Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ST25TA64K-AB6B3 from STMicroelectronics is an industrial-grade memory IC with a density of 65536 bits and operates asynchronously. It features a wide temperature range from -40 °C to 85 °C, making it ideal for harsh environments. This surface-mount chip is perfect for applications requiring reliable data storage in compact designs.
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The surface mount design allows for compact integration onto circuit boards, making it suitable for space-constrained applications.
Asynchronous operation provides faster response times and simplifies system design, which enhances performance in various applications.
The uncased chip format allows for flexible arrangements and reduced weight, making it ideal for high-density applications.
With a maximum operating temperature of 85 °C, this memory IC is designed for robust performance in a variety of industrial environments.
The 8Kx8 organization is optimal for a balanced approach between memory size and access speed, catering to a wide range of applications.
The ability to operate at -40 °C ensures reliability and functionality in extreme low-temperature environments, making it ideal for industrial and automotive applications.
The upper terminal positioning facilitates easy integration into existing designs, promoting efficiency during the assembly process.
As an industrial-grade component, this memory IC is built to withstand rigorous conditions, ensuring long lifespan and reliability.
CMOS technology offers low power consumption while delivering high performance, making this IC suitable for energy-efficient applications.
No-lead terminal form enhances connectivity options and allows for deeper mounting into PCB layers, thus improving thermal performance.
With 8192 words of storage, this IC provides ample memory capacity for various applications, from consumer electronics to industrial control systems.
The 8-bit memory width strikes a good balance between data throughput and implementation complexity, making it versatile for most applications.
Having 8K word capacity ensures that the device can handle substantial data needs efficiently without compromising speed.
A density of 65536 bits allows for efficient data storage, making it suitable for modern applications requiring compact yet effective memory solutions.
This IC serves its core function efficiently as a memory circuit, which is essential for stable performance in various electronic designs.
Other Function Memory ICs ST25TA64K-AB6B3 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Functions:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
ST25TA64K-AB6B3 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Obsolescence/ EOL - DK OBS NOTICE
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
1N4148W-T
Micro Commercial Components
1N4148W-T by Micro Commercial Components is a single rectifier diode with a max reverse recovery time of 0.004 us. It operates b/w -55 to 150 °C and has a max output current of 0.15 A. Ideal for applications requiring fast switching speeds in small outline packages.
1N4148
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
BAV99
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
LM7805CT
Texas Instruments
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
DS9093RB
Analog Devices
MEMORY CIRCUIT; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXSS-X; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED; Terminal Form: UNSPECIFIED;
TC528257J-70
Toshiba
Toshiba TC528257J-70 is a 256Kx8 VIDEO DRAM IC with 2097152-bit memory density. Operating at 5V, it has a max access time of 70ns and consumes up to 160mA. Ideal for applications requiring high-speed video data processing in commercial temperature environments.
DS1993L-F5+
DS1993L-F5+ by Analog Devices is a 4KX1 memory circuit with 4096-bit memory density. It operates in asynchronous mode with power supplies of 3/5V, offering a max access time of 15000ns. This round disk button package IC is ideal for applications requiring non-volatile memory storage in temperature ranges from -40 to 70°C.
M24SR64-YMN6T/2
STMicroelectronics
M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.
CY8C20110-LDX2I
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: VQCCN; Package Shape: SQUARE; No. of Words Code: 2K;
TMS27C64-30
Other Memory ICs;
SN74AS871JD
SN74AS871JD by Texas Instruments is a TTL technology IC with 28 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. The ceramic package body and rectangular shape make it ideal for various other function memory circuits.
M36W108B100ZN1
M36W108B100ZN1 from STMicroelectronics is a mixed memory IC featuring 8Mbit density with FLASH+SRAM technology. It operates asynchronously at voltages b/w 2.7V and 3.6V, with a max access time of 100ns. Ideal for commercial applications requiring compact, high-speed memory solutions.
MR25H256ACDF
Everspin Technologies
MR25H256ACDF by Everspin Technologies is a 32KX8 SPI BUS SERIAL EEPROM memory IC with a memory density of 262144 bits. It operates at a nominal voltage of 3V and has an industrial temperature grade. This memory IC is suitable for applications requiring small outline, heat sink, and very thin profile packages.
M30082040054X0IWAY
Renesas Electronics
Renesas Electronics M30082040054X0IWAY is a 1MX8 MEMORY CIRCUIT IC with 8388608 bit memory density. It operates synchronously at 3V, in a small outline package suitable for surface mounting. With an operating temperature range of -40 to 85 °C, it's ideal for applications requiring high-speed synchronous memory functions.
TMS2150-4JDL
TMS2150-4JDL by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 45ns access time, 145mA max supply current, and 5V nominal voltage. It is ideal for applications requiring fast memory operations in commercial temperature environments.
