Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M24SR02-YSB12I/2 from STMicroelectronics is a CMOS memory IC with a 256x8 organization, operating b/w -40 °C and 85°C. It features a supply voltage range of 2.7V to 5.5V and supports synchronous operation. Ideal for industrial applications requiring reliable data storage in compact designs.
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The surface mount design allows for a compact layout and facilitates automated assembly, making it suitable for high-density applications.
The synchronous operation provides faster processing speeds, improving overall performance for applications with demanding timing requirements.
Operating at a nominal voltage of 3.3 V makes this memory IC compatible with a variety of low-power devices, ensuring efficient operation.
The uncased chip style allows for customized packaging solutions, which can be beneficial for unique applications and space constraints.
With a maximum operating temperature of 85 °C, this IC can function reliably in moderately harsh environments.
The organization of 256x8 allows for efficient data storage and retrieval, making it suitable for applications with moderate memory requirements.
The ability to operate at temperatures as low as -40 °C ensures that this memory IC performs well in extreme cold conditions, enhancing its range of applications.
The upper terminal position aids in the effective mounting and connection of the IC, which can simplify PCB design.
A minimum supply voltage of 2.7 V provides flexibility for low-voltage operation in battery-powered or energy-efficient devices.
Being rated for industrial temperature grade ensures reliability and durability in demanding environments, making it ideal for use in industrial applications.
CMOS technology offers low power consumption and high noise immunity, providing an energy-efficient solution for various applications.
The no lead design minimizes the footprint and allows for easier integration in densely populated circuit boards.
With 256 words of memory capacity, it balances the requirement for adequate storage while maintaining compactness.
An 8-bit width provides a good mix of performance and efficiency, well-suited for most common data handling tasks.
The 256 words code capacity ensures reliable storage for critical application data, making it a dependable choice for memory needs.
A maximum supply voltage of 5.5 V allows for compatibility with a range of systems, enhancing the versatility of this memory IC.
With a memory density of 2048 bits, it provides sufficient data space for various applications, from basic to advanced functionalities.
Classified as a memory circuit, this IC is designed specifically for data storage tasks, ensuring effectiveness and reliability.
Other Function Memory ICs M24SR02-YSB12I/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M24SR02-YSB12I/2 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
1N4148
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
Diotec Semiconductor Ag
SMBJ18CA
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Onsemi
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
OPA2227UA
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
MR25H256MDC
Everspin Technologies
MR25H256MDC by Everspin Technologies is a 262144-bit MEMORY CIRCUIT with 32KX8 organization, operating at 3.3V. This SMALL OUTLINE IC has a temperature range of -40 to 125 °C and is AEC-Q100 compliant, suitable for AUTOMOTIVE applications requiring reliable synchronous memory solutions.
M36LLR8860D1ZAQF
M36LLR8860D1ZAQF by STMicroelectronics is a low-profile, synchronous memory IC featuring 16M words of FLASH+PSRAM with a supply voltage range of 1.7-1.95V. It operates efficiently at temperatures from -25 °C to 85 °C and supports surface mount applications. Ideal for compact devices, it offers high-density storage in a small footprint.
MR2A16AYS35
Freescale Semiconductor
MR2A16AYS35 by Freescale Semiconductor is a 256KX16 MEMORY CIRCUIT with 4194304 bit Memory Density. Operating at 3.3V, it has an Access Time of 35ns and supports ASYNCHRONOUS mode. This PLASTIC/EPOXY IC in SMALL OUTLINE, THIN PROFILE package is ideal for applications requiring high-speed memory access in commercial temperature environments.
MR2A16AVMA35
MR2A16AVMA35 by Everspin Technologies is a 256Kx16 memory IC with 35ns access time, operating at 3.3V. It features a low profile grid array package suitable for industrial applications requiring fast asynchronous operation and high memory density.
M36W108T100ZM5T
STMicroelectronics M36W108T100ZM5T is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. It operates in asynchronous mode, has a supply voltage range of 2.7V to 3.6V, and is suitable for applications requiring low profile grid array packages.
XC17S150XLPD8C
Xilinx
Xilinx XC17S150XLPD8C is a 1040128-bit MEMORY CIRCUIT with 3.3V supply, 10MHz clock frequency, and 70°C operating temp. Ideal for applications requiring synchronous operation in commercial-grade environments.
SN74HC670NP3
SN74HC670NP3 by Texas Instruments is a CMOS memory IC with 16 terminals, operating temperature range of -40 to 85°C, and power supply of 2-6V. Its rectangular package shape makes it suitable for industrial applications requiring reliable memory functions in various electronic devices.
