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ST25TA02KP-C6C5

STMicroelectronics

ST25TA02KP-C6C5 by STMicroelectronics

ST25TA02KP-C6C5 from STMicroelectronics is a compact, dual-terminal memory IC with a 256x8 organization and operates asynchronously. It features an industrial temperature range of -40 °C to 85 °C and comes in a very thin profile package. Ideal for space-constrained applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,681 parts In-Stock

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6,681

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Digiode

USA . 4,962 parts In-Stock

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4,962

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Anansix

USA . 819 parts In-Stock

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819

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,190 parts In-Stock

1+ parts

$3.716

100+ parts

-

1k+ parts

$3.344

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1,190

$3.716

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$3.344

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MKK Technologies

India . 131 parts In-Stock

1+ parts

$6.987

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131

$6.987

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DigiPath Technology Company

USA . 131 parts In-Stock

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$6.987

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131

$6.987

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AZTECH Wire

Italy . 252 parts In-Stock

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$9.440

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252

$9.440

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Corphita

USA . 3,179 parts In-Stock

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3,179

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Parana Technologies

USA . 1,094 parts In-Stock

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$4.443

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1,094

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$4.443

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Perfect Parts

USA . 18 parts In-Stock

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18

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Overview

Unlock the potential of your projects with the ST25TA02KP-C6C5 from STMicroelectronics—where innovation meets reliability. This sleek, dual-terminal memory IC combines top-notch quality with industrial-grade performance, ensuring seamless operation even in extreme conditions. Perfect for various applications, its compact design allows for efficient integration, delivering exceptional value and efficiency to elevate your next big idea!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances the reliability and longevity of the memory IC, making it suitable for various applications.

Surface Mount: YES

Surface-mounted technology allows for compact designs and improved PCB layout, saving space in electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout efficiency and aids in maximizing circuit board real estate.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides faster response times and allows simpler interfacing with other components.

No. of Terminals: 8

Having 8 terminals ensures sufficient connectivity for diverse applications, facilitating easier integration into circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile and small outline make this product ideal for space-constrained applications, including portable devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in industrial and harsh environments.

Organization: 256X8

This organization format indicates a well-structured data layout, enabling efficient data handling and retrieval.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40 °C makes this memory IC versatile for extreme conditions.

Terminal Position: DUAL

Dual terminal positioning allows for easier soldering and enhanced connection stability, which is crucial for performance.

Maximum Seated Height: 0.6 mm

A low seated height supports high-density applications, making it an excellent choice for modern compact circuits.

Width: 2 mm

The compact width facilitates integration into smaller devices while maintaining functionality.

Length: 3 mm

Short length contributes to a compact footprint, enabling the design of smaller gadgets with intricate circuitry.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this memory IC guarantees robust performance and reliability under demanding conditions.

Technology: CMOS

CMOS technology provides low-power consumption and high-speed operation, ideal for battery-operated devices.

Terminal Form: NO LEAD

The no-lead design improves thermal efficiency and simplifies manufacturing processes, making it environmentally friendly.

No. of Words: 256 words

Offering 256 words of storage is suitable for applications requiring moderate data capacity with effective retrieval.

Memory Width: 8

An 8-bit memory width allows for efficient data processing capabilities, suitable for many embedded applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports modern compact designs, allowing for high-density placements on PCBs.

No. of Words Code: 256

This specification ensures that the IC can handle specific applications that require structured data management.

Memory Density: 2048 bit

2048 bits of memory density is beneficial for a variety of applications needing economical data storage solutions.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit, this IC is tailored for efficient data storage and retrieval, making it essential in many electronic applications.

Technical Specifications

Other Function Memory ICs ST25TA02KP-C6C5 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

ST25TA02KP-C6C5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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