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DSM2180F3V-90T6

STMicroelectronics

DSM2180F3V-90T6 by STMicroelectronics

DSM2180F3V-90T6 from STMicroelectronics is a 128Kx8 asynchronous memory IC with a supply voltage range of 3.0-3.6V, ideal for industrial applications. It features a compact flatpack design and operates within -40 °C to 85°C. This CMOS device ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,413 parts In-Stock

1+ parts

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3,413

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Vyrian

USA . 2,716 parts In-Stock

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2,716

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Anansix

USA . 356 parts In-Stock

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356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,985 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

$2.286

10k+ parts

-

1,985

$2.540

-

$2.286

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MKK Technologies

India . 2,062 parts In-Stock

1+ parts

$4.777

100+ parts

-

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2,062

$4.777

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DigiPath Technology Company

USA . 2,062 parts In-Stock

1+ parts

$4.777

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-

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2,062

$4.777

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Native Components

USA . 729 parts In-Stock

1+ parts

$10.753

100+ parts

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729

$10.753

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Northwest PG Solutions

USA . 1,762 parts In-Stock

1+ parts

$11.829

100+ parts

$10.646

1k+ parts

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1,762

$11.829

$10.646

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Corphita

USA . 4,730 parts In-Stock

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4,730

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Parana Technologies

USA . 921 parts In-Stock

1+ parts

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$3.037

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921

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$3.037

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Overview

Unlock superior performance with the DSM2180F3V-90T6 from STMicroelectronics, a leader in innovative memory solutions. This high-quality asynchronous memory IC enhances reliability and efficiency across diverse applications, from industrial automation to consumer electronics. With robust temperature resilience and a compact design, it ensures seamless integration and lasting durability, providing exceptional value that empowers your next project to thrive. Choose innovation; choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB designs, improving overall system efficiency and performance.

Package Shape: SQUARE

The square package shape can optimize space usage on the circuit board, which is beneficial for compact electronic designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access times, enhancing the overall speed of data processing in applications.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3 V is common in modern electronics, providing compatibility with a wide range of systems.

No. of Terminals: 52

With 52 terminals, this IC supports a variety of functionalities and connections, making it versatile for different applications.

Package Style (Meter): FLATPACK

The flatpack style allows for stable mounting and good thermal performance, making it efficient for various electronic devices.

Maximum Operating Temperature: 85 °C

Operation at high temperatures (up to 85 °C) ensures reliability in industrial environments and applications subject to heat.

Organization: 128KX8

This organization provides sufficient memory capacity for handling complex data requirements in various applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures (-40 °C) ensures functionality in extreme cold environments, enhancing reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish enhances conductivity and corrosion resistance, leading to longer lifespan and better performance.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient connection and enables easier routing on PCB, essential for modern compact layouts.

Maximum Seated Height: 2.35 mm

A low seated height allows for a more compact design in multi-layer boards, saving space in tighter electronic assemblies.

Width: 10 mm

The 10 mm width is suited for fitting into standard PCB layouts, ensuring broad compatibility with existing designs.

Minimum Supply Voltage (Vsup): 3 V

Operating with a minimum of 3 V allows it to function effectively in lower voltage applications, enhancing versatility.

Length: 10 mm

The compact length of 10 mm works well for space-constrained applications, making it ideal for portable devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh environments, making this product suitable for industrial applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making it a top choice for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals provide a robust connection with good mechanical stability, ensuring reliable performance in assembly.

No. of Words: 131072 words

A capacity of 131072 words allows for storing large amounts of data, suitable for applications like data logging and processing.

Memory Width: 8

With a memory width of 8 bits, this IC can efficiently process data in standard byte-size chunks, making data handling smoother.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch supports modern PCB designs and is suitable for high-density applications, enhancing the design flexibility.

No. of Words Code: 128K

A code of 128K words suggests a significant storage capability for applications requiring substantial memory resources.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage flexibility (up to 3.6 V) ensures adaptability in various systems without compromising performance.

Memory Density: 1048576 bit

A high memory density of 1048576 bits provides ample storage space for data-intensive applications, making it a valuable component.

Memory IC Type: MEMORY CIRCUIT

Being categorized as a memory circuit highlights its core functionality in storing and retrieving data, essential for most electronic designs.

Technical Specifications

Other Function Memory ICs DSM2180F3V-90T6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSM2180F3V-90T6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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