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DSM2150F5V-12T6T

STMicroelectronics

DSM2150F5V-12T6T by STMicroelectronics

DSM2150F5V-12T6T by STMicroelectronics is a 256Kx16 asynchronous memory IC with a supply voltage range of 3.0-3.6V. It features an industrial temperature grade (-40 °C to 85°C) and comes in a thin profile flatpack package. Ideal for various applications requiring reliable memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,649 parts In-Stock

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Anansix

USA . 2,053 parts In-Stock

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2,053

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Digiode

USA . 232 parts In-Stock

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232

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IDEA Electronic Components Group

UK . 516 parts In-Stock

1+ parts

$3.709

100+ parts

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$3.338

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516

$3.709

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MKK Technologies

India . 2,210 parts In-Stock

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$6.974

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2,210

$6.974

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DigiPath Technology Company

USA . 2,210 parts In-Stock

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$6.974

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2,210

$6.974

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Northwest PG Solutions

USA . 1,320 parts In-Stock

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1,320

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Parana Technologies

USA . 1,121 parts In-Stock

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$4.434

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$4.434

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Native Components

USA . 855 parts In-Stock

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Corphita

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Overview

Unlock your project's potential with the DSM2150F5V-12T6T from STMicroelectronics, a leader in innovative memory solutions. This cutting-edge asynchronous memory IC combines robust performance with superior reliability, ensuring seamless operation even in demanding environments. Ideal for industrial applications, its compact design and efficient power usage make it a smart choice for engineers seeking quality and value. Choose STMicroelectronics for excellence that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a compact design and simplifies the manufacturing process, enhancing efficiency in production.

Package Shape: SQUARE

A square package shape optimizes space utilization on circuit boards, making it easier to integrate into a variety of designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in data handling and reduces latency, beneficial for high-speed applications.

Nominal Supply Voltage / Vsup: 3.3 V

A nominal supply voltage of 3.3 V is ideal for modern electronic devices, ensuring compatibility and efficient power consumption.

No. of Terminals: 80

With 80 terminals, this IC offers ample connectivity options, making it versatile for various applications and designs.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile design with fine pitch allows for high density and compact PCB layouts, making it suitable for space-constrained designs.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C is favorable for industrial environments, ensuring reliable performance under elevated temperature conditions.

Organization: 256KX16

With a memory organization of 256Kx16, it provides efficient data storage capabilities, suitable for a variety of computing tasks.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C makes this IC suitable for extreme conditions, ensuring reliability in harsh environments.

Terminal Position: QUAD

Quad terminal position enhances connection efficiency and stability, making it easier to mount on PCBs for reliable operation.

Maximum Seated Height: 1.2 mm

A maximum seated height of just 1.2 mm helps save valuable vertical space in compact designs, facilitating dense module arrangements.

Width: 12 mm

A width of 12 mm contributes to a compact form factor, ideal for space-constrained applications while maintaining performance.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3 V allows for flexibility in power supply options, accommodating different system requirements.

Length: 12 mm

At 12 mm in length, this IC offers a balanced footprint for efficient use of space on PCBs without compromising on capacity.

Temperature Grade: INDUSTRIAL

An industrial temperature grade assures durability and performance in harsh and fluctuating environmental conditions.

Technology: CMOS

CMOS technology serves low power consumption and high-speed operation, making this product suitable for advanced electronic applications.

Terminal Form: GULL WING

Gull wing terminals ensure ease of soldering and greater robustness against mechanical stresses during installation, enhancing reliability.

No. of Words: 262144 words

With 262144 words available, it provides a substantial amount of data storage for applications requiring significant memory capacity.

Memory Width: 16

A memory width of 16 bits helps in efficient data processing, crucial for applications that require quick data retrieval.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is conducive to high-density designs, permitting smaller and more compact PCBs while ensuring reliable connections.

No. of Words Code: 256K

Providing 256K words of memory allows for flexible and extensive data management, suitable for a variety of applications.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides an added margin for power supply variability while ensuring stable performance.

Memory Density: 4194304 bit

A memory density of 4194304 bits indicates high storage capability, making this IC suitable for data-intensive applications.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, this product caters specifically to memory applications, ensuring optimized performance in its intended use.

Technical Specifications

Other Function Memory ICs DSM2150F5V-12T6T attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO CONTAINS 32K BYTE OF SECONDARY FLASH MEMORY

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

80

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

DSM2150F5V-12T6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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