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DSM2180F3V-15T6

STMicroelectronics

DSM2180F3V-15T6 by STMicroelectronics

DSM2180F3V-15T6 from STMicroelectronics is a 128Kx8 CMOS memory IC designed for industrial applications. It operates asynchronously with a supply voltage range of 3-3.6V and features a compact flatpack design. With a max temp of 85 °C, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,965 parts In-Stock

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Anansix

USA . 1,982 parts In-Stock

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1,982

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Digiode

USA . 581 parts In-Stock

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581

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Distributors (Availability)

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Native Components

USA . 73 parts In-Stock

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$0.437

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-

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$0.419

73

$0.437

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$0.419

Northwest PG Solutions

USA . 282 parts In-Stock

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$0.480

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$0.424

282

$0.480

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$0.424

IDEA Electronic Components Group

UK . 2,183 parts In-Stock

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$5.384

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$4.845

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2,183

$5.384

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$4.845

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Microchip USA

USA . 435 parts In-Stock

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$8.275

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435

$8.275

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MKK Technologies

India . 2,286 parts In-Stock

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$10.124

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2,286

$10.124

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DigiPath Technology Company

USA . 2,286 parts In-Stock

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$10.124

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2,286

$10.124

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AZTECH Wire

Italy . 911 parts In-Stock

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$21.830

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911

$21.830

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Component Stockers USA

USA . 499 parts In-Stock

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$99.990

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499

$99.990

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Parana Technologies

USA . 2,353 parts In-Stock

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$6.437

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2,353

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$6.437

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Corphita

USA . 2,173 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the DSM2180F3V-15T6 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality memory IC is designed for demanding industrial applications, ensuring robust operation in extreme temperatures. Its advanced asynchronous design offers seamless integration, maximizing efficiency while minimizing power consumption. Elevate your projects with a trusted partner that guarantees quality and superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability, making the product suitable for various industrial environments.

Surface Mount: YES

Surface mount technology allows for easier integration into modern circuit boards, enabling more compact designs.

Package Shape: SQUARE

A square package shape simplifies PCB layout and maximizes space efficiency for compact device designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access without the need for clock synchronization, improving overall system efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with low-power electronic systems.

No. of Terminals: 52

A higher number of terminals increases connectivity options, supporting complex applications.

Package Style (Meter): FLATPACK

Flatpack style supports low-profile applications, making it ideal for space-constrained designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where higher heat tolerance is required.

Organization: 128KX8

The memory organization of 128Kx8 allows efficient data storage and retrieval for complex applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C enables the product to function in harsh, low-temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positions provide flexibility in layout design and are suited for high-density applications.

Maximum Seated Height: 2.35 mm

A low maximum seated height allows for more compact device designs, reducing overall product thickness.

Width: 10 mm

A width of 10 mm is ideal for streamlined designs, fitting well into compact and space-sensitive circuits.

Minimum Supply Voltage (Vsup): 3 V

The capability to operate at a minimum voltage of 3V enhances its versatility across different power levels.

Length: 10 mm

With a length of 10 mm, this IC can be effectively integrated into compact electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in demanding environments, suitable for commercial and industrial use.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making this product energy efficient.

Terminal Form: GULL WING

Gull wing terminal form provides excellent mechanical stability and soldering characteristics for reliable connections.

No. of Words: 131072 words

A capacity of 131072 words allows for substantial data storage, suitable for a wide range of applications.

Memory Width: 8

An 8-bit memory width aligns with standard data processing efficiencies, supporting versatile applications.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch enables higher density layouts, maximizing the use of PCB space.

No. of Words Code: 128K

The 128K words code capacity indicates a robust data handling ability for complex systems.

Maximum Supply Voltage (Vsup): 3.6 V

The ability to handle up to 3.6V ensures compatibility with various power supply configurations.

Memory Density: 1048576 bit

With a memory density of 1Mbit, it can accommodate a wide range of data storage needs, making it versatile for numerous applications.

Memory IC Type: MEMORY CIRCUIT

As a memory circuit type, it is optimized for efficient storage solutions in various electronic applications.

Technical Specifications

Other Function Memory ICs DSM2180F3V-15T6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSM2180F3V-15T6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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