-512-25
Analog Devices' DS1217M-512-25 is a 64Kx8 memory IC with CMOS technology. Operating at 5V, it has a memory density of 524288 bits and supports asynchronous mode. This MICROELECTRONIC ASSEMBLY package is ideal for commercial applications requiring reliable memory storage in the temperature range of 0 to 70 °C.
DS1207-G05
DS1207-G05 by Analog Devices is a CMOS MEMORY CIRCUIT with 5 terminals. It operates SYNCHRONOUSLY at temperatures from 0 °C to 70°C. This RECTANGULAR IC is ideal for commercial applications requiring SPECIAL SHAPE package style.
M36LLR8860T1ZAQF
STMicroelectronics
M36LLR8860T1ZAQF by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates b/w -25 °C and 85 °C, making it ideal for compact electronic applications. With an 88-terminal grid array design, it ensures efficient space utilization in devices.
DS2401AP+
Maxim Integrated
MEMORY CIRCUIT;
DLPR100DWC
DLPR100DWC by Texas Instruments is a memory circuit IC with 2MX8 organization, 8-bit memory width, and 16777216 bit memory density. It operates at temperatures ranging from -40 to 85 °C and has a max standby current of 0.00005 Amp. Ideal for industrial applications requiring small outline package style and surface mount compatibility.
DS90922R-000
DS90922R-000 by Analog Devices is a CMOS MEMORY CIRCUIT with 2 terminals in a ROUND METAL package. It features TIN LEAD finish and THROUGH-HOLE terminal form. Ideal for applications requiring Other Function Memory ICs in CYLINDRICAL style packages.
M30082040108X0PWAY
Renesas Electronics
Renesas Electronics M30082040108X0PWAY is a 1MX8 MEMORY CIRCUIT IC with 8388608 bit Memory Density. It operates in SYNCHRONOUS mode at 3V, suitable for applications requiring high-speed data processing. With a small outline and very thin profile, it's ideal for compact electronic devices.
MT38W2021A902ZQXZI.X69
Micron Technology
Micron Technology's MT38W2021A902ZQXZI.X69 is a 4MX16 memory IC with 67108864 bit memory density. Operating in synchronous mode, it has 88 terminals in a grid array package style. Ideal for industrial applications, it supports a memory width of 16 bits and operates b/w -40 to 85 °C temperature range.
TMS27PC32JL4
TMS44C251-12DJ
TMS44C251-12DJ by Texas Instruments is a 256KX4 MEMORY CIRCUIT IC with 1048576 bit Memory Density, 120 ns Max Access Time. It operates at 5V, has DUAL terminals in a SMALL OUTLINE package, suitable for commercial applications requiring fast memory access.
S70KL1281DABHI020
S70KL1281DABHI020 by Infineon Technologies is a 16MX8 MEMORY CIRCUIT with 134217728 bit memory density. It operates in SYNCHRONOUS mode at temperatures ranging from -40 to 85 °C, suitable for INDUSTRIAL applications. This PLASTIC/EPOXY IC has a GRID ARRAY package style, measures 8mm x 6mm x 1mm, and features a BALL terminal form.
DS2436B-C02/T&R
S71PL127NB0HHW4U0
Spansion
Spansion S71PL127NB0HHW4U0 is an 8MX16 FLASH+PSRAM memory IC with 134217728-bit density and 70ns access time. It operates at 3V, in a thin profile grid array package, suitable for applications requiring high-speed data storage and retrieval.
TMS27C64-45
TMS44C250-1SD
TMS44C250-1SD by Texas Instruments is a 256KX4 MEMORY CIRCUIT with 1048576 bit Memory Density. It operates at 5V, has a Max Access Time of 100ns, and consumes up to 110mA. This IC is ideal for applications requiring fast data access in commercial temperature environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MR2A16ACYS35
Freescale Semiconductor
MR2A16ACYS35 by Freescale Semiconductor is a 256Kx16 memory IC with 3.3V supply, operating in industrial temperature range of -40 to 85°C. It features asynchronous mode, 35ns access time, and GULL WING terminals. Ideal for applications requiring high-speed memory operations in compact electronic devices.
MR2A16AVYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Surface Mount: YES;
MR2A16AYS35
MR2A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit Memory Density. Operating at 3.3V, it has an Access Time of 35ns and supports ASYNCHRONOUS mode. This PLASTIC/EPOXY IC in SMALL OUTLINE, THIN PROFILE package is ideal for applications requiring high-speed memory access in commercial temperature environments.
MR2A16ATS35C
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G44;
MR2A16AVMA35
Everspin Technologies
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
MR2A08AMYS35
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MR2A16ACMA35
MR2A16ACMA35 by Everspin: 256KX16 memory IC with 35ns access time, operates at 3.3V. Suitable for industrial applications, features low profile grid array package and CMOS technology.
MR2A16AMYS35
MR2A16AMYS35 by Everspin Tech: 256KX16 memory IC with 4194304 bit density. Operating at -40 to 125 °C, it's AEC-Q100 graded for automotive applications. Features include 3.3V supply, small outline package, and dual terminal position.
MR2A16AVYS35R
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;
MR2A16AMYS35R
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
MR2A16AVMA35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
MR2A08ACYS35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
MR2A08AYS35
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Current: 135 mA;
MR2A08ACMA35
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
MR2A08ACYS35R
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Standby Current: .02 Amp;
MR2A08AMMA35
MEMORY CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Memory Density: 2097152 bit;
MR2A08AYS35R
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Power Supplies (V): 3.3;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved