Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DSM2180F3V-15T6 from STMicroelectronics is a 128Kx8 CMOS memory IC designed for industrial applications. It operates asynchronously with a supply voltage range of 3-3.6V and features a compact flatpack design. With a max temp of 85 °C, it ensures reliability in demanding environments.
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$0.437
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Northwest PG Solutions
$0.480
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IDEA Electronic Components Group
$5.384
$4.845
Microchip USA
$8.275
MKK Technologies
$10.124
DigiPath Technology Company
AZTECH Wire
$21.830
Component Stockers USA
$99.990
Parana Technologies
$6.437
Corphita
The use of plastic/epoxy material provides durability and reliability, making the product suitable for various industrial environments.
Surface mount technology allows for easier integration into modern circuit boards, enabling more compact designs.
A square package shape simplifies PCB layout and maximizes space efficiency for compact device designs.
Asynchronous operation allows for faster data access without the need for clock synchronization, improving overall system efficiency.
Operating at a nominal supply voltage of 3.3V ensures compatibility with low-power electronic systems.
A higher number of terminals increases connectivity options, supporting complex applications.
Flatpack style supports low-profile applications, making it ideal for space-constrained designs.
With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where higher heat tolerance is required.
The memory organization of 128Kx8 allows efficient data storage and retrieval for complex applications.
A minimum operating temperature of -40 °C enables the product to function in harsh, low-temperature environments.
Nickel palladium gold finish enhances solderability and corrosion resistance, ensuring long-term reliability.
Quad terminal positions provide flexibility in layout design and are suited for high-density applications.
A low maximum seated height allows for more compact device designs, reducing overall product thickness.
A width of 10 mm is ideal for streamlined designs, fitting well into compact and space-sensitive circuits.
The capability to operate at a minimum voltage of 3V enhances its versatility across different power levels.
With a length of 10 mm, this IC can be effectively integrated into compact electronic systems.
The industrial temperature grade ensures reliability in demanding environments, suitable for commercial and industrial use.
CMOS technology offers low power consumption and high-speed operation, making this product energy efficient.
Gull wing terminal form provides excellent mechanical stability and soldering characteristics for reliable connections.
A capacity of 131072 words allows for substantial data storage, suitable for a wide range of applications.
An 8-bit memory width aligns with standard data processing efficiencies, supporting versatile applications.
The 0.65 mm terminal pitch enables higher density layouts, maximizing the use of PCB space.
The 128K words code capacity indicates a robust data handling ability for complex systems.
The ability to handle up to 3.6V ensures compatibility with various power supply configurations.
With a memory density of 1Mbit, it can accommodate a wide range of data storage needs, making it versatile for numerous applications.
As a memory circuit type, it is optimized for efficient storage solutions in various electronic applications.
Other Function Memory ICs DSM2180F3V-15T6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
JESD-30 Code:
JESD-609 Code:
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Operating Mode:
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Organization:
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DSM2180F3V-15T6 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
BAV99
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
MC7805CTG
Onsemi
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
AB26TRB-32.768KHZ--T
Abracon
AB26TRB-32.768KHZ--T by Abracon is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 35000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency in surface mount configurations.
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
Surge Components
National Semiconductor
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
Philips Components
MTFC16GLTAM-WT
Micron Technology
MTFC16GLTAM-WT by Micron Technology is a memory IC with 137TB density, operating at -25 to 85°C. It has 153 terminals in a square package shape for surface mounting. Ideal for applications requiring high memory capacity and reliable performance in various temperature conditions.
M36W108B100ZN6
STMicroelectronics
M36W108B100ZN6 from STMicroelectronics is a mixed memory IC featuring 1M x 8 organization with Flash+SRAM technology. It operates asynchronously at supply voltages of 2.7V to 3.6V and supports industrial applications with a max temp of 85 °C. Its compact design (11.8mm x 9.8mm) ensures efficient space utilization in electronic devices.
M36W108B120ZM1T
M36W108B120ZM1T by STMicroelectronics is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. It operates in asynchronous mode, has a CMOS technology, and supports a supply voltage range of 2.7V to 3.6V. This low-profile grid array package is suitable for various commercial applications requiring high-density memory solutions.
