Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DSM2150F5V-12T6T by STMicroelectronics is a 256Kx16 asynchronous memory IC with a supply voltage range of 3.0-3.6V. It features an industrial temperature grade (-40 °C to 85°C) and comes in a thin profile flatpack package. Ideal for various applications requiring reliable memory solutions.
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The use of plastic/epoxy in the package body ensures durability and protection against environmental factors, making it suitable for various applications.
Surface mount capability allows for a compact design and simplifies the manufacturing process, enhancing efficiency in production.
A square package shape optimizes space utilization on circuit boards, making it easier to integrate into a variety of designs.
Asynchronous operation provides flexibility in data handling and reduces latency, beneficial for high-speed applications.
A nominal supply voltage of 3.3 V is ideal for modern electronic devices, ensuring compatibility and efficient power consumption.
With 80 terminals, this IC offers ample connectivity options, making it versatile for various applications and designs.
The flatpack, thin profile design with fine pitch allows for high density and compact PCB layouts, making it suitable for space-constrained designs.
Operating up to 85 °C is favorable for industrial environments, ensuring reliable performance under elevated temperature conditions.
With a memory organization of 256Kx16, it provides efficient data storage capabilities, suitable for a variety of computing tasks.
The capability to operate at temperatures as low as -40 °C makes this IC suitable for extreme conditions, ensuring reliability in harsh environments.
Quad terminal position enhances connection efficiency and stability, making it easier to mount on PCBs for reliable operation.
A maximum seated height of just 1.2 mm helps save valuable vertical space in compact designs, facilitating dense module arrangements.
A width of 12 mm contributes to a compact form factor, ideal for space-constrained applications while maintaining performance.
The minimum supply voltage of 3 V allows for flexibility in power supply options, accommodating different system requirements.
At 12 mm in length, this IC offers a balanced footprint for efficient use of space on PCBs without compromising on capacity.
An industrial temperature grade assures durability and performance in harsh and fluctuating environmental conditions.
CMOS technology serves low power consumption and high-speed operation, making this product suitable for advanced electronic applications.
Gull wing terminals ensure ease of soldering and greater robustness against mechanical stresses during installation, enhancing reliability.
With 262144 words available, it provides a substantial amount of data storage for applications requiring significant memory capacity.
A memory width of 16 bits helps in efficient data processing, crucial for applications that require quick data retrieval.
A terminal pitch of 0.5 mm is conducive to high-density designs, permitting smaller and more compact PCBs while ensuring reliable connections.
Providing 256K words of memory allows for flexible and extensive data management, suitable for a variety of applications.
A maximum supply voltage of 3.6 V provides an added margin for power supply variability while ensuring stable performance.
A memory density of 4194304 bits indicates high storage capability, making this IC suitable for data-intensive applications.
As a dedicated memory circuit, this product caters specifically to memory applications, ensuring optimized performance in its intended use.
Other Function Memory ICs DSM2150F5V-12T6T attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
Additional Features:
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DSM2150F5V-12T6T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
ULN2803ADWG4
Texas Instruments
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
SMBJ18CA
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
1N4148WS
First Components International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
261
Deltrol Controls
Other Relays;
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
SMJ27C128-30J
Other Memory ICs;
TMS27PC291-50N
M36W108T120ZN5T
STMicroelectronics M36W108T120ZN5T is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. It operates in asynchronous mode, with a supply voltage range of 2.7V to 3.6V. This GRID ARRAY package has a very thin profile, suitable for applications requiring high memory capacity in compact spaces.
SN74AS870NT1
SN74AS870NT1 by Texas Instruments is a TTL technology IC with 24 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. The rectangular plastic/epoxy body makes it ideal for various other function memory circuits.
CY15B102Q-SXET
Infineon Technologies
Infineon's CY15B102Q-SXET is a 256Kx8 memory IC with synchronous operation, suitable for automotive applications. It operates at 3.3V with power supplies of 2.5/3.3V, featuring a small outline package style and Gull Wing terminal form. With a max operating temperature of 125°C, it offers high memory density of 2097152 bits for reliable performance in automotive environments.
TMS27C291-45N
TMX27PC128N20
DS2401-SL+T&R
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Memory Density: 64 bit;
TMS27C32-2NE
DS1992L-F5+
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; JESD-30 Code: O-MEDB-N2; Maximum Supply Voltage (Vsup): 6 V;
S27KS0641DPBHI020
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
TMS44C251-15DJ
TMS44C251-15DJ by Texas Instruments is a 256Kx4 MEMORY CIRCUIT IC with 1048576 bit Memory Density. It operates at 5V, has a Max Access Time of 150ns, and consumes up to 85mA. This CMOS technology chip in SMALL OUTLINE package is ideal for applications requiring fast memory access and high memory density.
DS2411R/TR
Dallas Semiconductor
DS2411R/TR by Dallas Semiconductor is a 3-terminal memory IC with plastic/epoxy package. It operates in industrial temperature range (-40 to 85°C) and requires 2/5V power supply. Ideal for applications requiring low standby current (0.000001A) and minimal supply current (0.1mA).
SN74S262N1
SN74S262N1 by Texas Instruments is a TTL Memory Circuit IC with 20 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, suitable for commercial applications. The PLASTIC/EPOXY rectangular package makes it ideal for memory circuit functions.
DS6207-4
Analog Devices
DS6207-4 by Analog Devices is a CMOS Memory Circuit with 384-bit memory density. It operates b/w 0 °C to 70°C, suitable for commercial applications. This rectangular IC has 5 terminals and is ideal for various memory circuit functions.
MTFDHBL512TDQ-1AT12ATYYTR
Micron Technology
MEMORY CIRCUIT;
AF4GUDI-OEM
Atp Electronics
AF4GUDI-OEM by Atp Electronics is a CMOS memory circuit with 4GX8 organization, 8-bit memory width, and 34.36 Gb density. It operates in industrial temperature range (-40 to 85°C) and is surface mountable for various applications requiring high-density memory solutions.
DS2401Z
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 4; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS; Terminal Position: DUAL;
TACT2152-25JD
TACT2152-25JD by Texas Instruments is a 2Kx8 memory circuit IC with 16384-bit memory density. It operates at 5V, has a max access time of 25ns, and supports commercial temperature grade. This CMOS technology IC comes in an IN-LINE package style and is ideal for applications requiring fast data access and reliable memory storage.
WSF512K16-39H2I
Mercury Systems
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: PGA; Package Shape: SQUARE; Memory Density: 8388608 bit;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DSM2190F4V-15K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Terminal Form: J BEND;
DSM2150F5V-12T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 80; Package Code: TFQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
DSM2180F3V-15T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
DSM2180F3V-15K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
DSM2180F3V-90T6
DSM2180F3-90T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 5.5 V;
DSM2180F3-90K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Qualification: Not Qualified;
DSM2180F3-15K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; JESD-30 Code: S-PQCC-J52;
DSM2180F3V-90K6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QCCJ; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
DSM2180F3-15T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Terminal Form: GULL WING;
DSM2190F4V-15T6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Memory Density: 2097152 bit;
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