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M24SR02-YSB12I/2

STMicroelectronics

M24SR02-YSB12I/2 by STMicroelectronics

M24SR02-YSB12I/2 from STMicroelectronics is a CMOS memory IC with a 256x8 organization, operating b/w -40 °C and 85°C. It features a supply voltage range of 2.7V to 5.5V and supports synchronous operation. Ideal for industrial applications requiring reliable data storage in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,977 parts In-Stock

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3,977

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Vyrian

USA . 3,309 parts In-Stock

1+ parts

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3,309

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Anansix

USA . 943 parts In-Stock

1+ parts

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943

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,144 parts In-Stock

1+ parts

$2.743

100+ parts

-

1k+ parts

$2.469

10k+ parts

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2,144

$2.743

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$2.469

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MKK Technologies

India . 924 parts In-Stock

1+ parts

$5.159

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924

$5.159

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DigiPath Technology Company

USA . 924 parts In-Stock

1+ parts

$5.159

100+ parts

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924

$5.159

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Corphita

USA . 1,980 parts In-Stock

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1,980

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Parana Technologies

USA . 120 parts In-Stock

1+ parts

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$3.280

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120

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$3.280

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Overview

Unlock the potential of your projects with the M24SR02-YSB12I/2 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality memory IC excels in diverse applications, offering robust performance in challenging environments with a wide temperature range. Its compact design and energy efficiency ensure seamless integration into your devices, enhancing reliability and functionality. Experience the advantage of superior technology that drives your success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for a compact layout and facilitates automated assembly, making it suitable for high-density applications.

Operating Mode: SYNCHRONOUS

The synchronous operation provides faster processing speeds, improving overall performance for applications with demanding timing requirements.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal voltage of 3.3 V makes this memory IC compatible with a variety of low-power devices, ensuring efficient operation.

Package Style (Meter): UNCASED CHIP

The uncased chip style allows for customized packaging solutions, which can be beneficial for unique applications and space constraints.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in moderately harsh environments.

Organization: 256X8

The organization of 256x8 allows for efficient data storage and retrieval, making it suitable for applications with moderate memory requirements.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures that this memory IC performs well in extreme cold conditions, enhancing its range of applications.

Terminal Position: UPPER

The upper terminal position aids in the effective mounting and connection of the IC, which can simplify PCB design.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V provides flexibility for low-voltage operation in battery-powered or energy-efficient devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grade ensures reliability and durability in demanding environments, making it ideal for use in industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, providing an energy-efficient solution for various applications.

Terminal Form: NO LEAD

The no lead design minimizes the footprint and allows for easier integration in densely populated circuit boards.

No. of Words: 256 words

With 256 words of memory capacity, it balances the requirement for adequate storage while maintaining compactness.

Memory Width: 8

An 8-bit width provides a good mix of performance and efficiency, well-suited for most common data handling tasks.

No. of Words Code: 256

The 256 words code capacity ensures reliable storage for critical application data, making it a dependable choice for memory needs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows for compatibility with a range of systems, enhancing the versatility of this memory IC.

Memory Density: 2048 bit

With a memory density of 2048 bits, it provides sufficient data space for various applications, from basic to advanced functionalities.

Memory IC Type: MEMORY CIRCUIT

Classified as a memory circuit, this IC is designed specifically for data storage tasks, ensuring effectiveness and reliability.

Technical Specifications

Other Function Memory ICs M24SR02-YSB12I/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics

Specs

JESD-30 Code:

X-XUUC-N

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

M24SR02-YSB12I/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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