DS2401A+
Maxim Integrated
MEMORY CIRCUIT;
DS2411P
DS2411P by Maxim Integrated is a 64-bit memory circuit IC with 6 terminals. It operates asynchronously at temperatures ranging from -40 to 85°C, ideal for industrial applications. With a supply voltage of 1.5-5.25V and low standby current of 0.000001A, it offers reliable performance in compact small outline packaging.
SN74LS600ADW
Texas Instruments
SN74LS600ADW by Texas Instruments is a 16KX1 memory circuit IC with TTL technology. Operating at 5V, it has 16384-bit memory density and functions in asynchronous mode. This small outline package is ideal for applications requiring reliable memory storage in commercial temperature environments.
27C64
Thomson-csf Compsants Specific
Other Memory ICs;
MR0A16ACYS35
Freescale Semiconductor
MR0A16ACYS35 by Freescale Semiconductor is a 256Kx16 memory IC with CMOS technology. It operates at 3.3V, has 44 terminals, and a package size of 18.41mm x 10.16mm x 1.2mm. Suitable for industrial applications requiring fast access time of 35ns and low standby current of 0.028Amp.
DS2411AR+T&R
Analog Devices
MEMORY CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
MR44V064BMAZAATL
Lapis Semiconductor
MR44V064BMAZAATL by Lapis Semiconductor is a synchronous memory IC with 8Kx8 organization and 65536-bit memory density. Operating at 3.3V, it has a temperature range of -40 to 85°C, making it suitable for industrial applications requiring small outline, low profile packages in a rectangular shape.
M36LLR8760D1ZAQE
M36LLR8760D1ZAQE by STMicroelectronics is a low-profile, asynchronous memory IC featuring 16M words of mixed FLASH+PSRAM. It operates at a nominal voltage of 1.8V and supports temperatures from -25 °C to 85 °C. Ideal for compact applications requiring efficient data storage and retrieval.
SMJ27L08-45JM
The Texas Instruments SMJ27L08-45JM is a 1Kx8 OTP ROM memory IC with 3-STATE output. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. With a memory density of 8192 bits and max access time of 450ns, it offers reliable performance in harsh environments.
TMS27PC32-150NE
SNC54LS170J
SNC54LS170J by Texas Instruments is a MIL-STD-883 Class B (Modified) memory IC with 16 terminals, operating at temperatures from -55°C to 125°C. It has a supply voltage of 5V and uses TTL technology. Ideal for military applications requiring reliable performance in harsh environments.
TMS27PC49-5TL
CY15B104QSN-108SXIES
Infineon Technologies
CY15B104QSN-108SXIES by Infineon Technologies is a 512Kx8 memory IC with synchronous operation. It has a memory density of 4,194,304 bits and operates at a nominal voltage of 3V. This small outline package is ideal for industrial applications requiring reliable memory storage in compact spaces.
TMS4025NC
TMS4025NC by Texas Instruments is a 1KX2 MOS memory IC with 2048-bit density. It operates b/w -25°C to 70°C, featuring separate I/O and open-drain output characteristics. This rectangular package with 24 terminals in-line is ideal for applications requiring reliable memory storage.
TMS4C1060-30DJ
TMS4C1060-30DJ by Texas Instruments is a 20-terminal memory IC with 5V supply, operating b/w 0-70°C. It features a max access time of 25ns and standby current of 0.01A. Ideal for commercial applications requiring fast memory circuits in small outline packages.
TMS4C1060-60SD
TMS4C1060-60SD by Texas Instruments is a 20-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in commercial grade applications requiring reliable memory storage solutions.
M36W108B120ZN5T
STMicroelectronics M36W108B120ZN5T is a 1MX8 memory IC with 8388608 bit memory density. It operates in asynchronous mode, with a supply voltage range of 2.7V to 3.6V. This GRID ARRAY package is suitable for applications requiring high memory capacity and low profile design.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DSM2190F4V-15K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Terminal Form: J BEND;
DSM2150F5V-12T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: TFQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
DSM2150F5V-12T6T
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: TFQFP; Package Shape: SQUARE; Memory Width: 16;
DSM2180F3V-15K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
DSM2180F3V-90T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
DSM2180F3-90T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 5.5 V;
DSM2180F3-90K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Qualification: Not Qualified;
DSM2180F3-15K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; JESD-30 Code: S-PQCC-J52;
DSM2180F3V-90K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
DSM2180F3-15T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Terminal Form: GULL WING;
DSM2190F4V-15T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Memory Density: 2097152 bit;
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