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M24SR64-YSB12I6/2

STMicroelectronics

M24SR64-YSB12I6/2 by STMicroelectronics

M24SR64-YSB12I6/2 from STMicroelectronics is a CMOS memory IC with an 8Kx8 organization, operating b/w 2.7V and 5.5V. It features a wide temperature range of -40 °C to 85 °C, making it ideal for industrial applications. This surface-mount device supports synchronous operation for efficient data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,703 parts In-Stock

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Anansix

USA . 1,402 parts In-Stock

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Digiode

USA . 506 parts In-Stock

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506

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 426 parts In-Stock

1+ parts

$4.723

100+ parts

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$4.251

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426

$4.723

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MKK Technologies

India . 609 parts In-Stock

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$8.882

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DigiPath Technology Company

USA . 609 parts In-Stock

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$8.882

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609

$8.882

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Parana Technologies

USA . 1,213 parts In-Stock

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$5.647

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$5.647

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Corphita

USA . 129 parts In-Stock

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Overview

Unlock unparalleled performance with the M24SR64-YSB12I6/2 from STMicroelectronics, a name synonymous with reliability and innovation. Designed for diverse applications, this advanced memory IC delivers exceptional quality in demanding environments, operating seamlessly between -40 °C to 85 °C. Enjoy benefits like low power consumption and synchronous operation, ensuring efficiency and durability for your projects. Elevate your designs with ST's commitment to excellence!

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability ensures that the IC can be easily integrated into compact designs, making it suitable for modern electronics.

Operating Mode: SYNCHRONOUS

The synchronous operation allows for high-speed data access and improved performance, essential for demanding applications.

Nominal Supply Voltage / Vsup: 3.3 V

The 3.3 V nominal supply voltage is ideal for compatibility with low-power digital circuits, contributing to energy efficiency.

Package Style (Meter): UNCASED CHIP

The uncasised chip package provides flexibility in custom applications and helps minimize space in the PCB layout.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C makes this IC suitable for various industrial environments, ensuring reliability under demanding conditions.

Organization: 8KX8

With an organization of 8Kx8, the memory structure allows for efficient data organization and manipulation, enhancing performance.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C guarantees functionality in extreme cold environments, making it suitable for outdoor or harsh applications.

Terminal Position: UPPER

Upper terminal positioning offers ease of access for soldering and connection, allowing for simpler integration into various designs.

Minimum Supply Voltage: 2.7 V

A minimum supply voltage of 2.7 V allows for flexible power supply options, accommodating various system designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades signifies robustness and reliability, catering to demanding and long-term applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, essential for performance in battery-operated devices.

Terminal Form: NO LEAD

No-lead terminal form provides a compact design and helps reduce overall package size, which is beneficial for space-constrained devices.

No. of Words: 8192 words

With 8192 words of memory, this IC offers ample storage for a variety of applications, from simple operations to complex data storage.

Memory Width: 8

An 8-bit memory width facilitates a good balance of data throughput and resource efficiency, suitable for various applications.

No. of Words Code: 8K

The 8K words code indicates a robust memory capacity, making it practical for applications requiring considerable data storage.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V increases design flexibility, allowing this IC to function in a broader range of systems.

Memory Density: 65536 bit

With a memory density of 65536 bits, this IC provides sufficient capacity for data-intensive tasks, enhancing its utility in various applications.

Memory IC Type: MEMORY CIRCUIT

As a dedicated memory circuit, it is tailored for reliable data storage and retrieval, essential for system efficiency and performance.

Technical Specifications

Other Function Memory ICs M24SR64-YSB12I6/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

M24SR64-YSB12I6/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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