Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.
Add filters
All
Selected
47C16T-I/SN
Microchip Technology
47C16T-I/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with an organization of 2KX8 and a memory density of 16384 bit. It operates at a nominal voltage of 5V and has a max access time of 400 ns. This memory circuit is commonly used in industrial applications requiring reliable data storage.
400 ns
R-PDSO-G8
e3
4.9 mm
16384 bit
MEMORY CIRCUIT
8
EEPROM+SRAM
3
1
2048 words
2K
SYNCHRONOUS
85 Cel
-40 Cel
2KX8
PLASTIC/EPOXY
SOP
SOP8,.23
RECTANGULAR
SMALL OUTLINE
260
1.75 mm
5.5 V
4.5 V
5
YES
CMOS
INDUSTRIAL
MATTE TIN
GULL WING
1.27 mm
DUAL
40
3.9 mm
47L04T-I/ST
47L04T-I/ST by Microchip Technology is a small outline, thin profile memory IC with EEPROM+SRAM mixed memory type. Operating in synchronous mode, it offers 512x8 organization and 4096-bit memory density. Ideal for industrial applications requiring fast access times at temperatures ranging from -40 to 85°C.
4.4 mm
4096 bit
512 words
512
512X8
TSSOP
TSSOP8,.25
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.2 mm
3.6 V
2.7 V
.65 mm
3 mm
47L16-E/P
47L16-E/P by Microchip Technology is a 2KX8 EEPROM+SRAM memory IC with 16384 bit density. Operating in synchronous mode, it has a max access time of 400 ns and operates b/w -40 to 125 °C. Ideal for automotive applications, this rectangular IN-LINE package offers reliable performance in various systems.
R-PDIP-T8
9.271 mm
125 Cel
DIP
DIP8,.3
IN-LINE
5.334 mm
NO
AUTOMOTIVE
THROUGH-HOLE
2.54 mm
7.62 mm
47L16T-E/SN
47L16T-E/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with 2KX8 organization. Operating at -40 to 125 °C, it has a memory density of 16384 bit and max access time of 400 ns. Ideal for automotive applications due to its small outline package style and CMOS technology.
47L16T-E/ST
47L16T-E/ST by Microchip Technology is a CMOS memory IC with EEPROM+SRAM, operating in synchronous mode. It has an organization of 2KX8 and a memory density of 16384 bit. Ideal for automotive applications, it offers a wide temperature range from -40 to 125 °C and operates at supply voltages b/w 2.7V to 3.6V.
47L16T-I/ST
47L16T-I/ST by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is ideal for industrial applications requiring a memory density of 16384 bit, fast access time of 400 ns, and operating temperature range from -40 to 85°C.
SMC128AFB6E
STMicroelectronics
SMC128AFB6E by STMicroelectronics is an industrial-grade, asynchronous memory IC with a density of 1 Gb and operates b/w -40 °C to 85 °C. It features a 128Mx8 organization and comes in a no-lead, uncasded chip package. Ideal for high-performance applications requiring reliable data storage.
X-XUUC-N
1073741824 bit
134217728 words
128M
ASYNCHRONOUS
128MX8
UNSPECIFIED
DIE
UNCASED CHIP
NO LEAD
UPPER
SMC512AFB6E
SMC512AFB6E by STMicroelectronics is an industrial-grade, asynchronous memory IC with a density of 4 Gb and operates b/w -40 °C to 85 °C. It features a 512M x 8 organization in a no-lead package, ideal for space-constrained applications. This CMOS technology ensures reliable performance in various electronic devices.
4294967296 bit
536870912 words
512M
512MX8
MT29C1G12MAAIVAMD-5IT
Micron Technology
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
IT ALSO CONTAINS 512MBIT(32MBIT X 16) MOBILE LPDDR
R-PBGA-B130
9 mm
130
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
NOT SPECIFIED
1 mm
1.95 V
1.7 V
1.8
BALL
BOTTOM
8 mm
MT29C1G12MAAIYAMR-5AIT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B130;
LPDRAM IS ORGANISED AS 32M X 16
MT29C1G12MAAJVAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Width: 8 mm;
16
67108864 words
64M
64MX16
MT29C1G12MAAJYAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
THGBMGG9U4LBAIR
Toshiba
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
R-PBGA-B153
549755813888 bit
153
68719476736 words
64G
-25 Cel
64GX8
BGA
GRID ARRAY
OTHER
THGBMGT0U8LBAIG
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
1099511627776 bit
137438953472 words
128G
128GX8
THGBMHG6C1LBAIL
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
68719476736 bit
8589934592 words
8G
8GX8
THGBMHG6C1LBAU6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
105 Cel
THGBMHG7C1LBAIL
137438953472 bit
17179869184 words
16G
16GX8
THGBMHG7C2LBAU7
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
THGBMHG8C2LBAIL
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 8;
274877906944 bit
34359738368 words
32G
32GX8
THGBMHG8C4LBAU7
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
THGBMHG9C4LBAIR
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
THGBMHG9C8LBAU8
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;
THGBMHT0C8LBAIG
THGBMHG6C1LBAWL
THGBMHG7C2LBAWR
THGBMHG8C4LBAWR
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;
THGBMHG9C8LBAWG
ST25TA512-AC6G5
ST25TA512-AC6G5 from STMicroelectronics is a CMOS memory IC designed for industrial applications, operating in asynchronous mode. It features a 512-bit density with a temperature range of -40 °C to 85 °C and comes in a no-lead rectangular package. Ideal for compact designs, it offers reliable performance in harsh environments.