LC331632M-10
LC331632M-10 by Onsemi is a 32KX16 CMOS memory IC with 3-STATE output. It operates at a nominal voltage of 5V and has a memory density of 524288 bits. This small outline package is ideal for applications requiring common I/O type in commercial temperature grades.
TMS27PC64-15N
Other Memory ICs;
SN74S262NP1
SN74S262NP1 by Texas Instruments is a TTL memory circuit IC with 20 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, suitable for commercial applications. The through-hole terminals are spaced at 2.54mm pitch, making it ideal for various function memory circuits.
MR25H10CDF
MR25H10CDF by Everspin Technologies is a synchronous memory IC with a capacity of 128Kx8 and a memory density of 1,048,576 bits. It operates at a nominal voltage of 3V and has a max operating temperature of 85°C. This memory circuit is commonly used in industrial applications requiring reliable and high-performance data storage.
DS1204U-G04
Analog Devices
DS1204U-G04 by Analog Devices is a 128-bit MEMORY CIRCUIT with 128x1 organization. It operates SYNCHRONOUSLY at 5V, suitable for COMMERCIAL use up to 70 °C. This RECTANGULAR IC in SPECIAL SHAPE package is ideal for applications requiring reliable memory storage.
SN74AS871DW
SN74AS871DW by Texas Instruments is a TTL technology IC with 28 terminals in a small outline package. Operating temperature range is 0-70°C, suitable for commercial applications. It features gull wing terminals and is surface mountable, ideal for various memory functions.
SN74LS603ADW
SN74LS603ADW by Texas Instruments is a 64KX1 memory circuit IC with TTL technology. It operates asynchronously at 5V, with a memory density of 65536 bits. This small outline package is surface mountable and suitable for various commercial applications requiring reliable memory storage.
DS2401Z+
DS2401Z+ by Analog Devices is a CMOS memory circuit with 64-bit memory density. It operates asynchronously at a nominal voltage of 5V and has a small outline package style. It is commonly used in industrial applications requiring low-power memory storage.
SN54HC670FK
SN54HC670FK by Texas Instruments is a CMOS memory IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. It has power supplies of 2-6V and is surface mountable, making it ideal for compact electronic devices.
FM33256B-GTR
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
M38510/31901BEX
M38510/31901BEX by Texas Instruments is a MILITARY-grade MEMORY CIRCUIT with 16-bit memory density. It operates ASYNCHRONOUSLY at temperatures ranging from -55 to 125 °C, ideal for applications requiring reliable performance in harsh environments. The IC features a 4x4 organization and comes in a CERAMIC, METAL-SEALED COFIRED package with 16 terminals.
DS2401P+T&R
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Terminal Form: C BEND;
MR2A16AMYS35R
MR2A16AMYS35R by Everspin Technologies is a 256Kx16 memory IC with CMOS technology. Operating at 3.3V, it has a temperature range of -40 to 125°C and is AEC-Q100 compliant for automotive applications. This small outline, thin profile package with 44 terminals is ideal for high-performance asynchronous memory needs in automotive electronics.
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M24SR64-YDW6T/2
M24SR64-YDW6T/2 by STMicroelectronics is a memory IC with 8KX8 organization, 65536 bit memory density, and operates at 3.3V. It is used in industrial applications for data storage and communication due to its small outline package style and dual terminal position.
M24SR64-YMN6T/2
M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.
M24SR64-YSB1217/2
MEMORY CIRCUIT;
M24SR04-GMC5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
M24SR04-YMN5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
M24SR04-YMF6T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Organization: 512X8;
M24SR04-YDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M24SR04-YMF7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Width: 2 mm; No. of Words Code: 512;
M24SR64-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; JESD-30 Code: R-PDSO-G8;
M24SR64-YDW7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V; Operating Mode: SYNCHRONOUS;
M24SR04-YMC7/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words: 4096 words; Technology: CMOS;
M24SR16-YMC7T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
M24SR64-YDW8T/2
M24SR64-YDW8T/2 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. It operates in synchronous mode, has a supply voltage range of 2.7V to 5.5V, and industrial temperature grade. This small outline IC with dual terminals is ideal for applications requiring secure data storage and retrieval in compact devices.
M24SR64-YSB12I6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Package Style (Meter): UNCASED CHIP;
M24SR04-GDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
M24SR04-YMC6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
M24SR04-YMC5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
M24SR04-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Organization: 512X8;
M24SR04-GMF5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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