Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
M24SR64-YDW8T/2 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. It operates in synchronous mode, has a supply voltage range of 2.7V to 5.5V, and industrial temperature grade. This small outline IC with dual terminals is ideal for applications requiring secure data storage and retrieval in compact devices.
Median Price
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4
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1k+
Vyrian
1+ parts
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Digiode
Nova Conductors
Anansix
IDEA Electronic Components Group
$3.773
$3.396
AZTECH Wire
$6.321
MKK Technologies
$7.095
DigiPath Technology Company
Ampacity Inc.
$26.000
Corphita
Parana Technologies
$4.511
Bastille Electronics
PLASTIC/EPOXY - This material is lightweight and durable, making the product long-lasting and easy to handle.
YES - Allows for easy and efficient installation on PCBs, saving time and effort during assembly.
RECTANGULAR - Provides a compact and space-saving design, ideal for applications with limited space constraints.
SYNCHRONOUS - Ensures synchronized data transfer, improving overall system performance and efficiency.
8 - Offers flexibility and compatibility with various systems and devices.
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Enhances product aesthetics and facilitates high-density mounting.
105 °C - Withstands high temperature environments, ensuring reliable operation in challenging conditions.
64KX1 - Provides high memory density in a single chip, offering ample storage capacity for data-intensive applications.
40 °C - Operates effectively in low temperature environments, suitable for diverse industrial settings.
DUAL - Offers increased connectivity options and flexibility for system integration.
1.2 mm - Ultra-thin profile facilitates compact designs and enables integration in space-constrained applications.
2.9 mm - Slim form factor allows for efficient space utilization on PCBs.
2.7 V - Low power consumption ensures energy efficiency and extends battery life in portable devices.
4.3 mm - Compact size enables easy integration and placement in tight spaces.
INDUSTRIAL - Designed to withstand harsh industrial environments, ensuring reliable performance in demanding conditions.
CMOS - Utilizes advanced CMOS technology for efficient power management and superior speed.
GULL WING - Provides secure and reliable connections for stable data transmission.
65536 words - Offers ample storage for data processing applications, enhancing system performance.
0.65 mm - Fine pitch design allows for high-density mounting and enhanced connectivity.
64K - Convenient code for easy identification and compatibility with existing systems.
5.5 V - Supports higher voltage operation for robust performance in industrial applications.
65536 bit - High memory density allows for efficient data storage and processing capabilities.
MEMORY CIRCUIT - Versatile IC type suitable for various memory applications in electronics.
Other Function Memory ICs M24SR64-YDW8T/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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No. of Words Code:
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Maximum Operating Temperature:
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M24SR64-YDW8T/2 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
EU2B-YS2J03F
Idec
ROTARY SWITCH;
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDLL4148
National Semiconductor
SMBJ18CA
Yageo
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
1N4148WS
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
MBRS140T3G
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
NC7WZ17P6X
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
Secos
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Wuxi Xuyang Electronic
Silicon Standard
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
DS2411P+
Analog Devices
DS2411P+ by Analog Devices is a 64-bit MEMORY CIRCUIT with 64x1 organization. Operating in ASYNCHRONOUS mode, it has a supply voltage range of 1.5V to 5.25V and operates in INDUSTRIAL temperature grade. Suitable for applications requiring small outline packages and low standby current consumption.
TMS27C32-150NE4
Texas Instruments
Other Memory ICs;
MT29C8G96MAZBADKD-5WT
Micron Technology
MT29C8G96MAZBADKD-5WT by Micron Technology is a 64MX32 memory IC with 67108864 words and 2147483648 bit memory density. Operating at 1.7-1.95V, it has a synchronous mode and thin profile grid array package shape. Ideal for applications requiring high-speed data processing in compact electronic devices.
TMS2708-45JDL
TMS2708-45JDL by Texas Instruments is a 1KX8 MOS memory IC with 8192-bit density. It features 3-STATE output, operates b/w 0 to 70°C, and has a max access time of 450 ns. Ideal for applications requiring high-speed data storage in commercial-grade environments.