M28F221-80N6
TMS27C32NL
SSDSA2BW160G301
Intel
Intel's SSDSA2BW160G301 is a MICROELECTRONIC ASSEMBLY with 160GX8 organization, operating in ASYNCHRONOUS mode. It offers 171798691840 words capacity, 1374389534720 bit memory density, and CMOS technology. Ideal for commercial applications requiring high-speed data processing at temperatures ranging from 0 to 70 °C.
DS2411P+T&R
Analog Devices' DS2411P+T&R is a 64-bit memory circuit IC with 64x1 organization. Operating in asynchronous mode, it has a supply voltage range of 1.5V to 5.25V and operates in industrial temperature grades. This small outline package IC is suitable for applications requiring low standby current and compact design.
M36LLR8760T1ZAQF
M36LLR8760T1ZAQF by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
MTFC32GLTDM-WT
Micron Technology
MTFC32GLTDM-WT by Micron Technology is a memory IC with 274877906944 bit density. It operates at temperatures from -25 to 85 °C and has 153 terminals in a square package shape. Ideal for applications requiring power supplies of 1.8/3.3,3/3.3 V and surface mount compatibility.
TMS4C1060-60SD
TMS4C1060-60SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in commercial grade applications requiring reliable memory storage solutions.
TMS2708-35JL
TMS2708-35JL by Texas Instruments is a 1KX8 MOS memory IC with 8192-bit density and 350 ns access time. It features 3-STATE output characteristics, operates b/w 0 to 70 °C, and comes in a ceramic rectangular package. Ideal for applications requiring fast data retrieval in commercial temperature environments.
AT88SC25616C-SU
Atmel
CRYPTO MEMORY; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: MATTE TIN; Qualification: Not Qualified;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ST25DV04K-IER6T3
ST25DV04K-IER6T3 by STMicroelectronics is a 4Kx1 memory IC with 4096-bit memory density. It operates synchronously at 3.3V, suitable for industrial applications. The small outline package has a rectangular shape, 0.65mm terminal pitch, and dual terminal position for surface mount assembly.
ST25DV64K-IER6S3
ST25DV64K-IER6S3 by STMicroelectronics is a 64Kx1 memory circuit with CMOS technology. It operates at 3.3V, has 8 terminals in a small outline package, and can store 65536 bits of data. Ideal for industrial applications requiring synchronous operation and a temperature range from -40 to 85°C.
ST25DV16K-IER6S3
ST25DV16K-IER6S3 by STMicroelectronics is a 16Kx1 memory IC with CMOS technology. It operates synchronously at 3.3V, suitable for industrial applications. With a compact rectangular package style and gull wing terminals, it offers high memory density of 16384 bits for various functions.
ST25DV64K-IER6T3
ST25DV64K-IER6T3 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85 °C and is suitable for industrial applications requiring small outline, thin profile ICs.
ST25DV04K-IER6S3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ST25DV16K-IER6T3
ST25DV16K-IER6T3 by STMicroelectronics is a 16KX1 MEMORY CIRCUIT with 16384 bit Memory Density. It operates at 3.3V, -40 to 85 °C temperature range, in SYNCHRONOUS mode. Ideal for industrial applications requiring small outline, thin profile ICs with shrink pitch package style.
ST25DV04K-JFR6D3
ST25DV04K-JFR6D3 by STMicroelectronics is a 4Kx1 memory circuit with 4096-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C and comes in a small outline package for industrial applications. With synchronous operation and no-lead terminals, it is suitable for various IoT and RFID systems.
ST25DV04K-IER6C3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Position: DUAL;
ST25DV64K-JFR6D3
ST25DV64K-JFR6D3 by STMicroelectronics is a 64Kx1 memory IC with CMOS technology. It operates synchronously at 3.3V, suitable for industrial applications. With a small outline package and dual terminals, it offers a memory density of 65536 bits for various electronic devices.
ST25DV16K-JFR6D3
ST25DV16K-JFR6D3 by STMicroelectronics is a 16Kx1 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 85°C and a package style of small outline, heat sink/slug, very thin profile. Ideal for industrial applications requiring high memory density and synchronous operation in a compact square package.
ST25DV04K-JFR6L3
MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ST25DV04K-JFR6U3
ST25DV04K-JFR8C3
MEMORY CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
ST25DV04K-IER8C3
ST25DV16K-IER6C3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
ST25DV16K-IER6D3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 12; Package Code: HVSON; Package Shape: SQUARE; Terminal Position: DUAL;
ST25DV04K-IER6L3
ST25DV04K-JFR6C3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
ST25DV16K-IER6G3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 16KX1; Memory Width: 1;
ST25DV04K-IER6D3
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 12; Package Code: HVSON; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
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