Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M24SR02-YSB12I/2 from STMicroelectronics is a CMOS memory IC with a 256x8 organization, operating b/w -40 °C and 85°C. It features a supply voltage range of 2.7V to 5.5V and supports synchronous operation. Ideal for industrial applications requiring reliable data storage in compact designs.
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The surface mount design allows for a compact layout and facilitates automated assembly, making it suitable for high-density applications.
The synchronous operation provides faster processing speeds, improving overall performance for applications with demanding timing requirements.
Operating at a nominal voltage of 3.3 V makes this memory IC compatible with a variety of low-power devices, ensuring efficient operation.
The uncased chip style allows for customized packaging solutions, which can be beneficial for unique applications and space constraints.
With a maximum operating temperature of 85 °C, this IC can function reliably in moderately harsh environments.
The organization of 256x8 allows for efficient data storage and retrieval, making it suitable for applications with moderate memory requirements.
The ability to operate at temperatures as low as -40 °C ensures that this memory IC performs well in extreme cold conditions, enhancing its range of applications.
The upper terminal position aids in the effective mounting and connection of the IC, which can simplify PCB design.
A minimum supply voltage of 2.7 V provides flexibility for low-voltage operation in battery-powered or energy-efficient devices.
Being rated for industrial temperature grade ensures reliability and durability in demanding environments, making it ideal for use in industrial applications.
CMOS technology offers low power consumption and high noise immunity, providing an energy-efficient solution for various applications.
The no lead design minimizes the footprint and allows for easier integration in densely populated circuit boards.
With 256 words of memory capacity, it balances the requirement for adequate storage while maintaining compactness.
An 8-bit width provides a good mix of performance and efficiency, well-suited for most common data handling tasks.
The 256 words code capacity ensures reliable storage for critical application data, making it a dependable choice for memory needs.
A maximum supply voltage of 5.5 V allows for compatibility with a range of systems, enhancing the versatility of this memory IC.
With a memory density of 2048 bits, it provides sufficient data space for various applications, from basic to advanced functionalities.
Classified as a memory circuit, this IC is designed specifically for data storage tasks, ensuring effectiveness and reliability.
Other Function Memory ICs M24SR02-YSB12I/2 attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M24SR02-YSB12I/2 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Onsemi
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Nexperia
MBRS1100T3G
MBRS1100T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.75V. It operates in temperatures ranging from -65 to 175°C, making it suitable for power applications. With a reverse test voltage of 100V, this diode is ideal for high-power circuits requiring efficient rectification.
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
Texas Instruments
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
TMS2150-35JD
TMS2150-35JD by Texas Instruments is a 512x9 MEMORY CIRCUIT IC with 35ns access time, ideal for commercial applications. Operating at 5V, it has a max standby current of 0.145A and operates in temperatures ranging from 0 to 70°C. The package style is IN-LINE with a RECTANGULAR shape and CERAMIC body material.
MT29C8G96MAZBADKD-5WT
Micron Technology
MT29C8G96MAZBADKD-5WT by Micron Technology is a 64MX32 memory IC with 67108864 words and 2147483648 bit memory density. Operating at 1.7-1.95V, it has a synchronous mode and thin profile grid array package shape. Ideal for applications requiring high-speed data processing in compact electronic devices.
NMC27C512AQ120
Other Memory ICs; Terminal Finish: TIN LEAD; JESD-609 Code: e0;
SAA4955TJ
NXP Semiconductors
SAA4955TJ by NXP Semiconductors is a memory circuit IC with 245772x12 organization and 2949264 bit memory density. It operates synchronously at a nominal voltage of 3.3V and has a max access time of 21ns. This IC is commonly used in applications requiring small outline package style and commercial temperature grade.
MT29GZ6A6BPIET-53AAT.112
Micron Technology's MT29GZ6A6BPIET-53AAT.112 is a 512MX16 FLASH+LPDDR memory IC with 149 terminals in a compact GRID ARRAY package. Operating at 1.8V, it offers synchronous mode and AEC-Q100 screening for automotive applications, with a wide temperature range from -40 to 105°C.
M28F221-80YN3
STMicroelectronics
Other Memory ICs;
SN74S262N
SN74S262N by Texas Instruments is a TTL memory circuit IC with 20 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring reliable memory functions. The through-hole terminal form and 2.54mm pitch enhance its ease of use in various electronic devices.
MT43A4G40200NFA-S15:A
Micron Technology's MT43A4G40200NFA-S15:A is a 4GX4 memory IC with 17179869184 bit density. Operating at 1.2V, it features synchronous mode and 896 terminals in a square GRID ARRAY package. Ideal for applications requiring high memory capacity and fast data processing in electronic devices.
