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DSM2180F3-15T6

STMicroelectronics

DSM2180F3-15T6 by STMicroelectronics

DSM2180F3-15T6 from STMicroelectronics is a 128Kx8 asynchronous memory IC designed for industrial applications. It operates at a nominal voltage of 5V, with a temperature range of -40 °C to 85°C. This surface-mount device features a compact flatpack design and offers high reliability with nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,139 parts In-Stock

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4,139

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Digiode

USA . 2,874 parts In-Stock

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Anansix

USA . 1,274 parts In-Stock

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1,274

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IDEA Electronic Components Group

UK . 1,170 parts In-Stock

1+ parts

$1.888

100+ parts

-

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$1.699

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1,170

$1.888

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$1.699

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Northwest PG Solutions

USA . 1,672 parts In-Stock

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$3.433

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$3.433

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MKK Technologies

India . 259 parts In-Stock

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$3.550

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259

$3.550

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DigiPath Technology Company

USA . 259 parts In-Stock

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$3.550

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259

$3.550

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Corphita

USA . 1,647 parts In-Stock

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Native Components

USA . 538 parts In-Stock

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$3.027

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Parana Technologies

USA . 456 parts In-Stock

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$2.257

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Overview

Unlock the potential of your next project with the DSM2180F3-15T6 from STMicroelectronics, a leader in innovation and reliability. This versatile memory IC delivers superior performance in demanding environments, ensuring seamless operation in a range of applications from industrial automation to consumer electronics. With robust temperature tolerance and a compact design, it offers exceptional value, enhancing product longevity and efficiency while simplifying your development process. Choose quality that empowers your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for a more compact design and simplifies the assembly process in modern electronics.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, accommodating dense configurations in electronic devices.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler control logic, enhancing design flexibility and ease of integration into systems.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V ensures compatibility with a wide range of devices, simplifying power management in designs.

No. of Terminals: 52

A greater number of terminals provide additional flexibility for connections, enabling more complex configurations.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile which is advantageous for space-constrained applications and provides efficient heat dissipation.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for industrial applications where higher temperatures can occur.

Organization: 128KX8

An organization of 128KX8 allows for efficient data storage and retrieval, supporting various applications, including data logging and buffering.

Minimum Operating Temperature: -40 °C

This part's ability to function at -40 °C makes it ideal for harsh environments and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel-palladium-gold plating ensures excellent corrosion resistance and solderability, contributing to the longevity and reliability of the connections.

Terminal Position: QUAD

The quad terminal position facilitates a stable and robust connection, enhancing the overall reliability of the IC.

Maximum Seated Height: 2.35 mm

A low seated height allows this IC to fit in slim designs, essential for modern slim-profile devices and space-saving applications.

Width: 10 mm

With a width of 10 mm, it’s compact enough for various designs, ensuring it can fit in tighter spaces without sacrificing performance.

Minimum Supply Voltage: 4.5V

The minimum supply voltage of 4.5V provides flexibility in power supply design, accommodating a variety of power sources.

Length: 10 mm

A length of 10 mm contributes to a compact package, suitable for space-saving applications where board real-estate is at a premium.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates reliability in extreme environmental conditions, making it ideal for industrial and commercial applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance, making this memory IC efficient for various applications.

Terminal Form: GULL WING

Gull wing terminals offer excellent solderability and stability, ensuring reliable connections on PCBs.

No. of Words: 131072 words

With 131072 words, this memory IC offers substantial storage capacity for applications requiring significant data handling.

Memory Width: 8

An 8-bit memory width provides a balance between performance and efficiency, making it suitable for many general-data applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact designs while ensuring ease of access for soldering and testing.

No. of Words Code: 128K

With a code of 128K words, it allows for efficient data management in applications that require a decent amount of non-volatile memory.

Maximum Supply Voltage: 5.5V

The maximum supply voltage of 5.5V provides safe overhead for operation, ensuring robust performance without risking damage to the IC.

Memory Density: 1048576 bit

The memory density of 1048576 bits allows for diverse applications, providing adequate space for data storage in embedded systems.

Memory IC Type: MEMORY CIRCUIT

Being classified as a memory circuit, this IC is essential in any computing or processing system, providing a reliable means of storing data.

Technical Specifications

Other Function Memory ICs DSM2180F3-15T6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSM2180F3-15T6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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