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DSM2180F3-15K6

STMicroelectronics

DSM2180F3-15K6 by STMicroelectronics

DSM2180F3-15K6 by STMicroelectronics is a 128Kx8 CMOS memory IC designed for industrial applications. It operates asynchronously with a supply voltage range of 4.5V to 5.5V and features a compact square chip carrier package. With a max temp of 85 °C, it's ideal for robust environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,477 parts In-Stock

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Vyrian

USA . 393 parts In-Stock

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393

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Digiode

USA . 326 parts In-Stock

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326

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Native Components

USA . 471 parts In-Stock

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$0.528

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471

$0.528

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Northwest PG Solutions

USA . 896 parts In-Stock

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$0.581

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IDEA Electronic Components Group

UK . 982 parts In-Stock

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$5.103

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$4.593

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982

$5.103

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$4.593

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MKK Technologies

India . 1,373 parts In-Stock

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$9.596

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DigiPath Technology Company

USA . 1,373 parts In-Stock

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$9.596

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Corphita

USA . 2,422 parts In-Stock

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Parana Technologies

USA . 2,169 parts In-Stock

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$6.102

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Overview

Unlock the power of innovation with the DSM2180F3-15K6 from STMicroelectronics, a trusted leader in semiconductor solutions. This high-performance memory IC is designed for versatile applications, offering exceptional reliability and efficiency in harsh environments. With its robust temperature range and compact design, it ensures seamless operation that meets industrial standards, delivering unmatched value to your projects. Experience quality you can depend on, empowering your designs with performance and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration into compact circuit designs, optimizing space and enabling high-density assembly.

Package Shape: SQUARE

The square shape simplifies layout design and provides uniform thermal and mechanical performance, ensuring reliability.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access without the need for clock synchronization, enhancing system responsiveness.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V is widely used and ensures compatibility with various standard systems, facilitating easy adoption.

No. of Terminals: 52

52 terminals provide ample connections for data and control signals, offering flexibility for a wide range of applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging allows for efficient thermal dissipation and is suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

The operating temperature range up to 85 °C makes it suitable for industrial environments that may involve higher thermal conditions.

Organization: 128KX8

The 128Kx8 memory organization provides a balanced structure for storing and retrieving data efficiently, enhancing performance.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme cold environments, making it ideal for industrial use.

Terminal Finish: MATTE TIN

Matte tin terminal finish reduces soldering defects and improves reliability, ensuring quality connections in assembly.

Terminal Position: QUAD

Quad terminal positioning allows for optimal footprint on PCBs, enhancing layout flexibility and reducing board space.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm ensures compatibility with low-profile designs, making it suitable for space-constrained applications.

Width: 19.1262 mm

A compact width of 19.1262 mm enables integration into space-sensitive designs, facilitating modern electronics applications.

Minimum Supply Voltage (Vsup): 4.5 V

Supporting a minimum supply voltage of 4.5 V ensures versatility in power supply designs, accommodating various systems.

Length: 19.1262 mm

The uniform length of 19.1262 mm complements the width, providing a square form factor that's advantageous for layout design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies durability and reliability under harsh conditions, ideal for demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it suitable for a wide range of electronic devices.

Terminal Form: J BEND

J bend terminal form facilitates reliable soldering and easy assembly, enhancing manufacturability and performance.

No. of Words: 131072 words

With 131072 words, it provides substantial data storage capability, making it ideal for many data-driven applications.

Memory Width: 8

An 8-bit memory width allows for efficient processing and alignment with common data architectures, enhancing compatibility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between density and ease of assembly, providing flexibility in design.

No. of Words Code: 128K

The 128K words code offers a compact and efficient memory arrangement, suitable for various digital applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures robust operation within a safe range, providing design reliability.

Memory Density: 1048576 bit

A memory density of 1048576 bits enables substantial data storage, making it suitable for applications requiring large memory capacity.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, it is optimized for data storage tasks, providing efficient and reliable performance in various applications.

Technical Specifications

Other Function Memory ICs DSM2180F3-15K6 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1262 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

52

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.1262 mm

Trade Compliance

DSM2180F3-15K6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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