5962-01-260-3013
Other Memory ICs; Peak Reflow Temperature (C): NOT SPECIFIED; Qualification: Not Qualified; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
FM33256B-GTR
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
TMS27PC32-120JE4
DS2401+
DS2401+ by Analog Devices is a 64-bit MEMORY CIRCUIT with 3 terminals, operating at 5V. It has an industrial temperature grade range of -40 to 85°C and uses CMOS technology. Ideal for applications requiring asynchronous operation in a cylindrical package style.
M36W0R5020B0ZAQF
STMicroelectronics
M36W0R5020B0ZAQF by STMicroelectronics is a mixed memory IC featuring 2M x 16 organization with Flash+SRAM technology. It operates asynchronously at a nominal voltage of 1.8V, suitable for industrial applications. With a max temp of 85 °C and low power consumption, it ensures reliability in demanding environments.
M36W108T120ZN1T
STMicroelectronics M36W108T120ZN1T is a 1MX8 memory IC with 8388608 bit memory density. It operates in asynchronous mode, with CMOS technology and 2.7-3.6V supply voltage range. Suitable for commercial applications, it features a grid array package style and very thin profile for compact designs.
FM33256B-G
Ramtron International
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
TMS2150-35JD
TMS2150-35JD by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 35ns access time, ideal for commercial applications. Operating at 5V, it has a max standby current of 0.145A and operates in temperatures ranging from 0 to 70°C. The package style is IN-LINE with a RECTANGULAR shape and CERAMIC body material.
CY8C20110-SX2I
CY8C20110-SX2I by Infineon: 2Kx1 memory IC with 2048-bit density. Operates synchronously at 3V, -40 to 85°C temp range. Ideal for industrial applications requiring small outline package and dual terminal position.
DS2400T
Analog Devices' DS2400T is a 3-terminal memory IC with a supply voltage of 5V, suitable for industrial applications. With a temperature range of -40 to 85 °C, it features tin-lead terminal finish and plastic/epoxy package material. Ideal for various functions requiring reliable memory storage in harsh environments.
TMX27PC256N30
M28F221-70YN3
CY8C20110-SX2IT
MEMORY CIRCUIT; Moisture Sensitivity Level (MSL): 3;
MR2A16AVYS35R
Freescale Semiconductor
MR2A16AVYS35R by Freescale Semiconductor is a 256Kx16 memory IC with 4194304-bit density. Operating at 3.3V, it has an access time of 35ns and max standby current of 0.028A. Ideal for commercial applications requiring fast asynchronous memory performance in a small outline package.
SN74AS871N1
SN74AS871N1 by Texas Instruments is a TTL technology IC with 28 terminals in an IN-LINE package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. With a rectangular plastic/epoxy body, it is commonly used in memory functions requiring dual terminal positions.
TMS27C291-50N
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M24SR64-YDW6T/2
M24SR64-YDW6T/2 by STMicroelectronics is a memory IC with 8KX8 organization, 65536 bit memory density, and operates at 3.3V. It is used in industrial applications for data storage and communication due to its small outline package style and dual terminal position.
M24SR64-YMN6T/2
M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.
M24SR64-YSB1217/2
MEMORY CIRCUIT;
M24SR04-GMC5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
M24SR04-YMN5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
M24SR04-YMF6T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Organization: 512X8;
M24SR04-YDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M24SR04-YMF7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Width: 2 mm; No. of Words Code: 512;
M24SR64-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; JESD-30 Code: R-PDSO-G8;
M24SR64-YDW7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V; Operating Mode: SYNCHRONOUS;
M24SR04-YMC7/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words: 4096 words; Technology: CMOS;
M24SR16-YMC7T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
M24SR64-YSB12I6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Package Style (Meter): UNCASED CHIP;
M24SR04-GDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
M24SR04-YMC6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
M24SR04-YMC5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
M24SR02-YSB12I/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Package Style (Meter): UNCASED CHIP;
M24SR04-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Organization: 512X8;
M24SR04-GMF5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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