Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
M24SR64-YDW8T/2 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. It operates in synchronous mode, has a supply voltage range of 2.7V to 5.5V, and industrial temperature grade. This small outline IC with dual terminals is ideal for applications requiring secure data storage and retrieval in compact devices.
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$7.095
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$26.000
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$4.511
Bastille Electronics
PLASTIC/EPOXY - This material is lightweight and durable, making the product long-lasting and easy to handle.
YES - Allows for easy and efficient installation on PCBs, saving time and effort during assembly.
RECTANGULAR - Provides a compact and space-saving design, ideal for applications with limited space constraints.
SYNCHRONOUS - Ensures synchronized data transfer, improving overall system performance and efficiency.
8 - Offers flexibility and compatibility with various systems and devices.
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Enhances product aesthetics and facilitates high-density mounting.
105 °C - Withstands high temperature environments, ensuring reliable operation in challenging conditions.
64KX1 - Provides high memory density in a single chip, offering ample storage capacity for data-intensive applications.
40 °C - Operates effectively in low temperature environments, suitable for diverse industrial settings.
DUAL - Offers increased connectivity options and flexibility for system integration.
1.2 mm - Ultra-thin profile facilitates compact designs and enables integration in space-constrained applications.
2.9 mm - Slim form factor allows for efficient space utilization on PCBs.
2.7 V - Low power consumption ensures energy efficiency and extends battery life in portable devices.
4.3 mm - Compact size enables easy integration and placement in tight spaces.
INDUSTRIAL - Designed to withstand harsh industrial environments, ensuring reliable performance in demanding conditions.
CMOS - Utilizes advanced CMOS technology for efficient power management and superior speed.
GULL WING - Provides secure and reliable connections for stable data transmission.
65536 words - Offers ample storage for data processing applications, enhancing system performance.
0.65 mm - Fine pitch design allows for high-density mounting and enhanced connectivity.
64K - Convenient code for easy identification and compatibility with existing systems.
5.5 V - Supports higher voltage operation for robust performance in industrial applications.
65536 bit - High memory density allows for efficient data storage and processing capabilities.
MEMORY CIRCUIT - Versatile IC type suitable for various memory applications in electronics.
Other Function Memory ICs M24SR64-YDW8T/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M24SR64-YDW8T/2 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
1N4148
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3203F
Idec
ROTARY SWITCH;
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
BAV99
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
Taiwan Semiconductor
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
Gec Plessey Semiconductors
Won-top Electronics
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
Taitron Components
Cheng-yi Electronic
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
MMBT3904LT1G
MMBT3904LT1G by Onsemi is a NPN BJT with max. collector-emitter voltage of 40V, hFE of 30, and fT of 300MHz. Ideal for small signal applications in electronics due to its compact size, high transition frequency, and low power dissipation capabilities.
47C16T-I/SN
Microchip Technology
47C16T-I/SN by Microchip Technology is a synchronous EEPROM+SRAM memory IC with an organization of 2KX8 and a memory density of 16384 bit. It operates at a nominal voltage of 5V and has a max access time of 400 ns. This memory circuit is commonly used in industrial applications requiring reliable data storage.
TMS4C1050-6N
Texas Instruments
TMS4C1050-6N by Texas Instruments is a 16-terminal MEMORY CIRCUIT IC with 5V supply, 50ns access time, and 35mA max supply current. It operates b/w 0-70°C in COMMERCIAL grade applications, featuring THROUGH-HOLE terminals in a RECTANGULAR PLASTIC/EPOXY package suitable for various memory circuit functions.
SNJ54AS870FH
SNJ54AS870FH by Texas Instruments is a MILITARY-grade TTL IC with 28 terminals in a CHIP CARRIER package. Operating temperature range from -55 to 125 °C, suitable for harsh environments. Ideal for applications requiring high reliability and performance in military and aerospace industries.
AT88SC018-SU-CN
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SN74HC670N
SN74HC670N by Texas Instruments is a CMOS memory IC with 16 terminals and operating temperature range of -40 to 85°C. It has power supplies of 2/6V, suitable for industrial applications requiring reliable memory functions in an IN-LINE package style.
