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M24SR04-YMF7T/2

STMicroelectronics

M24SR04-YMF7T/2 by STMicroelectronics

M24SR04-YMF7T/2 by STMicroelectronics is a 4096-bit memory circuit with 512x8 organization. Operating at 3.3V, it offers asynchronous mode and dual terminal position for versatile applications. This small outline IC with 0.5mm terminal pitch is ideal for IoT devices and smart cards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,986 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,986

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Digiode

USA . 1,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,556

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-

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Vyrian

USA . 1,503 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,503

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,273 parts In-Stock

1+ parts

$2.542

100+ parts

-

1k+ parts

$2.288

10k+ parts

-

1,273

$2.542

-

$2.288

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MKK Technologies

India . 1,582 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

-

10k+ parts

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1,582

$4.780

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-

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DigiPath Technology Company

USA . 1,582 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,582

$4.780

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-

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Corphita

USA . 3,875 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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3,875

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Parana Technologies

USA . 1,630 parts In-Stock

1+ parts

-

100+ parts

$3.039

1k+ parts

-

10k+ parts

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1,630

-

$3.039

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Overview

Elevate your projects with the M24SR04-YMF7T/2 by STMicroelectronics, a cutting-edge memory IC that offers unparalleled quality and reliability. With STMicroelectronics' renowned reputation for excellence in semiconductor manufacturing, you can trust this product to deliver exceptional performance in a wide range of applications. From IoT devices to smart appliances, the M24SR04-YMF7T/2 provides seamless connectivity and efficient data storage, ensuring a smooth user experience. Upgrade your designs with this versatile memory circuit and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to various environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology makes installation of the memory IC easier and more efficient, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible timing and communication protocols, making the memory IC compatible with a variety of systems and applications.

Nominal Supply Voltage / Vsup (V): 3.3

3.3V supply voltage is a common standard in many electronic devices, ensuring compatibility with a wide range of systems.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing the memory IC with other components in the circuit.

Organization: 512X8

The 512x8 organization offers a good balance between storage capacity and data access speed, making it suitable for various memory applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the memory IC energy-efficient and reliable in noisy environments.

Memory Density: 4096 bit

With a high memory density of 4096 bits, this memory IC can store a large amount of data efficiently and compactly.

Memory IC Type: MEMORY CIRCUIT

Being a memory circuit type, this IC is specifically designed and optimized for storing and accessing data, ensuring reliable performance in memory-intensive applications.

Technical Specifications

Other Function Memory ICs M24SR04-YMF7T/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

ASYNCHRONOUS

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

M24SR04-YMF7T/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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