R-XUUC-N
512 bit
64
64X8
DIE OR CHIP
M24SR04-GSG12I/2
M24SR04-GSG12I/2 from STMicroelectronics is a synchronous memory IC with a 3.3V nominal voltage and operates in a no-lead, round package. It features 512x8 organization and offers a memory density of 4096 bits, ideal for compact applications. This CMOS technology ensures efficient performance in various electronic devices.
O-XUUC-N
WAFER
ROUND
3.3
M24SR64-YDW8T/2
M24SR64-YDW8T/2 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. It operates in synchronous mode, has a supply voltage range of 2.7V to 5.5V, and industrial temperature grade. This small outline IC with dual terminals is ideal for applications requiring secure data storage and retrieval in compact devices.
4.3 mm
65536 bit
65536 words
64K
64KX1
2.9 mm
M24SR64-YMN8T/2
M24SR64-YMN8T/2 by STMicroelectronics is a 64Kx1 memory IC with CMOS technology. It operates in synchronous mode, has 65536-bit memory density, and supports a supply voltage range of 2.7V to 5.5V. This small outline package is ideal for industrial applications requiring reliable data storage and retrieval capabilities.
M24SR64-YSG12I/2
M24SR64-YSG12I/2 by STMicroelectronics is a synchronous memory IC with 8Kx8 organization and 65536-bit memory density. Operating at 3.3V, it is suitable for applications requiring uncased chip package style and CMOS technology. Ideal for surface mount setups, this rectangular-shaped IC supports a wide supply voltage range from 2.7V to 5.5V.
8192 words
8K
8KX8
M24SR02-YSG12I/2
MEMORY CIRCUIT; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 2KX1; Terminal Form: NO LEAD; JESD-30 Code: X-XUUC-N;
2048 bit
2KX1
ST25TB512-AC6G6
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Package Style (Meter): UNCASED CHIP; Surface Mount: YES;
32
16 words
16X32
2988146
Phoenix Contact
MEMORY CIRCUIT; Package Code: DIE; Package Shape: RECTANGULAR; Memory Density: 4294967296 bit; No. of Words Code: 512M; Surface Mount: YES;
MT43A4G40200NFA-S15:A
Micron Technology's MT43A4G40200NFA-S15:A is a 4GX4 memory IC with 17179869184 bit density. Operating at 1.2V, it features synchronous mode and 896 terminals in a square GRID ARRAY package. Ideal for applications requiring high memory capacity and fast data processing in electronic devices.
IT ALSO OPERATES AT LOGIC OPERATING TEMPERATURE 0 TO 110 DEG CENTIGRADE
S-PBGA-B896
31 mm
17179869184 bit
4
896
4294967296 words
4G
0 Cel
4GX4
SQUARE
4.2 mm
1.26 V
1.14 V
1.2
MT29C2G24MAAAAHAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
ALSO ORGANISED AS 64M X 16
33554432 words
32M
32MX32
MT29C2G24MAABAHAMD-5EIT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Additional Features: ALSO ORGANISED AS 64M X 16;
MT29C2G24MAABAHAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;
MT29C2G24MAABAKAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
MT29C4G48MAZBAAKS-5WT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
ALSO ORGANISED AS 128M X 16
R-PBGA-B137
13 mm
2147483648 bit
137
64MX32
.8 mm
10.5 mm
MT29C4G96MAYBACKD-5WT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 67108864 words;
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.1 mm
MT29C4G96MAZBACKD-5WT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; Width: 10.5 mm;
MT29C8G96MAZBADKD-5IT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
MT29C8G96MAZBADKD-5WT
MT29C8G96MAZBADKD-5WT by Micron Technology is a 64MX32 memory IC with 67108864 words and 2147483648 bit memory density. Operating at 1.7-1.95V, it has a synchronous mode and thin profile grid array package shape. Ideal for applications requiring high-speed data processing in compact electronic devices.
MT29C1G12MAACVAMD-5IT
NAND FLASH IS ORGANISED AS 64M X 16
e1
536870912 bit
16777216 words
16M
16MX32
Tin/Silver/Copper (Sn/Ag/Cu)
30
MT29C1G12MAACYAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
MT29C1G12MAADVAMD-5IT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 130; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
© 2023 All rights reserved