IRMCF171TR
International Rectifier
MEMORY CIRCUIT;
CC2544RHBT
The Texas Instruments CC2544RHBT is a square chip carrier with a clock frequency of 2496 MHz, suitable for automotive applications. Operating temperature ranges from -40 to 125°C, with supply voltage ranging from 2V to 3.6V. Ideal for memory circuits requiring high-speed performance in compact designs.
DS1204U-G3C
Analog Devices
DS1204U-G3C by Analog Devices is a 256-bit MEMORY CIRCUIT with 256x1 organization. It operates in SYNCHRONOUS mode at 5V, suitable for COMMERCIAL use up to 70 °C. This RECTANGULAR IC in SPECIAL SHAPE package is ideal for memory applications requiring fast and synchronized data processing.
TMS27C291-50N
Other Memory ICs;
AF4GUDI-OEM
Atp Electronics
AF4GUDI-OEM by Atp Electronics is a CMOS memory circuit with 4GX8 organization, 8-bit memory width, and 34.36 Gb density. It operates in industrial temperature range (-40 to 85°C) and is surface mountable for various applications requiring high-density memory solutions.
TMS2564-35JL
TMS2564-35JL by Texas Instruments is an 8KX8 memory IC with 65536 bit density and 350 ns access time. It features a 3-STATE output, operates b/w 0 to 70 °C, and has a package style of IN-LINE. Ideal for applications requiring fast data retrieval in commercial-grade temperature environments.
AT88SC018-SU-CM-T
AT88SC018-SU-CM-T by Microchip Technology is a 4Kx1 memory circuit IC with 4096-bit memory density. It operates in synchronous mode, has a supply voltage range of 2.7V to 3.6V, and an industrial temperature grade. This small outline package with dual terminals is ideal for secure data storage applications.
XC17S20PD8C
Xilinx
The Xilinx XC17S20PD8C is a 178144-bit memory circuit IC with synchronous operation and 3-STATE output. It operates at a max clock frequency of 10 MHz, suitable for applications requiring high-speed memory access. With a package style of IN-LINE and through-hole terminal form, it is commonly used in commercial-grade systems needing reliable memory storage.
M36W108T120ZM1
STMicroelectronics
M36W108T120ZM1 from STMicroelectronics is a low-profile, asynchronous memory IC featuring 8Mbit density with FLASH+SRAM technology. It operates at 3/3.3V and supports a max access time of 120ns, ideal for embedded applications. Its compact design ensures efficient space utilization in various electronic devices.
TMS27C32-100NE
FM24CL64-S
Enhanced Memory Systems
TACT2152-25N3
TACT2152-25N3 by Texas Instruments is a 2Kx8 memory circuit IC with 16384-bit memory density. It operates at a max access time of 25ns and has a nominal voltage of 5V. This CMOS technology IC is commonly used in applications requiring fast memory access and reliable data storage.
FM25L256-GC
Cypress Semiconductor
TMS27PC32-15JE4
TMS27PC32-120NE
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M24SR64-YDW6T/2
M24SR64-YDW6T/2 by STMicroelectronics is a memory IC with 8KX8 organization, 65536 bit memory density, and operates at 3.3V. It is used in industrial applications for data storage and communication due to its small outline package style and dual terminal position.
M24SR64-YMN6T/2
M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.
M24SR64-YSB1217/2
M24SR04-GMC5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
M24SR04-YMN5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
M24SR04-YMF6T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Organization: 512X8;
M24SR04-YDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M24SR04-YMF7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Width: 2 mm; No. of Words Code: 512;
M24SR64-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; JESD-30 Code: R-PDSO-G8;
M24SR64-YDW7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V; Operating Mode: SYNCHRONOUS;
M24SR04-YMC7/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words: 4096 words; Technology: CMOS;
M24SR16-YMC7T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
M24SR64-YSB12I6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Package Style (Meter): UNCASED CHIP;
M24SR04-GDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
M24SR04-YMC6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
M24SR04-YMC5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
M24SR02-YSB12I/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
M24SR04-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Organization: 512X8;
M24SR04-GMF5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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