TACT2154-25N
TACT2154-25N by Texas Instruments is a 2Kx8 memory circuit IC with 16384-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 25ns. This CMOS technology IC is ideal for applications requiring fast data access in commercial temperature environments.
MT38W2021A902ZQXZI.X69
Micron Technology's MT38W2021A902ZQXZI.X69 is a 4MX16 memory IC with 67108864 bit memory density. Operating in synchronous mode, it has 88 terminals in a grid array package style. Ideal for industrial applications, it supports a memory width of 16 bits and operates b/w -40 to 85 °C temperature range.
SNJ54HC670FK
SNJ54HC670FK by Texas Instruments is a CMOS memory IC with 20 terminals in a chip carrier package. Operating temperature ranges from -55 to 125°C, suitable for military-grade applications. It has power supplies of 2-6V and is surface mountable, making it ideal for various electronic devices.
S70KL1281DABHI020
Cypress Semiconductor
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
SN74HC670J
SN74HC670J by Texas Instruments is a CMOS memory IC with 16 terminals in an IN-LINE package. It operates b/w -40 to 85°C, suitable for industrial use. With power supplies of 2/6V, it is ideal for applications requiring reliable memory functions in harsh environments.
SMJ44C251-12MJD
DS1217A/192K-25
Analog Devices
DS1217A/192K-25 by Analog Devices is a 24Kx8 CMOS memory circuit with 196608-bit density. It operates asynchronously at 5V, with a max access time of 250ns. Ideal for applications requiring fast and reliable non-volatile memory storage in commercial temperature environments.
SN74LS600ADWR
SN74LS600ADWR by Texas Instruments is a 16KX1 MEMORY CIRCUIT IC with TTL technology. It operates in ASYNCHRONOUS mode at 5V, offering 16384-bit memory density. This small outline package is ideal for applications requiring high-speed memory access and low power consumption.
TC528257J-70
Toshiba
Toshiba TC528257J-70 is a 256Kx8 VIDEO DRAM IC with 2097152-bit memory density. Operating at 5V, it has a max access time of 70ns and consumes up to 160mA. Ideal for applications requiring high-speed video data processing in commercial temperature environments.
TMS27C32-20NL4
M36W108T100ZN5T
M36W108T100ZN5T by STMicroelectronics is a 1MX8 memory IC with 1048576 words and 8388608 bit memory density. Operating in asynchronous mode, it has a supply voltage range of 2.7V to 3.6V and temperature range of -20 °C to 85°C. This rectangular GRID ARRAY package is suitable for various applications requiring high-density memory solutions.
MR256A08BMA35
Everspin Technologies
MR256A08BMA35 by Everspin: 32KX8 memory IC with 262144 bit density, operates at 3.3V, has 35ns access time. Ideal for commercial applications requiring low profile, fine pitch grid array package style.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M24SR64-YDW6T/2
M24SR64-YDW6T/2 by STMicroelectronics is a memory IC with 8KX8 organization, 65536 bit memory density, and operates at 3.3V. It is used in industrial applications for data storage and communication due to its small outline package style and dual terminal position.
M24SR64-YMN6T/2
M24SR64-YMN6T/2 by STMicroelectronics is a MEMORY CIRCUIT IC with 65536 bit memory density. It operates at 3.3V, has 8KX8 organization, and supports synchronous mode. Ideal for industrial applications requiring small outline package style and dual terminal position.
M24SR64-YSB1217/2
MEMORY CIRCUIT;
M24SR04-GMC5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;
M24SR04-YMN5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
M24SR04-YMF6T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Organization: 512X8;
M24SR04-YDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
M24SR04-YMF7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Width: 2 mm; No. of Words Code: 512;
M24SR64-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; JESD-30 Code: R-PDSO-G8;
M24SR64-YDW7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V; Operating Mode: SYNCHRONOUS;
M24SR04-YMC7/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words: 4096 words; Technology: CMOS;
M24SR16-YMC7T/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm;
M24SR64-YDW8T/2
M24SR64-YDW8T/2 by STMicroelectronics is a 64KX1 memory circuit with 65536 bit memory density. It operates in synchronous mode, has a supply voltage range of 2.7V to 5.5V, and industrial temperature grade. This small outline IC with dual terminals is ideal for applications requiring secure data storage and retrieval in compact devices.
M24SR64-YSB12I6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Package Style (Meter): UNCASED CHIP;
M24SR04-GDW5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH;
M24SR04-YMC6/2
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
M24SR04-YMC5/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
M24SR04-YMN7T/2
MEMORY CIRCUIT; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Organization: 512X8;
M24SR04-GMF5T/2
MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
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